Company News

Silicon Nitride Ceramic Bearings Reach 30,000 rpm: Why EV eAxles Are Becoming a Major Si₃N₄ Application

Electric-vehicle powertrains are changing the requirements placed on bearings. A conventional vehicle transmission is largely mechanical. An electric eAxle integrates: As manufacturers increase motor speed to reduce motor size and weight, bearing rotational speeds are rising sharply. In June 2026, JTEKT announced a grease-lubricated ceramic-ball bearing designed for high-performance EV eAxles with operation up to […]

Silicon Nitride Ceramic Bearings Reach 30,000 rpm: Why EV eAxles Are Becoming a Major Si₃N₄ Application قراءة المزيد »

Polished Alumina vs AlN Substrates for AI Server Power Modules: Thermal Performance, Flatness and Metallization

The rapid increase in AI computing density is changing the requirements placed on power conversion hardware. AI servers increasingly require compact, high-efficiency power supplies, DC/DC converters, power stages and advanced thermal-management systems. As power density rises, the ceramic substrate underneath power semiconductor devices becomes increasingly important. Two commonly considered materials are: Both provide electrical insulation,

Polished Alumina vs AlN Substrates for AI Server Power Modules: Thermal Performance, Flatness and Metallization قراءة المزيد »

300mm Wafer Boat Maintenance and Replacement Guide: Slot Wear, Particle Excursions, Cleaning Windows and End-of-Life Criteria

As semiconductor fabs move more high-volume thermal processes to 300mm wafers, wafer boat condition becomes increasingly important to process stability. A wafer boat may appear to be a simple furnace consumable, but it performs several critical functions at the same time: maintaining wafer spacing, supporting wafers during high-temperature processing, preserving loading accuracy, minimizing contact damage,

300mm Wafer Boat Maintenance and Replacement Guide: Slot Wear, Particle Excursions, Cleaning Windows and End-of-Life Criteria قراءة المزيد »

300mm (12-Inch) SiC Substrates: Crystal Growth, TTV, Bow, Warp, Defect Control and Challenges for Mass Production

Silicon carbide (SiC) substrates have become one of the most important materials for next-generation power electronics. As electric vehicles, renewable energy systems, industrial drives, rail traction, and AI data center power systems continue to demand higher efficiency and higher voltage operation, the need for larger-diameter SiC wafers is increasing rapidly. After the industry’s transition from

300mm (12-Inch) SiC Substrates: Crystal Growth, TTV, Bow, Warp, Defect Control and Challenges for Mass Production قراءة المزيد »

Why High-NA EUV Raises the Bar for SiC Ceramic Precision Structures: Thermal Drift, Stiffness, Vibration Control and Lightweight Design

High-NA extreme ultraviolet lithography is designed to print smaller semiconductor features with greater imaging contrast. By increasing numerical aperture from 0.33 in conventional EUV systems to 0.55, the technology can resolve substantially finer patterns using the same 13.5 nm EUV wavelength. The ASML TWINSCAN EXE:5000, the first High-NA EUV system, provides 8 nm resolution and

Why High-NA EUV Raises the Bar for SiC Ceramic Precision Structures: Thermal Drift, Stiffness, Vibration Control and Lightweight Design قراءة المزيد »

High-Power Ceramic Substrate Selection Guide: AlN, Si₃N₄ and Alumina for SiC Power Modules

Silicon carbide power devices can operate at higher voltages, switching frequencies and junction temperatures than conventional silicon devices. These advantages support smaller, lighter and more efficient power systems, but they also place greater thermal and mechanical demands on the package. The ceramic substrate is a critical part of this package. It electrically isolates the circuit

High-Power Ceramic Substrate Selection Guide: AlN, Si₃N₄ and Alumina for SiC Power Modules قراءة المزيد »

Ceramic Wafer End Effector Design: Material, Weight, Flatness and Particle Control

A ceramic wafer end effector—also called a wafer handling blade, robot blade or wafer transfer arm—is the part of a semiconductor robot that directly supports and transfers wafers between process chambers, load ports, aligners, inspection stations and wafer carriers. Although its geometry may appear simple, the end effector directly affects wafer positioning accuracy, transfer speed,

Ceramic Wafer End Effector Design: Material, Weight, Flatness and Particle Control قراءة المزيد »