{"id":2144,"date":"2026-05-13T02:09:42","date_gmt":"2026-05-13T02:09:42","guid":{"rendered":"https:\/\/www.xkh-ceramics.com\/?p=2144"},"modified":"2026-05-13T02:09:42","modified_gmt":"2026-05-13T02:09:42","slug":"precision-ceramic-components-for-semiconductor-equipment-comprehensive-overview-of-advanced-ceramic-applications","status":"publish","type":"post","link":"https:\/\/www.xkh-ceramics.com\/tr\/precision-ceramic-components-for-semiconductor-equipment-comprehensive-overview-of-advanced-ceramic-applications\/","title":{"rendered":"Precision Ceramic Components for Semiconductor Equipment: Comprehensive Overview of Advanced Ceramic Applications"},"content":{"rendered":"<p>As semiconductor manufacturing advances toward smaller process nodes, higher integration density, and ultra-clean production environments, precision ceramic components have become indispensable throughout semiconductor fabrication equipment.<\/p>\n\n\n\n<p><a href=\"https:\/\/www.xkh-ceramics.com\/tr\/products\/\">Advanced ceramics<\/a> are widely used in lithography, etching, thin-film deposition, ion implantation, CMP, packaging, and wafer handling systems. These ceramic components serve critical functions including wafer support, plasma resistance, insulation, gas distribution, thermal management, contamination control, and precision motion guidance.<\/p>\n\n\n\n<p>Due to their exceptional hardness, thermal stability, corrosion resistance, low particle generation, and electrical properties, precision ceramics have become key enabling materials for next-generation semiconductor manufacturing.<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"554\" height=\"338\" src=\"https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Precision-Ceramic-Components-for-Semiconductor-Equipment.png\" alt=\"\" class=\"wp-image-2145\" srcset=\"https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Precision-Ceramic-Components-for-Semiconductor-Equipment.png 554w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Precision-Ceramic-Components-for-Semiconductor-Equipment-300x183.png 300w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Precision-Ceramic-Components-for-Semiconductor-Equipment-18x12.png 18w\" sizes=\"(max-width: 554px) 100vw, 554px\" \/><\/figure>\n\n\n\n<h1 class=\"wp-block-heading\">Why Precision Ceramics Matter in Semiconductor Equipment<\/h1>\n\n\n\n<p>Modern semiconductor equipment operates under extremely demanding conditions:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>High vacuum environments<\/li>\n\n\n\n<li>Plasma exposure<\/li>\n\n\n\n<li>Corrosive process gases<\/li>\n\n\n\n<li>Ultra-high cleanliness requirements<\/li>\n\n\n\n<li>Rapid thermal cycling<\/li>\n\n\n\n<li>Nanometer-level precision motion<\/li>\n<\/ul>\n\n\n\n<p>Traditional metallic materials often struggle under these conditions due to contamination risks, thermal deformation, or chemical instability.<\/p>\n\n\n\n<p>Advanced ceramic materials provide critical advantages:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>High purity and low contamination<\/li>\n\n\n\n<li>Excellent wear resistance<\/li>\n\n\n\n<li>Outstanding plasma resistance<\/li>\n\n\n\n<li>Low thermal expansion<\/li>\n\n\n\n<li>High rigidity and dimensional stability<\/li>\n\n\n\n<li>Excellent dielectric properties<\/li>\n\n\n\n<li>Superior heat resistance<\/li>\n\n\n\n<li>Low particle generation<\/li>\n<\/ul>\n\n\n\n<p>As a result, precision ceramic components are extensively used inside semiconductor process chambers and wafer handling systems.<\/p>\n\n\n\n<h1 class=\"wp-block-heading\">Precision Ceramics in Front-End Semiconductor Manufacturing Equipment<\/h1>\n\n\n\n<h2 class=\"wp-block-heading\">1. Lithography Systems<\/h2>\n\n\n\n<p>High-end lithography machines require ultra-precise motion systems and structurally stable materials to achieve nanometer-scale patterning accuracy.