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<\/figure>\n\n\n\nWhat Is Wafer Boat Slot Geometry?<\/h2>\n\n\n\n
Wafer boat slot geometry describes the cross-sectional shape and dimensional characteristics of the grooves that locate and support each wafer.<\/p>\n\n\n\n
Important slot parameters include:<\/p>\n\n\n\n
- \n
- Groove shape<\/li>\n\n\n\n
- Slot opening width<\/li>\n\n\n\n
- Slot bottom width<\/li>\n\n\n\n
- Groove depth<\/li>\n\n\n\n
- Sidewall angle<\/li>\n\n\n\n
- Bottom radius<\/li>\n\n\n\n
- Entry chamfer<\/li>\n\n\n\n
- Contact position<\/li>\n\n\n\n
- Contact length<\/li>\n\n\n\n
- \uc2ac\ub86f \ud53c\uce58<\/li>\n\n\n\n
- Alignment between supporting rods<\/li>\n\n\n\n
- Clearance for wafer thickness and bow<\/li>\n<\/ul>\n\n\n\n
Although wafer boat grooves are often described as either V-shaped or U-shaped, many practical designs use modified or hybrid profiles. A groove may have angled entry walls, a rounded bottom, an asymmetric support surface or a relieved non-contact area.<\/p>\n\n\n\n
Historical wafer-boat designs also show combinations of V-shaped supporting notches and U-shaped guiding notches, as well as angled walls and radiused bottoms intended to control how the wafer enters and rests in the slot.<\/p>\n\n\n\n
The most suitable geometry depends on the wafer diameter, wafer thickness, boat orientation, loading method, processing temperature and allowable edge contact.<\/p>\n\n\n\n
V-Groove Wafer Boat Slots<\/h2>\n\n\n\n
A V-groove uses two inclined surfaces that converge toward the bottom of the slot. Depending on the design, the wafer may contact both inclined surfaces or rest mainly against one supporting surface.<\/p>\n\n\n\n
Advantages of V-Groove Slots<\/h3>\n\n\n\n
1. Self-centering capability<\/h4>\n\n\n\n
The inclined surfaces can help guide the wafer toward a repeatable position. This can be useful when the wafer must remain consistently aligned across multiple supporting rods.<\/p>\n\n\n\n
2. Relatively small contact region<\/h4>\n\n\n\n
A properly designed V-groove can limit contact to a narrow area near the wafer edge. Reduced contact may help lower the risk of large contact marks and reduce the area where contamination can accumulate.<\/p>\n\n\n\n
3. Positive wafer positioning<\/h4>\n\n\n\n
The angled walls can restrict excessive lateral movement, helping the wafer remain stable during handling and loading.<\/p>\n\n\n\n
4. Suitability for different wafer thicknesses<\/h4>\n\n\n\n
A V-shaped profile may accommodate small thickness variations because the wafer edge can rest at a slightly different height within the angled groove.<\/p>\n\n\n\n
Potential Limitations of V-Grooves<\/h3>\n\n\n\n
The same concentrated contact that provides accurate positioning can create local stress if the groove is too sharp or poorly matched to the wafer edge.<\/p>\n\n\n\n
Possible problems include:<\/p>\n\n\n\n
- \n
- Edge chipping<\/li>\n\n\n\n
- Local pressure marks<\/li>\n\n\n\n
- Excessive clamping<\/li>\n\n\n\n
- Difficulty inserting bowed wafers<\/li>\n\n\n\n
- Increased friction during thermal movement<\/li>\n\n\n\n
- Contact with an excessively sharp groove bottom<\/li>\n<\/ul>\n\n\n\n
A nominally V-shaped groove should therefore not automatically be manufactured with a perfectly sharp internal corner. A controlled root radius, relieved bottom or modified contact surface may be needed to prevent the wafer edge from bearing against a fragile apex.<\/p>\n\n\n\n
Wafer-boat designs have used inclined and curved slot surfaces to support wafer movement and avoid unnecessary contact between the wafer\u2019s outer region and non-supporting surfaces.<\/p>\n\n\n\n
