{"id":2484,"date":"2026-08-12T02:19:19","date_gmt":"2026-08-12T02:19:19","guid":{"rendered":"https:\/\/www.xkh-ceramics.com\/?p=2484"},"modified":"2026-08-12T02:34:48","modified_gmt":"2026-08-12T02:34:48","slug":"sic-wafer-boat-cleaning-and-contamination-control-particles-metals-and-service-life","status":"publish","type":"post","link":"https:\/\/www.xkh-ceramics.com\/it\/sic-wafer-boat-cleaning-and-contamination-control-particles-metals-and-service-life\/","title":{"rendered":"SiC Wafer Boat Cleaning and Contamination Control: Particles, Metals and Service Life"},"content":{"rendered":"

Silicon carbide wafer boats are widely used in semiconductor thermal processing because of their high-temperature stability, mechanical strength, chemical resistance, and relatively low particle generation. They are commonly found in oxidation, diffusion, LPCVD, annealing, and other furnace processes where wafers must be securely supported at elevated temperatures.<\/p>\n\n\n\n

However, even a high-quality SiC wafer boat <\/a>can become a source of contamination if deposits, particles, metallic impurities, or surface damage accumulate during repeated production cycles.<\/p>\n\n\n\n

For semiconductor manufacturers, cleaning a SiC wafer boat is therefore not simply a maintenance task. It is an important part of contamination control, wafer yield management, and consumable life-cycle optimization.<\/p>\n\n\n\n

This guide explains the major contamination mechanisms affecting SiC wafer boats, cleaning considerations, inspection methods, and practical factors that determine service life.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

Why SiC Wafer Boat Cleanliness Matters<\/h2>\n\n\n\n

During semiconductor processing, wafers may remain inside a high-temperature furnace for extended periods. The wafer boat is positioned very close to the wafer surface, making its cleanliness particularly important.<\/p>\n\n\n\n

Contamination from the boat can potentially contribute to:<\/p>\n\n\n\n

    \n
  • Wafer surface particles<\/li>\n\n\n\n
  • Metallic contamination<\/li>\n\n\n\n
  • Film residues<\/li>\n\n\n\n
  • Furnace tube contamination<\/li>\n\n\n\n
  • Cross-contamination between process batches<\/li>\n\n\n\n
  • Local wafer defects<\/li>\n\n\n\n
  • Reduced device yield<\/li>\n<\/ul>\n\n\n\n

    The acceptable cleanliness level depends heavily on the semiconductor process.<\/p>\n\n\n\n

    A wafer boat used for relatively tolerant thermal treatments may have different contamination requirements from one used in advanced semiconductor diffusion or deposition processes.<\/p>\n\n\n\n

    For this reason, wafer boat cleaning specifications should always be established according to the actual process environment rather than using one cleaning standard for every application.<\/p>\n\n\n\n

    1. Particle Contamination on SiC Wafer Boats<\/h2>\n\n\n\n

    Particle generation is one of the most common concerns associated with semiconductor furnace consumables.<\/p>\n\n\n\n

    Particles can originate from several sources.<\/p>\n\n\n\n

    Process Deposits<\/h3>\n\n\n\n

    Repeated furnace cycles may gradually create deposits on wafer boat surfaces.<\/p>\n\n\n\n

    Depending on the process, these deposits may include:<\/p>\n\n\n\n

      \n
    • Silicon-containing residues<\/li>\n\n\n\n
    • Oxide films<\/li>\n\n\n\n
    • Nitride deposits<\/li>\n\n\n\n
    • Dopant-related residues<\/li>\n\n\n\n
    • Reaction by-products<\/li>\n\n\n\n
    • Trace contaminants from furnace atmosphere<\/li>\n<\/ul>\n\n\n\n

      When the deposited layer becomes sufficiently thick, thermal cycling can cause cracking, peeling, or flaking.<\/p>\n\n\n\n