<\/p>\n\n\n\n<p>Typical ceramic components include:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Electrostatic chucks (ESC)<\/li>\n\n\n\n<li>Vacuum chucks<\/li>\n\n\n\n<li>Motion stages<\/li>\n\n\n\n<li>Guide rails<\/li>\n\n\n\n<li>Worktables<\/li>\n\n\n\n<li>Mask stages<\/li>\n\n\n\n<li>Cooling plates<\/li>\n\n\n\n<li>Structural blocks<\/li>\n\n\n\n<li>Mirror support structures<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Electrostatic Chuck (ESC)<\/h2>\n\n\n\n<p>Electrostatic chucks are among the most critical ceramic components in semiconductor manufacturing. They are used to securely hold and transfer wafers during plasma and vacuum-based processes such as:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Plasma etching<\/li>\n\n\n\n<li>Chemical vapor deposition (CVD)<\/li>\n\n\n\n<li>Ion implantation<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Common Ceramic Materials<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Alumina (Al\u2082O\u2083)<\/li>\n\n\n\n<li>Silicon Nitride (Si\u2083N\u2084)<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Manufacturing Challenges<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Complex internal structures<\/li>\n\n\n\n<li>High-purity raw material preparation<\/li>\n\n\n\n<li>Precision sintering control<\/li>\n\n\n\n<li>Ultra-flat surface machining<\/li>\n\n\n\n<li>Embedded electrode integration<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Precision Motion Stages<\/h2>\n\n\n\n<p>Lithography stages must achieve extremely high speed and positioning accuracy while minimizing deformation during rapid acceleration.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Material Requirements<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>High specific stiffness<\/li>\n\n\n\n<li>Low density<\/li>\n\n\n\n<li>Low thermal expansion<\/li>\n\n\n\n<li>Excellent dimensional stability<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Common Ceramic Materials<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Cordierite ceramics<\/li>\n\n\n\n<li>Silicon carbide (SiC)<\/li>\n<\/ul>\n\n\n\n<p>Silicon carbide is especially attractive due to its lightweight structure, high rigidity, and excellent thermal stability.<\/p>\n\n\n\n<h1 class=\"wp-block-heading\">2. Etching Equipment<\/h1>\n\n\n\n<p>Etching systems transfer circuit patterns from masks onto wafers and operate under highly corrosive plasma environments.<\/p>\n\n\n\n<p>Ceramic components commonly used include:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Process chambers<\/li>\n\n\n\n<li>Viewports<\/li>\n\n\n\n<li>Gas distribution plates<\/li>\n\n\n\n<li>Nozzles<\/li>\n\n\n\n<li>Focus rings<\/li>\n\n\n\n<li>Insulating rings<\/li>\n\n\n\n<li>Chamber covers<\/li>\n\n\n\n<li>Electrostatic chucks<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Etching Chamber Components<\/h2>\n\n\n\n<p>As device geometries continue shrinking, contamination control becomes increasingly critical. Ceramic materials have gradually replaced metals in many chamber applications.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Key Material Requirements<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Ultra-high purity<\/li>\n\n\n\n<li>Low metallic contamination<\/li>\n\n\n\n<li>Excellent plasma resistance<\/li>\n\n\n\n<li>High density and low porosity<\/li>\n\n\n\n<li>Fine grain structure<\/li>\n\n\n\n<li>Stable dielectric properties<\/li>\n\n\n\n<li>Good machinability<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Common Ceramic Materials<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Quartz (SiO\u2082)<\/li>\n\n\n\n<li>Silicon carbide (SiC)<\/li>\n\n\n\n<li>Aluminum nitride (AlN)<\/li>\n\n\n\n<li>Alumina (Al\u2082O\u2083)<\/li>\n\n\n\n<li>Silicon nitride (Si\u2083N\u2084)<\/li>\n\n\n\n<li>Yttria (Y\u2082O\u2083)<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Gas Distribution Plates (Shower Heads)<\/h2>\n\n\n\n<p>Gas distribution plates contain hundreds or thousands of precision micro-holes designed to evenly distribute process gases across wafer surfaces.