Alumina Ceramic Multi-Hole Plate Custom Engineering Component for Semiconductor and Industrial Applications

The Alumina Ceramic Multi-Hole Plate is a high-precision engineered component designed for demanding industrial environments requiring excellent dimensional stability, electrical insulation, and long-term mechanical reliability.

Manufactured from 95–99.5% high-purity alumina (Al₂O₃), this ceramic plate integrates precision-machined micro-hole arrays and slot structures, enabling controlled gas flow, accurate alignment, and stable mechanical positioning in advanced equipment systems.

The Alumina Ceramic Multi-Hole Plate is a high-precision engineered component designed for demanding industrial environments requiring excellent dimensional stability, electrical insulation, and long-term mechanical reliability.

Manufactured from 95–99.5% high-purity alumina (Al₂O₃), this ceramic plate integrates precision-machined micro-hole arrays and slot structures, enabling controlled gas flow, accurate alignment, and stable mechanical positioning in advanced equipment systems.

It is widely used in semiconductor processing, laser systems, microfluidics, high-temperature fixtures, and precision automation equipment.


Caratteristiche principali

High-Purity Alumina Material

Made from 95%, 96%, 99%, or 99.5% Al₂O₃ with excellent hardness, insulation, and chemical stability.

High-Precision Micro-Machining

Features laser-drilled or ultrasonically machined micro-holes (down to 0.1 mm) with tight positional accuracy.

Eccellente stabilità termica

Stable operation in environments up to 1600°C, suitable for high-temperature and thermal cycling conditions.

Outstanding Electrical Insulation

High dielectric strength and volume resistivity make it ideal for high-voltage and RF environments.

Resistenza chimica e al plasma

Resistant to acids, alkalis, solvents, and plasma exposure for long service life.

Fully Customizable Design

All structures can be customized including:

  • Hole diameter & spacing
  • Slot geometry & layout
  • Thickness & dimensions
  • Surface finish & coatings

Applicazioni

  • Semiconductor wafer processing fixtures
  • Gas distribution and microflow control plates
  • Laser and optical system alignment components
  • Vacuum and plasma-compatible chambers
  • High-voltage insulation and support structures
  • Precision automation and calibration platforms
  • Microfluidic and laboratory devices

Material Properties

  • Material: Alumina Ceramic (Al₂O₃) 95–99.5%
  • Color: Ivory / White
  • Density: 3.80–3.95 g/cm³
  • Hardness: ≥ 1200 HV
  • Compressive Strength: ≥ 2000 MPa
  • Flexural Strength: 300–400 MPa
  • Dielectric Strength: ≥ 15 kV/mm
  • Volume Resistivity: ≥ 10¹⁴ Ω·cm
  • Max Working Temperature: 1100–1600°C
  • Thermal Expansion: 7.2–8.0 × 10⁻⁶ /K

Precision & Tolerance

  • Flatness: ≤ 0.02–0.05 mm
  • Thickness tolerance: ±0.02 mm
  • Hole position accuracy: ±0.03 mm
  • Surface roughness: Ra 0.2–0.8 μm (optional polishing available)
  • Micro-hole diameter: 0.1–0.6 mm

Capacità di produzione

We utilize advanced ceramic processing technologies including:

  • Cold isostatic pressing (CIP) forming
  • Sinterizzazione ad alta temperatura
  • CNC precision machining
  • Laser drilling & ultrasonic machining
  • Surface grinding & polishing
  • Optional metallization (Mo-Mn, W) and Ni/Au plating

Opzioni di personalizzazione

We support full OEM customization:

  • Material grade selection (95% / 96% / 99% / 99.5%)
  • Complex hole arrays and slot patterns
  • Structural design optimization
  • Tight-tolerance machining
  • Surface polishing or lapping
  • Conductive layer integration (metallization)

Advantages Over Conventional Materials

Compared with metals or plastics, alumina ceramic offers:

  • Resistenza alle alte temperature
  • Better dimensional stability
  • Superior electrical insulation
  • Vita utile più lunga
  • Resistance to corrosion and plasma environments

FAQ

Q1: Can this ceramic plate be used in high-temperature environments?
Yes, it can operate stably up to 1100–1600°C depending on material grade.

Q2: What is the smallest hole size you can produce?
Micro-holes as small as 0.1 mm can be achieved using laser or ultrasonic machining.

Q3: Can I customize the hole layout?
Yes, all patterns, spacing, and geometries can be fully customized based on drawings.

Q4: Do you support metallization or conductive coatings?
Yes, Mo-Mn, tungsten metallization, and Ni/Au plating are available.

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