      These fragments may become particles inside the furnace.<\/p>\n\n\n\n

      Mechanical Contact<\/h3>\n\n\n\n

      Each wafer is supported by slots or contact points on the wafer boat.<\/p>\n\n\n\n

      Repeated wafer loading and unloading can gradually produce microscopic wear at these locations.<\/p>\n\n\n\n

      Poor slot geometry, excessive contact pressure, rough surfaces, or damaged edges can increase particle generation.<\/p>\n\n\n\n

      For semiconductor wafer boats, slot design and surface finish therefore have a direct influence on cleanliness.<\/p>\n\n\n\n

      Surface Damage<\/h3>\n\n\n\n

      Scratches, chips, microcracks, or damaged SiC coatings can create locations where contaminants accumulate.<\/p>\n\n\n\n

      They can also increase the risk of particle shedding during thermal cycling.<\/p>\n\n\n\n

      A cleaning program should therefore include both contamination removal and physical inspection.<\/p>\n\n\n\n

      2. Metallic Contamination<\/h2>\n\n\n\n

      Particles are visible or measurable contamination sources, but metallic contamination can be even more critical in semiconductor manufacturing.<\/p>\n\n\n\n

      Possible metallic contaminants may include:<\/p>\n\n\n\n

        \n
      • Iron<\/li>\n\n\n\n
      • Nickel<\/li>\n\n\n\n
      • Chromium<\/li>\n\n\n\n
      • Copper<\/li>\n\n\n\n
      • Sodium<\/li>\n\n\n\n
      • Aluminum<\/li>\n\n\n\n
      • Calcium<\/li>\n\n\n\n
      • Other trace metals<\/li>\n<\/ul>\n\n\n\n

        These contaminants can originate from handling tools, furnace hardware, previous process exposure, cleaning equipment, or unsuitable cleaning chemicals.<\/p>\n\n\n\n

        Even when contamination cannot be visually observed, trace metals may still affect semiconductor device performance.<\/p>\n\n\n\n

        For demanding applications, users may therefore establish maximum allowable levels for specific metallic elements.<\/p>\n\n\n\n

        Analytical methods may include techniques such as:<\/p>\n\n\n\n

          \n
        • ICP-MS<\/li>\n\n\n\n
        • TXRF<\/li>\n\n\n\n
        • Surface chemical analysis<\/li>\n\n\n\n
        • Process-specific contamination monitoring<\/li>\n<\/ul>\n\n\n\n

          The required detection method depends on the cleanliness specification and semiconductor process.<\/p>\n\n\n\n

          3. Why SiC Wafer Boat Material Quality Matters<\/h2>\n\n\n\n

          Not all SiC wafer boats have the same contamination performance.<\/p>\n\n\n\n

          Material structure, purity, manufacturing method, and surface treatment can significantly influence long-term behavior.<\/p>\n\n\n\n

          Common SiC material options may include:<\/p>\n\n\n\n

          Reaction-Bonded Silicon Carbide<\/h3>\n\n\n\n

          Reaction-bonded SiC, sometimes referred to as RB-SiC or RSiC depending on the manufacturing route and supplier terminology, can provide good mechanical properties and dimensional stability at relatively competitive cost.<\/p>\n\n\n\n

          However, material composition and residual phases must be carefully evaluated for semiconductor applications.<\/p>\n\n\n\n

          Sintered Silicon Carbide<\/h3>\n\n\n\n

          High-purity sintered SiC can provide excellent chemical stability, strength, and wear resistance.<\/p>\n\n\n\n

          It is often considered where demanding contamination control and long service life are required.<\/p>\n\n\n\n

          SiC-Coated Components<\/h3>\n\n\n\n

          Some semiconductor furnace components use a high-purity SiC coating over a structural substrate.<\/p>\n\n\n\n

          The coating can provide a chemically stable surface and improve contamination performance.<\/p>\n\n\n\n

