{"id":2297,"date":"2026-05-25T01:30:07","date_gmt":"2026-05-25T01:30:07","guid":{"rendered":"https:\/\/www.xkh-ceramics.com\/?p=2297"},"modified":"2026-05-25T01:30:10","modified_gmt":"2026-05-25T01:30:10","slug":"silicon-carbide-wafer-boat-vs-quartz-wafer-boat","status":"publish","type":"post","link":"https:\/\/www.xkh-ceramics.com\/cs\/silicon-carbide-wafer-boat-vs-quartz-wafer-boat\/","title":{"rendered":"Karbid k\u0159em\u00edku vs. k\u0159emenn\u00e9 desti\u010dky: Kter\u00fd je lep\u0161\u00ed?"},"content":{"rendered":"

P\u0159i v\u00fdrob\u011b polovodi\u010d\u016f maj\u00ed komponenty pro manipulaci s desti\u010dkami p\u0159\u00edm\u00fd vliv na stabilitu procesu, v\u00fdt\u011b\u017enost a dlouhodob\u00e9 provozn\u00ed n\u00e1klady. Mezi nimi hraj\u00ed lodi\u010dky pro p\u0159epravu desti\u010dek kritickou roli p\u0159i p\u0159eprav\u011b a podpo\u0159e desti\u010dek b\u011bhem vysokoteplotn\u00edch dif\u00fazn\u00edch, oxida\u010dn\u00edch, epitaxn\u00edch a povlakovac\u00edch proces\u016f.<\/p>\n\n\n\n

Dva nej\u010dast\u011bji pou\u017e\u00edvan\u00e9 materi\u00e1ly jsou Lod\u011b na oplatky z karbidu k\u0159em\u00edku (SiC)<\/a><\/strong> a Lod\u011b z k\u0159emenn\u00fdch desti\u010dek<\/strong>. Ob\u011b technologie jsou \u0161iroce pou\u017e\u00edv\u00e1ny v prost\u0159ed\u00ed polovodi\u010d\u016f a p\u0159esn\u00e9 v\u00fdroby, ale v\u00fdrazn\u011b se li\u0161\u00ed tepeln\u00fdm v\u00fdkonem, \u017eivotnost\u00ed, kontrolou kontaminace a n\u00e1klady na \u017eivotn\u00ed cyklus.<\/p>\n\n\n\n

Kter\u00fd z nich je lep\u0161\u00ed? Odpov\u011b\u010f z\u00e1vis\u00ed na va\u0161ich procesn\u00edch po\u017eadavc\u00edch.<\/p>\n\n\n\n

Tento \u010dl\u00e1nek porovn\u00e1v\u00e1 lod\u011b na SiC a k\u0159emenn\u00e9 desti\u010dky v kl\u00ed\u010dov\u00fdch v\u00fdkonnostn\u00edch faktorech, aby pomohl v\u00fdrobc\u016fm l\u00e9pe se rozhodnout.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

Co je to lo\u010fka na oplatky?<\/h2>\n\n\n\n

Lo\u010fka na desti\u010dky je nosn\u00e1 konstrukce ur\u010den\u00e1 k bezpe\u010dn\u00e9mu ulo\u017een\u00ed polovodi\u010dov\u00fdch desti\u010dek p\u0159i vysokoteplotn\u00edm zpracov\u00e1n\u00ed. Zachov\u00e1v\u00e1 rozte\u010d desti\u010dek, p\u0159esnost polohov\u00e1n\u00ed a mechanickou stabilitu p\u0159i vystaven\u00ed n\u00e1ro\u010dn\u00fdm podm\u00ednk\u00e1m.<\/p>\n\n\n\n

Oplatkov\u00e9 lod\u011b se b\u011b\u017en\u011b pou\u017e\u00edvaj\u00ed v:<\/p>\n\n\n\n

    \n
  • Difuzn\u00ed pece<\/li>\n\n\n\n
  • Oxida\u010dn\u00ed syst\u00e9my<\/li>\n\n\n\n
  • Procesy LPCVD<\/li>\n\n\n\n
  • Epitaxn\u00ed za\u0159\u00edzen\u00ed<\/li>\n\n\n\n
  • Povlakovac\u00ed syst\u00e9my pro polovodi\u010de<\/li>\n\n\n\n
  • V\u00fdroba sol\u00e1rn\u00edch \u010dl\u00e1nk\u016f<\/li>\n<\/ul>\n\n\n\n