U-Groove Wafer Boat Slots<\/h2>\n\n\n\n
A U-groove generally has more vertical sidewalls and a wider or rounded bottom. The actual profile may resemble a rectangular channel with corner radii rather than a perfect semicircle.<\/p>\n\n\n\n
Advantages of U-Groove Slots<\/h3>\n\n\n\n
1. Larger supporting area<\/h4>\n\n\n\n
A U-shaped or radiused bottom can distribute the load over a broader region than a sharp V-groove. This may reduce concentrated pressure at a single point.<\/p>\n\n\n\n
2. Easier wafer insertion<\/h4>\n\n\n\n
A wider opening can provide more clearance during manual or automated loading. This is useful when the wafer has measurable bow, thickness variation or positional variation.<\/p>\n\n\n\n
3. Improved tolerance to wafer movement<\/h4>\n\n\n\n
Additional clearance may allow the wafer to move slightly as the wafer and boat respond to temperature changes.<\/p>\n\n\n\n
4. Lower sensitivity to small dimensional variations<\/h4>\n\n\n\n
A U-groove can be more forgiving when processing wafers with a wider thickness range, provided the available clearance does not compromise stability.<\/p>\n\n\n\n
Potential Limitations of U-Grooves<\/h3>\n\n\n\n
A U-groove does not automatically provide better edge protection. If the bottom is too wide or the sidewalls are too loose, the wafer may tilt, rattle or move laterally.<\/p>\n\n\n\n
Potential issues include:<\/p>\n\n\n\n
- \n
- Inconsistent wafer position<\/li>\n\n\n\n
- Increased contact area<\/li>\n\n\n\n
- Particle trapping at the groove bottom<\/li>\n\n\n\n
- Wafer-to-slot impact during transport<\/li>\n\n\n\n
- Reduced alignment repeatability<\/li>\n\n\n\n
- More difficult control of contact location<\/li>\n<\/ul>\n\n\n\n
The groove should not be designed simply by adding a large radius. Its sidewall clearance, bottom radius and support height must be matched to the wafer edge geometry.<\/p>\n\n\n\n
V-Groove vs U-Groove Comparison<\/h2>\n\n\n\n
Design factor<\/th> V-groove<\/th> U-groove<\/th><\/tr> Wafer centering<\/td> Generally better<\/td> Depends more on sidewall clearance<\/td><\/tr> Contact area<\/td> Usually smaller<\/td> Usually larger<\/td><\/tr> Local contact stress<\/td> Can be higher<\/td> Can be more distributed<\/td><\/tr> Loading clearance<\/td> More sensitive to alignment<\/td> Often more forgiving<\/td><\/tr> Lateral movement<\/td> More restricted<\/td> May allow more movement<\/td><\/tr> Particle trapping<\/td> Lower with an open profile<\/td> Possible at a broad bottom<\/td><\/tr> Thickness tolerance<\/td> Can accommodate variation through contact height<\/td> Accommodated through wider clearance<\/td><\/tr> Edge protection<\/td> Good when properly radiused<\/td> Good when support radius is properly matched<\/td><\/tr> Manufacturing sensitivity<\/td> Sidewall angle and apex control are critical<\/td> Bottom width and corner radius are critical<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n Neither geometry is universally superior. The correct choice depends on how the wafer should be located, supported and allowed to move.<\/p>\n\n\n\n
In many applications, a modified groove combining an angled entry with a radiused supporting surface provides a better compromise than a pure V- or U-shaped slot.<\/p>\n\n\n\n
Why Contact Area Matters<\/h2>\n\n\n\n
The wafer boat should support the wafer securely while keeping unnecessary contact to a minimum.<\/p>\n\n\n\n
Contact area influences:<\/p>\n\n\n\n
- \n
- \uae30\uacc4\uc801 \uc2a4\ud2b8\ub808\uc2a4<\/li>\n\n\n\n
- Friction<\/li>\n\n\n\n
- \ud30c\ud2f0\ud074 \uc0dd\uc131<\/li>\n\n\n\n
- Surface marking<\/li>\n\n\n\n
- Thermal movement<\/li>\n\n\n\n
- Cleaning accessibility<\/li>\n\n\n\n