          However, coating thickness, adhesion, porosity, surface defects, and long-term thermal cycling behavior must be controlled.<\/p>\n\n\n\n

          Once the coating becomes damaged or begins to delaminate, replacement may be necessary.<\/p>\n\n\n\n

          4. How Should a SiC Wafer Boat Be Cleaned?<\/h2>\n\n\n\n

          There is no universal cleaning recipe suitable for every SiC wafer boat.<\/p>\n\n\n\n

          The correct cleaning method depends on:<\/p>\n\n\n\n

            \n
          • SiC material grade<\/li>\n\n\n\n
          • Surface coating<\/li>\n\n\n\n
          • Process chemistry<\/li>\n\n\n\n
          • Deposit composition<\/li>\n\n\n\n
          • Furnace temperature<\/li>\n\n\n\n
          • Semiconductor cleanliness requirements<\/li>\n\n\n\n
          • Customer-approved chemical processes<\/li>\n<\/ul>\n\n\n\n

            A typical cleaning workflow may include several stages.<\/p>\n\n\n\n

            Step 1: Visual Inspection<\/h3>\n\n\n\n

            Before cleaning, inspect the wafer boat under appropriate lighting.<\/p>\n\n\n\n

            Look for:<\/p>\n\n\n\n

              \n
            • Deposits<\/li>\n\n\n\n
            • Discoloration<\/li>\n\n\n\n
            • Particle accumulation<\/li>\n\n\n\n
            • Scratches<\/li>\n\n\n\n
            • Chipped slots<\/li>\n\n\n\n
            • Microfratture<\/li>\n\n\n\n
            • Surface peeling<\/li>\n\n\n\n
            • Coating damage<\/li>\n\n\n\n
            • Deformation<\/li>\n<\/ul>\n\n\n\n

              Recording the condition before cleaning helps determine whether the component should be cleaned or replaced.<\/p>\n\n\n\n

              Step 2: Particle Removal<\/h3>\n\n\n\n

              Loose particles should be removed using methods compatible with semiconductor cleanliness requirements.<\/p>\n\n\n\n

              Aggressive mechanical brushing should generally be avoided unless specifically approved because it can scratch the surface and create additional contamination.<\/p>\n\n\n\n

              Step 3: Chemical Cleaning<\/h3>\n\n\n\n

              Chemical cleaning may be used to remove process residues or metallic contamination.<\/p>\n\n\n\n

              The selected chemistry must be compatible with the SiC material and any coating present.<\/p>\n\n\n\n

              Cleaning conditions may require control of:<\/p>\n\n\n\n

                \n
              • Chemical concentration<\/li>\n\n\n\n
              • Temperatura<\/li>\n\n\n\n
              • Immersion time<\/li>\n\n\n\n
              • Bath purity<\/li>\n\n\n\n
              • Rinse quality<\/li>\n<\/ul>\n\n\n\n

                Semiconductor-grade chemicals are normally preferred for high-purity applications.<\/p>\n\n\n\n

                Step 4: DI Water Rinsing<\/h3>\n\n\n\n

                After chemical treatment, thorough rinsing with high-purity deionized water is important to remove residual cleaning chemicals and dissolved contaminants.<\/p>\n\n\n\n

                Insufficient rinsing can introduce contamination into the furnace during the next production cycle.<\/p>\n\n\n\n

                Step 5: Drying<\/h3>\n\n\n\n

                Clean drying conditions are also important.<\/p>\n\n\n\n

                Particle-free drying methods should be used wherever possible.<\/p>\n\n\n\n

                Improper drying can leave:<\/p>\n\n\n\n

                  \n
                • Water spots<\/li>\n\n\n\n
                • Residues<\/li>\n\n\n\n
                • Particles<\/li>\n\n\n\n
                • Chemical stains<\/li>\n<\/ul>\n\n\n\n

