The 310 × 310 mm alumina ceramic heat sink plate is a high-performance thermal management component made from high-purity aluminum oxide (Al₂O₃). It is designed for applications requiring efficient heat dissipation, electrical insulation, and long-term stability under high temperature and high voltage environments.
Compared with metal heat sinks, alumina ceramic offers superior electrical insulation, excellent corrosion resistance, and stable performance in harsh operating conditions.
This large-format ceramic plate is suitable for power electronics, LED modules, semiconductor equipment fixtures, and precision industrial systems.
Kluczowe cechy
- High thermal conductivity for efficient heat dissipation
- Excellent electrical insulation performance
- Wysoka wytrzymałość mechaniczna i odporność na zużycie
- Stable performance under high temperature environments
- Good chemical and corrosion resistance
- Precision ground surface available for high-flatness applications
Opcje materiałowe
- 95% Al₂O₃ (Standard industrial grade)
- 96% Al₂O₃ (Improved mechanical strength option)
- 99% Al₂O₃ (High purity, enhanced insulation & thermal stability)
Specyfikacja techniczna
| Pozycja | Specyfikacja |
|---|---|
| Materiał | Ceramika z tlenku glinu (Al₂O₃) |
| Rozmiar | 310 × 310 mm |
| Thickness | 0.5 – 10.0 mm (customizable) |
| Gęstość | 3,6 - 3,9 g/cm³ |
| Przewodność cieplna | 20 – 30 W/m·K |
| Wytrzymałość dielektryczna | ≥ 10 – 15 kV/mm |
| Volume Resistivity | ≥ 10¹⁴ Ω·cm |
| Wytrzymałość na zginanie | ≥ 300 – 350 MPa |
| Twardość | ≥ 80 HRA |
| Chropowatość powierzchni | Ra ≤ 0.4 – 0.8 μm (ground surface option) |
| Flatness | ≤ 0.05 – 0.10 mm (depending on thickness) |
| Kolor | Ivory / White |
Zastosowania
- LED high-power lighting modules
- Power semiconductor devices (IGBT, MOSFET cooling)
- RF and microwave equipment
- High-voltage insulation systems
- Industrial heat dissipation platforms
- Precision electronic assemblies
Opcje dostosowywania
- Size and thickness customization
- Surface polishing / lapping / metallization (Ag, Au, Ni plating support)
- Laser cutting and CNC machining
- Drilling and precision slotting
- High-flatness grade for optical/semiconductor use
FAQ (często zadawane pytania)
Q1: Is alumina ceramic better than aluminum for heat sink applications?
A: Alumina ceramic offers lower thermal conductivity than aluminum, but it provides superior electrical insulation, higher temperature resistance, and better corrosion stability. It is ideal for high-voltage and precision electronic environments where metal heat sinks may fail due to conductivity risks.
Q2: Can the 310 × 310 mm ceramic plate be customized into different shapes or hole patterns?
A: Yes. The alumina ceramic plate can be CNC machined, laser cut, drilled, or slotted according to design requirements. Custom geometries, mounting holes, and surface patterns are available for specific device integration needs.
Q3: Will the ceramic heat sink crack under high temperature or rapid temperature changes?
A: High-purity alumina ceramics have excellent thermal stability and can withstand high operating temperatures. However, like all ceramics, they are brittle under mechanical shock. Proper mounting design and controlled thermal cycling help ensure long-term reliability in practical applications.
Opinie
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