- Wafer position repeatability<\/li>\n<\/ul>\n\n\n\n
Contact Area That Is Too Small<\/h3>\n\n\n\n
Very small contact points can create concentrated stress. If the slot contains machining marks, sharp corners or dimensional mismatch, the contact pressure may be focused on a small portion of the wafer edge.<\/p>\n\n\n\n
This can increase the risk of:<\/p>\n\n\n\n
- \n
- Microchipping<\/li>\n\n\n\n
- Edge cracks<\/li>\n\n\n\n
- Repeated contact marks<\/li>\n\n\n\n
- Wafer instability<\/li>\n\n\n\n
- Accelerated slot wear<\/li>\n<\/ul>\n\n\n\n
Contact Area That Is Too Large<\/h3>\n\n\n\n
A broad contact surface distributes the mechanical load, but it also creates more opportunity for friction and contamination.<\/p>\n\n\n\n
Excessive contact can cause:<\/p>\n\n\n\n
- \n
- Restricted wafer movement<\/li>\n\n\n\n
- Particle accumulation<\/li>\n\n\n\n
- More difficult cleaning<\/li>\n\n\n\n
- Larger contact marks<\/li>\n\n\n\n
- Increased sensitivity to surface flatness<\/li>\n\n\n\n
- Sticking after repeated thermal cycles<\/li>\n<\/ul>\n\n\n\n
A low-contact wafer boat design should therefore reduce unnecessary contact without making the wafer mechanically unstable. Some SiC wafer-boat designs specifically use angled support features to reduce contact and manage stress during high-temperature processing.<\/p>\n\n\n\n
Matching the Groove to the Wafer Edge<\/h2>\n\n\n\n
The groove must be designed around the actual wafer edge rather than only the nominal wafer thickness.<\/p>\n\n\n\n
Semiconductor wafers may have:<\/p>\n\n\n\n
- \n
- Rounded edges<\/li>\n\n\n\n
- Beveled edges<\/li>\n\n\n\n
- Polished edges<\/li>\n\n\n\n
- Edge exclusions<\/li>\n\n\n\n
- Thickness tolerances<\/li>\n\n\n\n
- Bow or warp<\/li>\n\n\n\n
- Flats or orientation notches<\/li>\n\n\n\n
- Coatings or deposited films near the edge<\/li>\n<\/ul>\n\n\n\n
If the groove contact point is positioned too close to the wafer face, the slot may touch a coated or device-sensitive surface. If contact is placed too far toward the center of the edge, the wafer may sit too deeply and become difficult to load.<\/p>\n\n\n\n
The designer should identify:<\/p>\n\n\n\n
- \n
- Which part of the wafer edge may be contacted<\/li>\n\n\n\n
- Which surfaces must remain completely free from contact<\/li>\n\n\n\n
- How deeply the wafer should enter the groove<\/li>\n\n\n\n
- How much lateral clearance is acceptable<\/li>\n\n\n\n
- Whether the wafer will expand, bow or move during processing<\/li>\n<\/ol>\n\n\n\n
A detailed wafer edge drawing is strongly recommended for thin, coated, polished or non-standard wafers.<\/p>\n\n\n\n
Slot Opening and Entry Geometry<\/h2>\n\n\n\n
The slot entrance controls how easily the wafer can be loaded.<\/p>\n\n\n\n
A narrow entrance may provide precise positioning but requires accurate alignment between the robot, cassette and wafer boat. A wider entrance makes loading easier but may reduce final positioning accuracy.<\/p>\n\n\n\n
Useful entry features may include:<\/p>\n\n\n\n
- \n
- Lead-in chamfers<\/li>\n\n\n\n
- Rounded upper edges<\/li>\n\n\n\n
- Tapered slot openings<\/li>\n\n\n\n
- Asymmetric guiding walls<\/li>\n\n\n\n
- Polished transition surfaces<\/li>\n<\/ul>\n\n\n\n
Sharp edges at the slot entrance should be avoided. Even if the supporting area is properly designed, a sharp entry corner can strike the wafer during loading.<\/p>\n\n\n\n
For automated systems, slot geometry should be evaluated together with robot positioning tolerance and wafer transfer trajectory.<\/p>\n\n\n\n
Groove Depth and Wafer Retention<\/h2>\n\n\n\n
Groove depth affects both stability and accessibility.<\/p>\n\n\n\n
A deeper slot may provide stronger lateral retention, but it can also:<\/p>\n\n\n\n