                  Step 6: Final Inspection<\/h3>\n\n\n\n

                  After cleaning, the component should be inspected again.<\/p>\n\n\n\n

                  Depending on process requirements, inspection may include:<\/p>\n\n\n\n

                    \n
                  • Visual inspection<\/li>\n\n\n\n
                  • Surface particle testing<\/li>\n\n\n\n
                  • Ispezione dimensionale<\/li>\n\n\n\n
                  • Surface roughness measurement<\/li>\n\n\n\n
                  • Metallic contamination analysis<\/li>\n\n\n\n
                  • Crack inspection<\/li>\n<\/ul>\n\n\n\n

                    5. Pay Special Attention to Wafer Slots<\/h2>\n\n\n\n

                    The wafer slots are among the most critical areas of a SiC wafer boat.<\/p>\n\n\n\n

                    These areas experience repeated contact with wafer edges and may accumulate deposits more rapidly than other surfaces.<\/p>\n\n\n\n

                    Important slot parameters include:<\/p>\n\n\n\n

                      \n
                    • Slot width<\/li>\n\n\n\n
                    • Slot depth<\/li>\n\n\n\n
                    • Passo della scanalatura<\/li>\n\n\n\n
                    • Slot angle<\/li>\n\n\n\n
                    • Edge radius<\/li>\n\n\n\n
                    • Rugosit\u00e0 della superficie<\/li>\n\n\n\n
                    • Position tolerance<\/li>\n<\/ul>\n\n\n\n

                      If deposits accumulate inside the slots, wafers may no longer sit correctly.<\/p>\n\n\n\n

                      This may cause:<\/p>\n\n\n\n

                        \n
                      • Wafer tilting<\/li>\n\n\n\n
                      • Increased edge contact<\/li>\n\n\n\n
                      • Wafer scratching<\/li>\n\n\n\n
                      • Loading difficulty<\/li>\n\n\n\n
                      • Generazione di particelle<\/li>\n\n\n\n
                      • Wafer breakage<\/li>\n<\/ul>\n\n\n\n

                        Cleaning effectiveness inside narrow slots should therefore be specifically evaluated rather than inspecting only the external surfaces of the wafer boat.<\/p>\n\n\n\n

                        6. Cleaning Frequency: Time-Based or Process-Based?<\/h2>\n\n\n\n

                        A common question is how often a SiC wafer boat should be cleaned.<\/p>\n\n\n\n

                        There is no single number of furnace cycles that works for every semiconductor process.<\/p>\n\n\n\n

                        Cleaning frequency should ideally be determined using actual process data.<\/p>\n\n\n\n

                        Useful indicators include:<\/p>\n\n\n\n

                          \n
                        • Particle count trends<\/li>\n\n\n\n
                        • Deposit thickness<\/li>\n\n\n\n
                        • Furnace cycle count<\/li>\n\n\n\n
                        • Wafer defect trends<\/li>\n\n\n\n
                        • Process chemistry<\/li>\n\n\n\n
                        • Temperature history<\/li>\n\n\n\n
                        • Visual inspection results<\/li>\n<\/ul>\n\n\n\n

                          Some manufacturers use a predetermined number of process cycles.<\/p>\n\n\n\n

                          Others establish preventive cleaning intervals based on particle monitoring and process performance.<\/p>\n\n\n\n

                          A condition-based maintenance strategy can often reduce unnecessary cleaning while preventing excessive contamination buildup.<\/p>\n\n\n\n

                          7. Does Frequent Cleaning Reduce Wafer Boat Life?<\/h2>\n\n\n\n

                          Cleaning itself can influence the service life of the component.<\/p>\n\n\n\n

                          If aggressive chemicals, excessive mechanical force, unsuitable ultrasonic conditions, or repeated abrasive treatment are used, the wafer boat surface may gradually deteriorate.<\/p>\n\n\n\n

