The Silicon Carbide (SiC) Wafer Boat is a high-performance wafer carrier designed for advanced semiconductor and photovoltaic manufacturing processes. It is engineered to withstand extreme thermal environments and aggressive chemical atmospheres commonly found in diffusion, oxidation, and LPCVD processes.
Compared with traditional quartz wafer boats, SiC wafer boats provide significantly improved thermal stability, chemical resistance, mechanical strength, and service life, making them an ideal solution for next-generation high-temperature wafer processing equipment.
Główne zalety
Excellent High-Temperature Stability
Stable operation at temperatures up to 1650°C, with no deformation, cracking, or structural degradation.
Superior Chemical Resistance
Highly resistant to corrosive gases such as HCl, Cl₂, NH₃, ensuring minimal contamination in process chambers.
Wysoka wytrzymałość mechaniczna
Low thermal expansion coefficient and strong structural integrity under repeated thermal cycling.
Ultra-Low Particle Generation
Mirror-polished surface (Ra < 5 nm) significantly reduces particle shedding and improves wafer yield.
Extended Service Life
Lasts 2–5 times longer than quartz wafer boats, reducing maintenance frequency and overall cost of ownership.
Custom Engineering Design
Available in multiple configurations including:
- Flat type
- V-shaped type
- Multi-tier / stacked design
- Custom slot spacing and geometry
Material & Manufacturing Process
High-Purity Raw Material Selection
- SiC purity: >99.9%
- Strict control of particle size distribution for uniform density
Forming Process
- Cold Isostatic Pressing (CIP)
- Precision molding or additive forming
- Ensures crack-free green body structure
High-Temperature Sintering
- Sintered above 2000°C in inert/vacuum atmosphere
- Forms dense and stable SiC structure
CVD/CVI Reinforcement
- Enhances surface density and purity
- Reduces particle release during wafer processing
Precision CNC Machining
- Dimensional tolerance: ±0.01 mm
- Suitable for complex wafer loading structures
Mirror Surface Polishing
- Chemical Mechanical Polishing (CMP)
- Achieves surface roughness: Ra < 5 nm
Final Inspection
- Density testing
- Thermal shock resistance testing
- Particle contamination analysis
- Cleanroom packaging
Obszary zastosowań
- Semiconductor wafer diffusion processes
- LPCVD / oxidation furnace systems
- SiC and GaN epitaxy manufacturing
- Photovoltaic solar cell thermal processing
- High-temperature laboratory research
Typical Specifications (Custom Available)
| Parametr | Wartość |
|---|---|
| Rozmiar wafla | 6” / 8” / 12” |
| Materiał | SiC (Silicon Carbide) |
| Czystość | >99.9% |
| Maksymalna temperatura pracy | ≤1650°C |
| Chropowatość powierzchni | Ra < 5 nm |
| Żywotność | 2–5× quartz wafer boat |
Why Choose SiC Wafer Boats?
SiC wafer boats are becoming the preferred choice in advanced semiconductor manufacturing due to their ability to maintain structural stability under extreme conditions while minimizing contamination risk. They significantly improve process reliability and wafer yield, especially in high-temperature and corrosive environments.
FAQ
1. How is SiC better than quartz in wafer boats?
SiC offers higher temperature resistance, stronger chemical stability, and longer lifespan, making it more suitable for advanced semiconductor processes.
2. Can you provide customized designs?
Yes, we support full customization based on wafer size, furnace type, and process requirements.
3. What is the surface quality standard?
The surface is mirror-polished to Ra < 5 nm, ensuring ultra-low particle contamination.
4. What is the typical lifespan?
Generally 2–5 times longer than quartz wafer boats, depending on process conditions.
Opinie
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