- \n
- Increase surface contact<\/li>\n\n\n\n
- Make unloading more difficult<\/li>\n\n\n\n
- Restrict thermal movement<\/li>\n\n\n\n
- Increase the risk of wafer-face contact<\/li>\n\n\n\n
- Trap particles or cleaning residue<\/li>\n<\/ul>\n\n\n\n
A shallow slot may reduce contact but provide insufficient support during transport or furnace loading.<\/p>\n\n\n\n
The correct depth should be determined by wafer diameter, boat orientation and the number and position of support rods.<\/p>\n\n\n\n
Vertical wafer boats commonly use multiple grooved support rods arranged around the wafer so that aligned grooves support the wafer at several edge positions.<\/p>\n\n\n\n
Slot Alignment Between Support Rods<\/h2>\n\n\n\n
Even a well-designed groove profile can damage wafers if the slots on different support rods are not aligned.<\/p>\n\n\n\n
Misalignment can cause:<\/p>\n\n\n\n
- \n
- Wafer twisting<\/li>\n\n\n\n
- Uneven contact height<\/li>\n\n\n\n
- Concentrated loading on one rod<\/li>\n\n\n\n
- Difficulty inserting wafers<\/li>\n\n\n\n
- Changes in wafer spacing<\/li>\n\n\n\n
- Edge chipping during loading<\/li>\n<\/ul>\n\n\n\n
The inspection plan should therefore include more than individual groove width.<\/p>\n\n\n\n
Recommended checks include:<\/p>\n\n\n\n
- \n
- \uc2ac\ub86f \ud53c\uce58<\/li>\n\n\n\n
- Cumulative pitch error<\/li>\n\n\n\n
- Groove height consistency<\/li>\n\n\n\n
- Angular alignment<\/li>\n\n\n\n
- Rod straightness<\/li>\n\n\n\n
- Parallelism between rods<\/li>\n\n\n\n
- Wafer seating verification<\/li>\n\n\n\n
- Go\/no-go loading tests<\/li>\n<\/ul>\n\n\n\n
A sample wafer or precision inspection fixture can be used to verify whether the wafer contacts all intended supporting positions consistently.<\/p>\n\n\n\n
Surface Finish and Edge Quality of the Slot<\/h2>\n\n\n\n
Machining quality is especially important in the wafer contact region.<\/p>\n\n\n\n
The slot should be inspected for:<\/p>\n\n\n\n
- \n
- Burrs<\/li>\n\n\n\n
- Sharp corners<\/li>\n\n\n\n
- Grinding marks<\/li>\n\n\n\n
- Local pits<\/li>\n\n\n\n
- Chips<\/li>\n\n\n\n
- \ubbf8\uc138 \uade0\uc5f4<\/li>\n\n\n\n
- Uneven radii<\/li>\n\n\n\n
- Particle residue<\/li>\n\n\n\n
- \ud45c\uba74 \uc624\uc5fc<\/li>\n<\/ul>\n\n\n\n
For ceramic and SiC wafer boats, the manufacturing process must control both dimensional accuracy and local edge integrity. A groove that meets nominal dimensions may still be unsuitable if the supporting surface has chips or irregularities.<\/p>\n\n\n\n
The required surface finish should be specified separately for:<\/p>\n\n\n\n
- \n
- Wafer-contacting surfaces<\/li>\n\n\n\n
- Slot entry surfaces<\/li>\n\n\n\n
- Non-contacting surfaces<\/li>\n\n\n\n
- External handling surfaces<\/li>\n<\/ul>\n\n\n\n
Selecting a Slot Geometry for Thin Wafers<\/h2>\n\n\n\n
Thin wafers are generally more sensitive to local stress, bow and handling misalignment.<\/p>\n\n\n\n
For thin-wafer applications, buyers should consider:<\/p>\n\n\n\n
- \n
- Wider loading clearance<\/li>\n\n\n\n
- Smooth entry transitions<\/li>\n\n\n\n
- Controlled support radius<\/li>\n\n\n\n
- Reduced contact pressure<\/li>\n\n\n\n
- Consistent contact height<\/li>\n\n\n\n
- Additional supporting points<\/li>\n\n\n\n
- Wafer bow under operating conditions<\/li>\n\n\n\n
- Compatibility with temporary bonding or carrier wafers<\/li>\n<\/ul>\n\n\n\n
A groove copied from a standard-thickness wafer boat may not be suitable for a substantially thinner wafer.<\/p>\n\n\n\n
When developing a replacement boat, the supplier should know whether the existing geometry has already caused edge chips, loading resistance or unstable wafer positioning.<\/p>\n\n\n\n