                          Possible consequences include:<\/p>\n\n\n\n

                            \n
                          • Increased surface roughness<\/li>\n\n\n\n
                          • Slot dimension changes<\/li>\n\n\n\n
                          • Edge damage<\/li>\n\n\n\n
                          • Coating erosion<\/li>\n\n\n\n
                          • Microcrack formation<\/li>\n<\/ul>\n\n\n\n

                            The objective should therefore not be to clean as aggressively as possible.<\/p>\n\n\n\n

                            Instead, the cleaning process should remove contamination while minimizing changes to the SiC surface.<\/p>\n\n\n\n

                            8. Signs That a SiC Wafer Boat Should Be Replaced<\/h2>\n\n\n\n

                            Cleaning cannot restore every used wafer boat.<\/p>\n\n\n\n

                            Replacement should be considered when inspection identifies structural or surface defects that could compromise wafer safety or contamination control.<\/p>\n\n\n\n

                            Typical warning signs include:<\/p>\n\n\n\n

                            Cracked Slots<\/h3>\n\n\n\n

                            Even small cracks can propagate during repeated heating and cooling cycles.<\/p>\n\n\n\n

                            Chipped Wafer Contact Areas<\/h3>\n\n\n\n

                            Damaged contact surfaces can increase wafer scratching and particle generation.<\/p>\n\n\n\n

                            Excessive Surface Roughness<\/h3>\n\n\n\n

                            A severely roughened surface can retain contamination and release particles.<\/p>\n\n\n\n

                            Coating Delamination<\/h3>\n\n\n\n

                            For coated wafer boats, peeling or damaged coatings may expose the underlying substrate.<\/p>\n\n\n\n

                            Dimensional Deformation<\/h3>\n\n\n\n

                            High-temperature service can gradually affect dimensional accuracy.<\/p>\n\n\n\n

                            Critical dimensions such as wafer slot pitch and boat straightness should therefore be periodically checked.<\/p>\n\n\n\n

                            Persistent Contamination<\/h3>\n\n\n\n

                            If contamination remains above specification despite repeated cleaning, replacement may be more economical than continued re-cleaning.<\/p>\n\n\n\n

                            9. Factors Affecting SiC Wafer Boat Service Life<\/h2>\n\n\n\n

                            The life of a wafer boat is determined by several interacting factors rather than material strength alone.<\/p>\n\n\n\n

                            Important factors include:<\/p>\n\n\n\n

                            Factor<\/th>Influence on Service Life<\/th><\/tr>
                            Process temperature<\/td>Higher temperatures may accelerate material degradation<\/td><\/tr>
                            Ciclo termico<\/td>Repeated heating and cooling creates thermal stress<\/td><\/tr>
                            Process chemistry<\/td>Reactive atmospheres can affect surfaces and coatings<\/td><\/tr>
                            Deposit accumulation<\/td>Thick deposits may crack or flake<\/td><\/tr>
                            Cleaning chemistry<\/td>Aggressive cleaning may damage surfaces<\/td><\/tr>
                            Wafer loading<\/td>Improper handling can damage slots<\/td><\/tr>
                            SiC purity<\/td>Material composition affects contamination performance<\/td><\/tr>
                            Finitura superficiale<\/td>Rough surfaces can increase particle retention<\/td><\/tr>
                            Slot geometry<\/td>Poor geometry may increase mechanical wear<\/td><\/tr>
                            Manufacturing quality<\/td>Internal defects may shorten component life<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

                            This is why two visually similar wafer boats may have very different service lives in the same semiconductor furnace.<\/p>\n\n\n\n

                            10. How to Extend SiC Wafer Boat Service Life<\/h2>\n\n\n\n

                            Several practical measures can improve usable life.<\/p>\n\n\n\n

                            First, select the correct SiC material grade for the process temperature and chemistry.<\/p>\n\n\n\n

                            Second, specify appropriate slot tolerances and surface finish during manufacturing.<\/p>\n\n\n\n