    Vzhledem k tomu, \u017ee desti\u010dky jsou opakovan\u011b vystaveny tepeln\u00fdm cykl\u016fm a chemick\u00fdm vliv\u016fm, je v\u00fdb\u011br materi\u00e1lu velmi d\u016fle\u017eit\u00fd.<\/p>\n\n\n\n

    P\u0159ehled lod\u00ed z karbidu k\u0159em\u00edku<\/h2>\n\n\n\n

    Lo\u010fky z karbidu k\u0159em\u00edku jsou vyr\u00e1b\u011bny z modern\u00edch keramick\u00fdch materi\u00e1l\u016f s v\u00fdjime\u010dn\u00fdmi tepeln\u00fdmi a mechanick\u00fdmi vlastnostmi.<\/p>\n\n\n\n

    Kl\u00ed\u010dov\u00e9 vlastnosti:<\/p>\n\n\n\n

      \n
    • Vynikaj\u00edc\u00ed odolnost proti vysok\u00fdm teplot\u00e1m<\/li>\n\n\n\n
    • Vysok\u00e1 tepeln\u00e1 vodivost<\/li>\n\n\n\n
    • Vynikaj\u00edc\u00ed mechanick\u00e1 pevnost<\/li>\n\n\n\n
    • Vynikaj\u00edc\u00ed odolnost proti korozi<\/li>\n\n\n\n
    • N\u00edzk\u00e1 deformace p\u0159i tepeln\u00e9m cyklov\u00e1n\u00ed<\/li>\n\n\n\n
    • Dlouh\u00e1 \u017eivotnost<\/li>\n<\/ul>\n\n\n\n

      Lo\u010fky pro v\u00fdrobu SiC desti\u010dek se st\u00e1le \u010dast\u011bji pou\u017e\u00edvaj\u00ed p\u0159i pokro\u010dil\u00e9m zpracov\u00e1n\u00ed polovodi\u010d\u016f a ve velkos\u00e9riov\u00e9 v\u00fdrob\u011b.<\/p>\n\n\n\n

      P\u0159ehled k\u0159emenn\u00fdch desti\u010dek<\/h2>\n\n\n\n

      Lodi\u010dky na k\u0159emenn\u00e9 desti\u010dky se vyr\u00e1b\u011bj\u00ed z vysoce \u010dist\u00e9ho taven\u00e9ho k\u0159emene a tradi\u010dn\u011b se pou\u017e\u00edvaj\u00ed v pec\u00edch na v\u00fdrobu polovodi\u010d\u016f.<\/p>\n\n\n\n

      Kl\u00ed\u010dov\u00e9 vlastnosti:<\/p>\n\n\n\n

        \n
      • Vysok\u00e1 \u010distota<\/li>\n\n\n\n
      • N\u00edzk\u00e1 kovov\u00e1 kontaminace<\/li>\n\n\n\n
      • Dobr\u00e1 pr\u016fhlednost v\u016f\u010di tepeln\u00e9mu z\u00e1\u0159en\u00ed<\/li>\n\n\n\n
      • Relativn\u011b n\u00edzk\u00e9 n\u00e1klady na materi\u00e1l<\/li>\n\n\n\n
      • Vysp\u011bl\u00fd v\u00fdrobn\u00ed proces<\/li>\n<\/ul>\n\n\n\n

        K\u0159emen je ji\u017e po desetilet\u00ed standardn\u00edm materi\u00e1lem pro mnoho b\u011b\u017en\u00fdch polovodi\u010dov\u00fdch aplikac\u00ed.<\/p>\n\n\n\n