Replacement Wafer Boats: Should the Original Slot Be Copied?<\/h2>\n\n\n\n
Copying the original slot geometry may be appropriate when the existing boat has performed reliably and the goal is direct replacement.<\/p>\n\n\n\n
However, the original groove should not be copied without evaluating wear.<\/p>\n\n\n\n
Used wafer boats may have:<\/p>\n\n\n\n
- \n
- Widened grooves<\/li>\n\n\n\n
- Rounded slot entrances<\/li>\n\n\n\n
- Material loss<\/li>\n\n\n\n
- Deposits<\/li>\n\n\n\n
- Chipped support edges<\/li>\n\n\n\n
- Distorted dimensions<\/li>\n\n\n\n
- Uneven wear between slots<\/li>\n<\/ul>\n\n\n\n
Measurements should be taken from multiple slots, including lightly used areas whenever possible. The final drawing should distinguish between the intended original geometry and dimensions created by service wear.<\/p>\n\n\n\n
Information Required for a Custom Wafer Boat RFQ<\/h2>\n\n\n\n
To obtain an accurate design and quotation, provide the following information:<\/p>\n\n\n\n
Wafer information<\/h3>\n\n\n\n
- \n
- Wafer material<\/li>\n\n\n\n
- \uc6e8\uc774\ud37c \uc9c1\uacbd<\/li>\n\n\n\n
- Nominal thickness<\/li>\n\n\n\n
- Thickness tolerance<\/li>\n\n\n\n
- Edge profile<\/li>\n\n\n\n
- Bow and warp limits<\/li>\n\n\n\n
- Coating or film information<\/li>\n\n\n\n
- Sensitive contact areas<\/li>\n<\/ul>\n\n\n\n
Slot information<\/h3>\n\n\n\n
- \n
- V-groove, U-groove or custom profile<\/li>\n\n\n\n
- Slot opening width<\/li>\n\n\n\n
- Bottom width or radius<\/li>\n\n\n\n
- Groove depth<\/li>\n\n\n\n
- Sidewall angle<\/li>\n\n\n\n
- Entry chamfer<\/li>\n\n\n\n
- \uc2ac\ub86f \ud53c\uce58<\/li>\n\n\n\n
- Number of slots<\/li>\n\n\n\n
- Required contact position<\/li>\n<\/ul>\n\n\n\n
Boat information<\/h3>\n\n\n\n
- \n
- Vertical or horizontal configuration<\/li>\n\n\n\n
- \uc804\uccb4 \uce58\uc218<\/li>\n\n\n\n
- Number of support rods<\/li>\n\n\n\n
- Support rod position<\/li>\n\n\n\n
- Required capacity<\/li>\n\n\n\n
- Loading direction<\/li>\n\n\n\n
- Interface with furnace or transfer equipment<\/li>\n<\/ul>\n\n\n\n
Process information<\/h3>\n\n\n\n
- \n
- \ucd5c\ub300 \uc791\ub3d9 \uc628\ub3c4<\/li>\n\n\n\n
- Process atmosphere<\/li>\n\n\n\n
- \ud654\ud559 \ubb3c\uc9c8 \ub178\ucd9c<\/li>\n\n\n\n
- Cleaning method<\/li>\n\n\n\n
- Thermal cycle frequency<\/li>\n\n\n\n
- Particle-control requirements<\/li>\n\n\n\n
- Expected service life<\/li>\n<\/ul>\n\n\n\n
Inspection requirements<\/h3>\n\n\n\n
- \n
- Dimensional report<\/li>\n\n\n\n
- Slot pitch inspection<\/li>\n\n\n\n
- Surface-defect criteria<\/li>\n\n\n\n
- Material certificate<\/li>\n\n\n\n
- Cleanliness requirements<\/li>\n\n\n\n
- Sample loading test<\/li>\n\n\n\n
- Packaging requirements<\/li>\n<\/ul>\n\n\n\n
Drawings, photographs and an existing sample can significantly improve the accuracy of a replacement design.<\/p>\n\n\n\n
\uacb0\ub860<\/h2>\n\n\n\n
Wafer boat slot geometry is a critical part of wafer handling and furnace-process reliability. V-grooves can provide accurate positioning and limited contact, while U-grooves can provide greater loading clearance and broader support.<\/p>\n\n\n\n
However, the final performance depends on much more than the basic groove name.<\/p>\n\n\n\n
Slot opening width, bottom radius, sidewall angle, groove depth, contact position, entry shape, surface finish and alignment between support rods must all be evaluated together.<\/p>\n\n\n\n
For custom SiC, quartz or advanced ceramic wafer boats, the slot should be designed around the actual wafer edge, loading system and operating environment. A carefully controlled groove profile can improve loading consistency, reduce wafer edge damage and support more reliable semiconductor processing.<\/p>\n\n\n\n
