The Alumina Ceramic Multi-Hole Plate is a high-precision engineered component designed for demanding industrial environments requiring excellent dimensional stability, electrical insulation, and long-term mechanical reliability.
Manufactured from 95–99.5% high-purity alumina (Al₂O₃), this ceramic plate integrates precision-machined micro-hole arrays and slot structures, enabling controlled gas flow, accurate alignment, and stable mechanical positioning in advanced equipment systems.
It is widely used in semiconductor processing, laser systems, microfluidics, high-temperature fixtures, and precision automation equipment.
Caractéristiques principales
High-Purity Alumina Material
Made from 95%, 96%, 99%, or 99.5% Al₂O₃ with excellent hardness, insulation, and chemical stability.
High-Precision Micro-Machining
Features laser-drilled or ultrasonically machined micro-holes (down to 0.1 mm) with tight positional accuracy.
Excellente stabilité thermique
Stable operation in environments up to 1600°C, suitable for high-temperature and thermal cycling conditions.
Outstanding Electrical Insulation
High dielectric strength and volume resistivity make it ideal for high-voltage and RF environments.
Résistance aux produits chimiques et au plasma
Resistant to acids, alkalis, solvents, and plasma exposure for long service life.
Fully Customizable Design
All structures can be customized including:
- Hole diameter & spacing
- Slot geometry & layout
- Thickness & dimensions
- Surface finish & coatings
Applications
- Semiconductor wafer processing fixtures
- Gas distribution and microflow control plates
- Laser and optical system alignment components
- Vacuum and plasma-compatible chambers
- High-voltage insulation and support structures
- Precision automation and calibration platforms
- Microfluidic and laboratory devices
Material Properties
- Material: Alumina Ceramic (Al₂O₃) 95–99.5%
- Color: Ivory / White
- Density: 3.80–3.95 g/cm³
- Hardness: ≥ 1200 HV
- Compressive Strength: ≥ 2000 MPa
- Flexural Strength: 300–400 MPa
- Dielectric Strength: ≥ 15 kV/mm
- Volume Resistivity: ≥ 10¹⁴ Ω·cm
- Max Working Temperature: 1100–1600°C
- Thermal Expansion: 7.2–8.0 × 10⁻⁶ /K
Precision & Tolerance
- Flatness: ≤ 0.02–0.05 mm
- Thickness tolerance: ±0.02 mm
- Hole position accuracy: ±0.03 mm
- Surface roughness: Ra 0.2–0.8 μm (optional polishing available)
- Micro-hole diameter: 0.1–0.6 mm
Capacités de production
We utilize advanced ceramic processing technologies including:
- Cold isostatic pressing (CIP) forming
- Frittage à haute température
- CNC precision machining
- Laser drilling & ultrasonic machining
- Surface grinding & polishing
- Optional metallization (Mo-Mn, W) and Ni/Au plating
Options de personnalisation
We support full OEM customization:
- Material grade selection (95% / 96% / 99% / 99.5%)
- Complex hole arrays and slot patterns
- Structural design optimization
- Tight-tolerance machining
- Surface polishing or lapping
- Conductive layer integration (metallization)
Advantages Over Conventional Materials
Compared with metals or plastics, alumina ceramic offers:
- Résistance accrue à la température
- Better dimensional stability
- Superior electrical insulation
- Durée de vie plus longue
- Resistance to corrosion and plasma environments
FAQ
Q1: Can this ceramic plate be used in high-temperature environments?
Yes, it can operate stably up to 1100–1600°C depending on material grade.
Q2: What is the smallest hole size you can produce?
Micro-holes as small as 0.1 mm can be achieved using laser or ultrasonic machining.
Q3: Can I customize the hole layout?
Yes, all patterns, spacing, and geometries can be fully customized based on drawings.
Q4: Do you support metallization or conductive coatings?
Yes, Mo-Mn, tungsten metallization, and Ni/Au plating are available.
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