                            Third, establish controlled loading and unloading procedures.<\/p>\n\n\n\n

                            Fourth, monitor contamination trends rather than waiting for severe deposits to appear.<\/p>\n\n\n\n

                            Fifth, use validated cleaning methods that do not unnecessarily attack the SiC surface.<\/p>\n\n\n\n

                            Finally, inspect the wafer boat after a defined number of furnace cycles and maintain traceability for each component.<\/p>\n\n\n\n

                            Recording cleaning history and process cycles can help determine realistic replacement intervals.<\/p>\n\n\n\n

                            SiC Wafer Boat Inspection Checklist<\/h2>\n\n\n\n

                            When qualifying or maintaining a semiconductor SiC wafer boat, buyers and process engineers may consider checking:<\/p>\n\n\n\n

                              \n
                            • SiC material grade<\/li>\n\n\n\n
                            • Material purity<\/li>\n\n\n\n
                            • Diametro del wafer<\/li>\n\n\n\n
                            • Numero di slot<\/li>\n\n\n\n
                            • Passo della scanalatura<\/li>\n\n\n\n
                            • Slot width<\/li>\n\n\n\n
                            • Slot depth<\/li>\n\n\n\n
                            • Slot position tolerance<\/li>\n\n\n\n
                            • Boat straightness<\/li>\n\n\n\n
                            • Rugosit\u00e0 della superficie<\/li>\n\n\n\n
                            • Wafer contact geometry<\/li>\n\n\n\n
                            • Chips or cracks<\/li>\n\n\n\n
                            • Coating condition<\/li>\n\n\n\n
                            • Particle cleanliness<\/li>\n\n\n\n
                            • Metallic contamination<\/li>\n\n\n\n
                            • Cleaning history<\/li>\n\n\n\n
                            • Furnace cycle history<\/li>\n<\/ul>\n\n\n\n

                              For customized wafer boats, these requirements should ideally be defined before manufacturing.<\/p>\n\n\n\n

                              Custom SiC Wafer Boats for Semiconductor Processing<\/h2>\n\n\n\n

                              Semiconductor wafer boats frequently require customization according to the furnace system and wafer process.<\/p>\n\n\n\n

                              Typical customization parameters include:<\/p>\n\n\n\n

                                \n
                              • 100 mm wafer boats<\/li>\n\n\n\n
                              • 150 mm wafer boats<\/li>\n\n\n\n
                              • 200 mm wafer boats<\/li>\n\n\n\n
                              • 300 mm wafer boats<\/li>\n\n\n\n
                              • Custom wafer capacity<\/li>\n\n\n\n
                              • Custom slot pitch<\/li>\n\n\n\n
                              • Custom overall dimensions<\/li>\n\n\n\n
                              • Different SiC material grades<\/li>\n\n\n\n
                              • High-purity surfaces<\/li>\n\n\n\n
                              • Precision-machined wafer contact areas<\/li>\n<\/ul>\n\n\n\n

                                For replacement projects, customers can also provide an existing wafer boat, engineering drawing, sample, or dimensional inspection report for evaluation.<\/p>\n\n\n\n

                                When requesting a quotation, it is helpful to provide the wafer diameter, number of slots, slot pitch, overall dimensions, operating temperature, process atmosphere, material preference, cleanliness requirement, and required quantity.<\/p>\n\n\n\n

                                FAQ<\/h2>\n\n\n\n

                                Can SiC wafer boats be reused after cleaning?<\/h3>\n\n\n\n

                                Yes. SiC wafer boats are normally designed for repeated semiconductor processing cycles. If the component remains dimensionally stable and free from unacceptable cracks, surface damage, or contamination, it can generally be cleaned and reused according to the customer’s qualified process.<\/p>\n\n\n\n

                                What causes particles on a SiC wafer boat?<\/h3>\n\n\n\n

                                Particles may originate from process deposits, wafer contact wear, damaged surfaces, coating degradation, improper cleaning, or thermal cycling. Identifying the particle source is important before changing the cleaning procedure.<\/p>\n\n\n\n

