Структурная керамика для производства полупроводников: Материалы, применение и будущие тенденции
Modern semiconductor manufacturing requires unprecedented levels of precision, cleanliness, thermal stability, and reliability. As chip architectures continue to evolve toward smaller nodes, higher power density, and advanced packaging technologies, conventional metallic materials increasingly face limitations in process environments involving plasma exposure, ultra-high vacuum, aggressive chemicals, and extreme temperatures. Structural ceramics have therefore become indispensable materials […]




