Full CVD SiC Wafer Carrier Tray Plate for Semiconductor MOCVD & Etching Equipment

The SiC ceramic tray plate is a high-performance wafer carrier designed for advanced semiconductor processes such as MOCVD, epitaxy, and ICP etching. It is available in two structures:

  • Graphite substrate with CVD SiC coating
  • Monolithic high-purity CVD SiC tray (≥99.99%)

Compared with conventional graphite carriers, this product offers significantly improved thermal stability, corrosion resistance, and service life, making it ideal for demanding high-temperature semiconductor manufacturing environments.

It is widely used in GaN LED production, power semiconductor fabrication, and precision wafer processing systems.


Key Features & Advantages

1. Ultra-High Temperature Resistance

  • Stable operation at 1100–1200°C+
  • Suitable for harsh MOCVD and epitaxial growth environments
  • No deformation under long-term thermal cycling

2. Superior CVD SiC Coating Protection

  • Purity up to 99.999% SiC
  • Dense coating prevents gas penetration and substrate erosion
  • Eliminates graphite particle contamination in wafer processing

3. Excellent Corrosion & Chemical Resistance

  • Resistant to HF, H₂SO₄, HCl and reactive process gases
  • Ideal for aggressive semiconductor etching environments

4. High Thermal Conductivity & Uniform Heating

  • Ensures uniform temperature distribution across wafer surface
  • Improves film quality and process stability

5. Long Service Life

  • Up to 4× longer lifespan than traditional graphite-based trays
  • Reduced downtime and lower replacement frequency


Technical Specifications

Parameter Value
Material Type Graphite + CVD SiC coating / Full CVD SiC
SiC Purity ≥99.9% (coated), ≥99.99% (monolithic)
Diameter Range Φ380 mm – Φ600 mm
Operating Temperature 1100–1200°C
Thermal Conductivity High
Corrosion Resistance Excellent (HF, H₂SO₄ resistant)
Service Life ~4× graphite-based trays

Application Areas

Semiconductor Manufacturing

  • MOCVD (Metal Organic Chemical Vapor Deposition)
  • Epitaxial wafer growth (GaN, SiC, etc.)
  • ICP etching processes
  • High-precision wafer handling systems

LED Industry

  • High-brightness blue & white LED production
  • GaN-based optoelectronic devices

Advanced Electronics

  • Power semiconductors
  • High-frequency devices
  • Precision thin-film deposition systems

Performance Advantages vs Traditional Graphite Trays

Item Graphite Tray CVD SiC Coated Tray
Temperature Resistance Medium Very High
Corrosion Resistance Poor Excellent
Particle Contamination High risk Minimal
Service Life Short 3–4× longer
Surface Stability Degrades over time Highly stable

Packaging & Handling

  • Cleanroom-grade packaging available
  • Shock-resistant wooden crate or vacuum sealing
  • Designed for contamination-free semiconductor transport
  • Custom sizes supported (Φ380–Φ600 mm or tailored designs)

Why Choose This Product

This SiC wafer carrier tray is engineered for next-generation semiconductor manufacturing, where purity, thermal stability, and contamination control are critical. By replacing traditional graphite-based carriers, it significantly improves production yield, reduces maintenance costs, and ensures stable long-term process performance.


FAQ

Q1: What is the main advantage of CVD SiC coating compared to graphite trays?

CVD SiC coating provides a dense, ultra-pure protective layer that prevents gas penetration and graphite particle shedding, greatly improving durability and reducing wafer contamination.


Q2: Can this SiC tray be used in MOCVD high-temperature processes?

Yes. It is specifically designed for MOCVD applications and can operate reliably at 1100–1200°C with excellent thermal stability and uniform heat distribution.


Q3: What is the difference between coated graphite trays and full CVD SiC trays?

Coated graphite trays use a graphite core with a protective SiC layer, while full CVD SiC trays are monolithic structures with higher purity, better corrosion resistance, and longer service life.

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