                                How often should a SiC wafer boat be cleaned?<\/h3>\n\n\n\n

                                Cleaning frequency depends on the process chemistry, furnace temperature, deposition rate, contamination limits, and production cycle count. A process-based or condition-based cleaning interval is generally more effective than using the same fixed interval for every application.<\/p>\n\n\n\n

                                When should a SiC wafer boat be replaced instead of cleaned?<\/h3>\n\n\n\n

                                Replacement should be considered when cracks, chipped slots, severe surface roughness, dimensional deformation, coating failure, or persistent contamination could affect wafer handling or process cleanliness.<\/p>\n\n\n\n

                                What information is required for a custom SiC wafer boat quotation?<\/h3>\n\n\n\n

                                Buyers should normally provide wafer diameter, slot quantity, slot pitch, overall dimensions, operating temperature, process atmosphere, SiC material requirements, surface finish, cleanliness requirements, drawing or sample information, and required quantity.<\/p>\n\n\n\n

                                Conclusione<\/h2>\n\n\n\n

                                Cleaning and contamination control have a direct influence on SiC wafer boat performance in semiconductor manufacturing.<\/p>\n\n\n\n

                                Particles, metallic contamination, process deposits, mechanical wear, and surface damage can gradually affect both wafer cleanliness and component reliability. Effective maintenance therefore requires more than periodic chemical cleaning.<\/p>\n\n\n\n

                                Semiconductor manufacturers should combine controlled cleaning procedures with slot inspection, surface monitoring, dimensional checks, contamination analysis, and component traceability.<\/p>\n\n\n\n

                                When selecting a new SiC wafer boat, material purity, surface finish, slot geometry, dimensional tolerances, operating environment, and cleaning compatibility should all be evaluated together.<\/p>\n\n\n\n

                                A properly specified and maintained SiC wafer boat can provide stable wafer support, reduced particle risk, and longer service life across repeated high-temperature semiconductor processing cycles.<\/p>","protected":false},"excerpt":{"rendered":"

                                Silicon carbide wafer boats are widely used in semiconductor thermal processing because of their high-temperature stability, mechanical strength, chemical resistance, and relatively low particle generation. They are commonly found in oxidation, diffusion, LPCVD, annealing, and other furnace processes where wafers must be securely supported at elevated temperatures. However, even a high-quality SiC wafer boat can […]<\/p>\n","protected":false},"author":1,"featured_media":2485,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[3],"tags":[904,809,521,902,899,900,903,901],"class_list":["post-2484","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-semiconductor-furnace-consumables","tag-semiconductor-wafer-boat","tag-sic-wafer-boat","tag-sic-wafer-boat-service-life","tag-wafer-boat-cleaning","tag-wafer-boat-contamination","tag-wafer-boat-maintenance","tag-wafer-boat-particles"],"_links":{"self":[{"href":"https:\/\/www.xkh-ceramics.com\/it\/wp-json\/wp\/v2\/posts\/2484","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.xkh-ceramics.com\/it\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.xkh-ceramics.com\/it\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/it\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/it\/wp-json\/wp\/v2\/comments?post=2484"}],"version-history":[{"count":1,"href":"https:\/\/www.xkh-ceramics.com\/it\/wp-json\/wp\/v2\/posts\/2484\/revisions"}],"predecessor-version":[{"id":2486,"href":"https:\/\/www.xkh-ceramics.com\/it\/wp-json\/wp\/v2\/posts\/2484\/revisions\/2486"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/it\/wp-json\/wp\/v2\/media\/2485"}],"wp:attachment":[{"href":"https:\/\/www.xkh-ceramics.com\/it\/wp-json\/wp\/v2\/media?parent=2484"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/it\/wp-json\/wp\/v2\/categories?post=2484"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/it\/wp-json\/wp\/v2\/tags?post=2484"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}