產業新聞

Ceramic Electrical Conductivity Guide: Al2O3, AlN, SiC and ESD-Safe Ceramics

Ceramics are often described as electrical insulators, but this description is incomplete. In semiconductor equipment, electronics manufacturing, vacuum systems, wafer handling, and precision automation, ceramic components may be required to perform very different electrical functions. Some components must provide extremely high electrical insulation. Others need controlled semiconductive behavior to prevent static charge accumulation. Certain silicon […]

Ceramic Electrical Conductivity Guide: Al2O3, AlN, SiC and ESD-Safe Ceramics 閱讀更多 »

SiC Wafer Boat Cleaning and Contamination Control: Particles, Metals and Service Life

Silicon carbide wafer boats are widely used in semiconductor thermal processing because of their high-temperature stability, mechanical strength, chemical resistance, and relatively low particle generation. They are commonly found in oxidation, diffusion, LPCVD, annealing, and other furnace processes where wafers must be securely supported at elevated temperatures. However, even a high-quality SiC wafer boat can

SiC Wafer Boat Cleaning and Contamination Control: Particles, Metals and Service Life 閱讀更多 »

Ceramic Component Incoming Inspection: Sampling Plan, Dimensional Report and Surface Defect Limits

Incoming inspection is an important control point when purchasing precision ceramic components for semiconductor equipment, electronics, automation, medical devices and other demanding industrial applications. A ceramic component may appear acceptable at first sight while still containing dimensional deviations, edge chips, hidden cracks, incorrect hole positions, excessive warpage or surface defects that affect installation and service

Ceramic Component Incoming Inspection: Sampling Plan, Dimensional Report and Surface Defect Limits 閱讀更多 »

Alumina Ceramic Multi-Hole Plate Design: Hole Diameter, Pitch, Flatness and Inspection

Alumina ceramic multi-hole plates are used in semiconductor equipment, gas distribution systems, vacuum fixtures, electrical insulation assemblies, filtration supports, furnace components and precision industrial machinery. Although the basic structure may appear simple, manufacturing hundreds or thousands of accurately positioned holes in a ceramic plate requires careful control of hole diameter, pitch, true position, plate thickness,

Alumina Ceramic Multi-Hole Plate Design: Hole Diameter, Pitch, Flatness and Inspection 閱讀更多 »

氧化鋯陶瓷零件公差指南：尺寸精度、表面粗糙度與檢驗

Zirconia ceramic parts are widely used in applications requiring high strength, fracture toughness, wear resistance, electrical insulation and a smooth working surface. Typical products include ceramic shafts, sleeves, bushings, plungers, valve components, positioning pins, guides, nozzles and semiconductor equipment parts. However, specifying a zirconia component cannot be handled in exactly the same way as specifying

氧化鋯陶瓷零件公差指南：尺寸精度、表面粗糙度與檢驗 閱讀更多 »

如何指定客製化晶圓舟：晶圓直徑、插槽間距、容量與公差

A custom wafer boat must do more than hold a group of wafers. It must maintain consistent wafer spacing, fit the processing equipment, withstand repeated thermal cycles and avoid introducing particles or metallic contamination. Small dimensional errors can create serious operating problems. Incorrect slot pitch may interfere with robotic loading, insufficient clearance can damage wafer

如何指定客製化晶圓舟：晶圓直徑、插槽間距、容量與公差 閱讀更多 »

用於半導體製造的結構陶瓷：元件與材料選型

Structural ceramics play a critical role in semiconductor manufacturing equipment because many process components must operate under conditions that are difficult for conventional metals and polymers. Depending on the process, equipment parts may be exposed to: Advanced ceramics are used in wafer handling, lithography, etching, deposition, thermal processing, cleaning, inspection, back grinding and other semiconductor

用於半導體製造的結構陶瓷：元件與材料選型 閱讀更多 »

Wafer Chucking Force: Vacuum Pressure, Contact Area and Wafer Flatness

Wafer chucking force is one of the most important design parameters in semiconductor wafer handling, inspection, lithography, grinding, coating and precision machining equipment. A vacuum chuck must hold the wafer securely against acceleration, vibration and process loads. At the same time, it must avoid excessive local stress, backside contamination, wafer deformation and imprinting of the

Wafer Chucking Force: Vacuum Pressure, Contact Area and Wafer Flatness 閱讀更多 »

Ceramic Wafer Support Pins: Material Selection, Flatness and Particle Control

Ceramic wafer support pins are small but critical components in semiconductor processing equipment. They support, lift, position or temporarily separate wafers during transfer between a robot arm, process chamber, electrostatic chuck, vacuum chuck or wafer stage. Although their geometry is relatively simple, wafer support pins directly contact or approach sensitive wafer surfaces. Variations in pin

Ceramic Wafer Support Pins: Material Selection, Flatness and Particle Control 閱讀更多 »

陶瓷真空吸盤設計：氣孔率、平整度與晶圓夾持性能

Vacuum chucks are essential components in modern semiconductor manufacturing. They securely hold silicon, silicon carbide (SiC), sapphire, glass, and compound semiconductor wafers during lithography, inspection, grinding, polishing, laser processing, metrology, and wafer bonding. Among various chuck technologies, porous ceramic vacuum chuck have become the preferred solution because they provide uniform vacuum distribution, excellent dimensional stability,

陶瓷真空吸盤設計：氣孔率、平整度與晶圓夾持性能 閱讀更多 »

Ceramic Substrates: The Thermal Management Backbone of Advanced Electronic Devices

As emerging technologies such as electric vehicles (EVs), 5G communications, renewable energy systems, artificial intelligence (AI), aerospace electronics, and power semiconductors continue to evolve, electronic devices are becoming increasingly powerful, compact, and highly integrated. While these advancements improve performance, they also generate significantly higher heat densities, creating critical challenges for thermal management and device reliability.

Ceramic Substrates: The Thermal Management Backbone of Advanced Electronic Devices 閱讀更多 »

6 種主要陶瓷基板材料詳解：全面指南

With the rapid development of electric vehicles, power electronics, aerospace systems, satellite communications, and high-frequency semiconductor devices, electronic components are increasingly required to operate under high power, high temperature, and high frequency conditions. In such demanding environments, traditional organic or metal-based substrates often fail to provide sufficient thermal and electrical stability. As a result, advanced

6 種主要陶瓷基板材料詳解：全面指南 閱讀更多 »