<\/p>\n\n\n\n<p>Uniform gas flow directly impacts:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Film thickness uniformity<\/li>\n\n\n\n<li>Etching consistency<\/li>\n\n\n\n<li>Yield rate<\/li>\n\n\n\n<li>Process stability<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Technical Challenges<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Micro-hole dimensional consistency<\/li>\n\n\n\n<li>Burr-free internal surfaces<\/li>\n\n\n\n<li>Ultra-clean machining<\/li>\n\n\n\n<li>Corrosion resistance<\/li>\n\n\n\n<li>High flatness<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Common Ceramic Materials<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>CVD Silicon Carbide (CVD-SiC)<\/li>\n\n\n\n<li>Alumina ceramics<\/li>\n\n\n\n<li>Silicon nitride ceramics<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Focus Rings<\/h2>\n\n\n\n<p>Focus rings help maintain uniform plasma distribution around wafers during plasma etching processes.<\/p>\n\n\n\n<p>Traditional conductive silicon rings suffer from rapid fluorine plasma erosion, resulting in short operational lifetimes.<\/p>\n\n\n\n<p>Silicon carbide offers:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Similar electrical conductivity to silicon<\/li>\n\n\n\n<li>Superior plasma resistance<\/li>\n\n\n\n<li>Longer service life<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Common Material<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Silicon carbide (SiC)<\/li>\n<\/ul>\n\n\n\n<h1 class=\"wp-block-heading\">3. Thin-Film Deposition Equipment<\/h1>\n\n\n\n<p>Both PVD and CVD systems extensively utilize precision ceramic components due to their thermal and plasma stability.<\/p>\n\n\n\n<p>Typical components include:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Electrostatic chucks<\/li>\n\n\n\n<li>Ceramic heaters<\/li>\n\n\n\n<li>Gas distribution plates<\/li>\n\n\n\n<li>Chamber liners<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Ceramic Heaters<\/h2>\n\n\n\n<p>Ceramic heaters directly contact wafers and provide stable, uniform process temperatures during deposition.<\/p>\n\n\n\n<p>These components are essential for:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Temperature uniformity<\/li>\n\n\n\n<li>Thin-film quality<\/li>\n\n\n\n<li>Process repeatability<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Common Ceramic Materials<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Aluminum nitride (AlN)<\/li>\n\n\n\n<li>Alumina (Al\u2082O\u2083)<\/li>\n<\/ul>\n\n\n\n<p>Aluminum nitride is especially favored because of its high thermal conductivity and electrical insulation properties.<\/p>\n\n\n\n<h1 class=\"wp-block-heading\">Precision Ceramics in Back-End Semiconductor Processes<\/h1>\n\n\n\n<h2 class=\"wp-block-heading\">1. CMP (Chemical Mechanical Polishing) Equipment<\/h2>\n\n\n\n<p>CMP systems use ceramic materials in:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Polishing plates<\/li>\n\n\n\n<li>Wafer carriers<\/li>\n\n\n\n<li>Vacuum chucks<\/li>\n\n\n\n<li>Calibration platforms<\/li>\n\n\n\n<li>Robotic transfer arms<\/li>\n<\/ul>\n\n\n\n<p>Ceramic materials provide excellent dimensional stability and wear resistance during prolonged polishing operations.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">2. Wafer Dicing and Packaging Equipment<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">Key Ceramic Components<\/h3>\n\n\n\n<h4 class=\"wp-block-heading\">Diamond-Ceramic Composite Dicing Blades<\/h4>\n\n\n\n<ul class=\"wp-block-list\">\n<li>High cutting speed<\/li>\n\n\n\n<li>Minimal wafer chipping<\/li>\n\n\n\n<li>Superior wear resistance<\/li>\n<\/ul>\n\n\n\n<h4 class=\"wp-block-heading\">Ceramic Bonding Heads<\/h4>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Aluminum nitride ceramics<\/li>\n\n\n\n<li>High thermal conductivity<\/li>\n\n\n\n<li>Precise temperature uniformity<\/li>\n<\/ul>\n\n\n\n<h4 class=\"wp-block-heading\">Ceramic Packaging Substrates<\/h4>\n\n\n\n<ul class=\"wp-block-list\">\n<li>LTCC (Low Temperature Co-fired Ceramics)<\/li>\n\n\n\n<li>Fine wiring capability<\/li>\n\n\n\n<li>High-frequency signal support<\/li>\n<\/ul>\n\n\n\n<h4 class=\"wp-block-heading\">Ceramic Capillary Tools<\/h4>\n\n\n\n<p>Used in wire bonding processes.