\uc790\uc8fc \ubb3b\ub294 \uc9c8\ubb38<\/h2>\n\n\n\n
Is a V-groove always better for wafer positioning?<\/h3>\n\n\n\n
A V-groove generally provides stronger self-centering, but it is not automatically the best choice. A sharp or narrow V-groove may create concentrated edge stress. The groove angle, root radius and contact location must be matched to the wafer.<\/p>\n\n\n\n
Does a U-groove provide better wafer edge protection?<\/h3>\n\n\n\n
A U-groove can distribute contact over a broader area, but excessive clearance may allow wafer movement. Edge protection depends on the complete profile rather than whether the groove is simply called U-shaped.<\/p>\n\n\n\n
Can one wafer boat hold wafers with different thicknesses?<\/h3>\n\n\n\n
Small thickness variations may be accommodated by a properly designed slot. Significant thickness differences can change the wafer seating height, contact position and loading clearance. Separate boats or a specially developed groove may be required.<\/p>\n\n\n\n
What causes wafer chipping inside a boat slot?<\/h3>\n\n\n\n
Common causes include sharp slot edges, excessive contact pressure, misaligned support rods, insufficient loading clearance, surface defects, incorrect groove depth and impact during automated loading.<\/p>\n\n\n\n
Can an existing wafer boat be reverse engineered?<\/h3>\n\n\n\n
Yes. A supplier can measure the overall structure, slot profile, pitch, rod positions and equipment interfaces. However, wear and deposits must be considered so that damaged dimensions are not mistaken for the original design.<\/p>\n\n\n\n
Which material is suitable for custom wafer boats?<\/h3>\n\n\n\n
Material selection depends on temperature, process atmosphere, chemical exposure, purity and contamination requirements. Common options include quartz and different forms of silicon carbide. The material and groove geometry should be evaluated as one integrated design.<\/p>","protected":false},"excerpt":{"rendered":"
Wafer boat performance depends on more than the boat material, wafer capacity and overall dimensions. The geometry of each wafer slot directly affects wafer positioning, edge contact, loading stability, thermal movement and the risk of chipping or particle generation. A slot that is too narrow may grip the wafer edge too tightly. A slot that […]<\/p>\n","protected":false},"author":1,"featured_media":2473,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[4],"tags":[],"class_list":["post-2472","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technical-insights"],"_links":{"self":[{"href":"https:\/\/www.xkh-ceramics.com\/ko\/wp-json\/wp\/v2\/posts\/2472","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.xkh-ceramics.com\/ko\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.xkh-ceramics.com\/ko\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/ko\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/ko\/wp-json\/wp\/v2\/comments?post=2472"}],"version-history":[{"count":1,"href":"https:\/\/www.xkh-ceramics.com\/ko\/wp-json\/wp\/v2\/posts\/2472\/revisions"}],"predecessor-version":[{"id":2474,"href":"https:\/\/www.xkh-ceramics.com\/ko\/wp-json\/wp\/v2\/posts\/2472\/revisions\/2474"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/ko\/wp-json\/wp\/v2\/media\/2473"}],"wp:attachment":[{"href":"https:\/\/www.xkh-ceramics.com\/ko\/wp-json\/wp\/v2\/media?parent=2472"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/ko\/wp-json\/wp\/v2\/categories?post=2472"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/ko\/wp-json\/wp\/v2\/tags?post=2472"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}