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Common Materials<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Alumina ceramics<\/li>\n\n\n\n<li>Zirconia toughened alumina (ZTA)<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">3. Semiconductor Probe Stations and Test Equipment<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">Key Components<\/h3>\n\n\n\n<h4 class=\"wp-block-heading\">Ceramic Interposer Substrates<\/h4>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Beryllium oxide (BeO)<\/li>\n\n\n\n<li>Aluminum nitride (AlN)<\/li>\n<\/ul>\n\n\n\n<h4 class=\"wp-block-heading\">High-Frequency Test Fixtures<\/h4>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Aluminum nitride ceramics<\/li>\n<\/ul>\n\n\n\n<p>These materials support high-frequency signal transmission while maintaining thermal stability.<\/p>\n\n\n\n<h1 class=\"wp-block-heading\">Ceramic Components in Wafer Handling and Clean Environments<\/h1>\n\n\n\n<h2 class=\"wp-block-heading\">1. Wafer Transfer Robots<\/h2>\n\n\n\n<p>Semiconductor robotic systems require:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>High precision<\/li>\n\n\n\n<li>Low particle generation<\/li>\n\n\n\n<li>Long operational lifetime<\/li>\n\n\n\n<li>Vacuum compatibility<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Key Ceramic Components<\/h3>\n\n\n\n<h4 class=\"wp-block-heading\">Robotic Arms<\/h4>\n\n\n\n<h3 class=\"wp-block-heading\">Common Materials<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Alumina ceramics<\/li>\n\n\n\n<li>Silicon carbide ceramics<\/li>\n<\/ul>\n\n\n\n<h4 class=\"wp-block-heading\">Joint Bearings<\/h4>\n\n\n\n<h3 class=\"wp-block-heading\">Common Materials<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Zirconia ceramic balls<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Advantages<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Extremely low friction coefficient<\/li>\n\n\n\n<li>Long service life<\/li>\n\n\n\n<li>Excellent wear resistance<\/li>\n<\/ul>\n\n\n\n<h4 class=\"wp-block-heading\">End Effectors \/ Wafer Fingers<\/h4>\n\n\n\n<h3 class=\"wp-block-heading\">Common Material<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Silicon carbide ceramics<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Performance Advantages<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>High-temperature resistance<\/li>\n\n\n\n<li>Ultra-low particle release<\/li>\n\n\n\n<li>Excellent dimensional stability<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">2. Ultra-Pure Water and Gas Delivery Systems<\/h2>\n\n\n\n<p>Ceramic materials are also critical in chemical delivery systems.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Typical Components<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Valve sealing parts<\/li>\n\n\n\n<li>Pipe liners<\/li>\n\n\n\n<li>Corrosion-resistant flow components<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Common Materials<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Silicon nitride ceramics<\/li>\n\n\n\n<li>High-density alumina ceramics<\/li>\n<\/ul>\n\n\n\n<p>These materials offer excellent resistance to corrosive chemicals such as hydrofluoric acid.<\/p>\n\n\n\n<h1 class=\"wp-block-heading\">Key Advanced Ceramic Materials Used in Semiconductor Equipment<\/h1>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Ceramic Material<\/th><th>Main Advantages<\/th><th>Typical Applications<\/th><\/tr><\/thead><tbody><tr><td>Alumina (Al\u2082O\u2083)<\/td><td>Insulation, wear resistance<\/td><td>ESCs, insulators, robot arms<\/td><\/tr><tr><td>Aluminum Nitride (AlN)<\/td><td>High thermal conductivity<\/td><td>Ceramic heaters, substrates<\/td><\/tr><tr><td>Silicon Carbide (SiC)<\/td><td>Plasma resistance, rigidity<\/td><td>Focus rings, stages, wafer fingers<\/td><\/tr><tr><td>Silicon Nitride (Si\u2083N\u2084)<\/td><td>Strength, thermal shock resistance<\/td><td>Structural parts, seals<\/td><\/tr><tr><td>Zirconia (ZrO\u2082)<\/td><td>High toughness<\/td><td>Bearings, wear components<\/td><\/tr><tr><td>Quartz (SiO\u2082)<\/td><td>High purity<\/td><td>Chambers, furnace tubes<\/td><\/tr><tr><td>Yttria (Y\u2082O\u2083)<\/td><td>Plasma corrosion resistance<\/td><td>Chamber coatings<\/td><\/tr><tr><td>Boron Nitride (BN)<\/td><td>Thermal stability, lubrication<\/td><td>Insulators, thermal components<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h1 class=\"wp-block-heading\">Future Trends in Semiconductor Ceramic Components<\/h1>\n\n\n\n<p>As semiconductor manufacturing continues evolving toward:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Advanced process nodes<\/li>\n\n\n\n<li>AI chips<\/li>\n\n\n\n<li>3D packaging<\/li>\n\n\n\n<li>Wide-bandgap semiconductors<\/li>\n\n\n\n<li>High-power devices<\/li>\n<\/ul>\n\n\n\n<p>precision ceramic components will require:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Higher purity<\/li>\n\n\n\n<li>Better plasma resistance<\/li>\n\n\n\n<li>Larger dimensions<\/li>\n\n\n\n<li>Lower defect density<\/li>\n\n\n\n<li>More complex geometries<\/li>\n\n\n\n<li>Ultra-precision machining<\/li>\n\n\n\n<li>Advanced surface engineering<\/li>\n<\/ul>\n\n\n\n<p>Advanced ceramics are rapidly becoming one of the foundational technologies supporting future semiconductor equipment innovation.<\/p>\n\n\n\n<h1 class=\"wp-block-heading\">Conclusion<\/h1>\n\n\n\n<p>Precision ceramic components are essential throughout semiconductor manufacturing equipment, from lithography and plasma etching systems to wafer handling robots and packaging equipment.<\/p>\n\n\n\n<p>Their unique combination of:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>High purity<\/li>\n\n\n\n<li>Thermal stability<\/li>\n\n\n\n<li>Plasma resistance<\/li>\n\n\n\n<li>Mechanical strength<\/li>\n\n\n\n<li>Electrical insulation<\/li>\n\n\n\n<li>Low contamination<\/li>\n<\/ul>\n\n\n\n<p>makes advanced ceramics indispensable for achieving the precision, reliability, and cleanliness required in modern semiconductor production.<\/p>\n\n\n\n<p>As semiconductor technology advances, the importance of high-performance ceramic materials and ultra-precision ceramic manufacturing will continue to grow.<\/p>","protected":false},"excerpt":{"rendered":"<p>As semiconductor manufacturing advances toward smaller process nodes, higher integration density, and ultra-clean production environments, precision ceramic components have become indispensable throughout semiconductor fabrication equipment. Advanced ceramics are widely used [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":2145,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[3],"tags":[46,258,251,263,90,81,264],"class_list":["post-2144","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-advanced-ceramics","tag-precision-ceramics","tag-semiconductor-ceramics","tag-semiconductor-components","tag-semiconductor-equipment","tag-semiconductor-manufacturing","tag-semiconductor-process-equipment"],"_links":{"self":[{"href":"https:\/\/www.xkh-ceramics.com\/tr\/wp-json\/wp\/v2\/posts\/2144","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.xkh-ceramics.com\/tr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.xkh-ceramics.com\/tr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/tr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/tr\/wp-json\/wp\/v2\/comments?post=2144"}],"version-history":[{"count":1,"href":"https:\/\/www.xkh-ceramics.com\/tr\/wp-json\/wp\/v2\/posts\/2144\/revisions"}],"predecessor-version":[{"id":2146,"href":"https:\/\/www.xkh-ceramics.com\/tr\/wp-json\/wp\/v2\/posts\/2144\/revisions\/2146"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/tr\/wp-json\/wp\/v2\/media\/2145"}],"wp:attachment":[{"href":"https:\/\/www.xkh-ceramics.com\/tr\/wp-json\/wp\/v2\/media?parent=2144"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/tr\/wp-json\/wp\/v2\/categories?post=2144"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/tr\/wp-json\/wp\/v2\/tags?post=2144"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}