        Karbid k\u0159em\u00edku vs. k\u0159emenn\u00e9 desti\u010dky: Srovn\u00e1n\u00ed v\u00fdkonu<\/h2>\n\n\n\n
        Parametr<\/th>Lo\u010fka z karbidu k\u0159em\u00edku<\/th>Lo\u010f z k\u0159emenn\u00fdch desti\u010dek<\/th><\/tr><\/thead>
        Maxim\u00e1ln\u00ed provozn\u00ed teplota<\/td>Velmi vysok\u00e1<\/td>Vysok\u00e1<\/td><\/tr>
        Tepeln\u00e1 vodivost<\/td>Vynikaj\u00edc\u00ed<\/td>N\u00edzk\u00e1<\/td><\/tr>
        Mechanick\u00e1 pevnost<\/td>Velmi vysok\u00e1<\/td>Relativn\u011b n\u00edzk\u00e1<\/td><\/tr>
        Odolnost proti tepeln\u00fdm \u0161ok\u016fm<\/td>Vynikaj\u00edc\u00ed<\/td>M\u00edrn\u00e1<\/td><\/tr>
        Odolnost proti deformaci<\/td>Vynikaj\u00edc\u00ed<\/td>Doln\u00ed<\/td><\/tr>
        Odolnost proti korozi<\/td>Vynikaj\u00edc\u00ed<\/td>Dobr\u00fd<\/td><\/tr>
        \u017divotnost<\/td>Long<\/td>Krat\u0161\u00ed<\/td><\/tr>
        Po\u010d\u00e1te\u010dn\u00ed n\u00e1klady<\/td>Vy\u0161\u0161\u00ed<\/td>Doln\u00ed<\/td><\/tr>
        Dlouhodob\u00e9 n\u00e1klady<\/td>Doln\u00ed<\/td>Potenci\u00e1ln\u011b vy\u0161\u0161\u00ed<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

        1. Tepeln\u00e1 vodivost a distribuce tepla<\/h2>\n\n\n\n

        Jedn\u00edm z nejv\u011bt\u0161\u00edch rozd\u00edl\u016f mezi SiC a k\u0159emenem je tepeln\u00e1 vodivost.<\/p>\n\n\n\n

        Karbid k\u0159em\u00edku p\u0159en\u00e1\u0161\u00ed teplo mnohem \u00fa\u010dinn\u011bji ne\u017e k\u0159emen. Lep\u0161\u00ed tepeln\u00e1 vodivost napom\u00e1h\u00e1 rovnom\u011brn\u011bj\u0161\u00edmu rozlo\u017een\u00ed teploty nap\u0159\u00ed\u010d desti\u010dkami b\u011bhem zpracov\u00e1n\u00ed.<\/p>\n\n\n\n

        Mezi v\u00fdhody pat\u0159\u00ed:<\/p>\n\n\n\n

          \n
        • Stabiln\u011bj\u0161\u00ed procesn\u00ed podm\u00ednky<\/li>\n\n\n\n
        • Zlep\u0161en\u00e1 konzistence oplatek<\/li>\n\n\n\n
        • Sn\u00ed\u017een\u00ed tepeln\u00fdch gradient\u016f<\/li>\n\n\n\n
        • Ni\u017e\u0161\u00ed riziko deformace<\/li>\n<\/ul>\n\n\n\n

          K\u0159emen m\u00e1 relativn\u011b n\u00edzkou tepelnou vodivost. P\u0159i rychl\u00fdch cyklech zah\u0159\u00edv\u00e1n\u00ed a ochlazov\u00e1n\u00ed mohou b\u00fdt teplotn\u00ed rozd\u00edly v\u00fdrazn\u011bj\u0161\u00ed.<\/p>\n\n\n\n

          U vysoce p\u0159esn\u00fdch aplikac\u00ed je tepeln\u00e1 rovnom\u011brnost \u010dasto v\u00fdhodn\u011bj\u0161\u00ed pro SiC.<\/p>\n\n\n\n

          2. Mechanick\u00e1 pevnost a stabilita konstrukce<\/h2>\n\n\n\n

          Lo\u010fky na desti\u010dk\u00e1ch jsou vystaveny opakovan\u00fdm tepeln\u00fdm cykl\u016fm a mechanick\u00e9mu zat\u00ed\u017een\u00ed.<\/p>\n\n\n\n

          Karbid k\u0159em\u00edku m\u00e1 v\u00fdrazn\u011b vy\u0161\u0161\u00ed mechanickou pevnost ne\u017e k\u0159emen. To znamen\u00e1, \u017ee:<\/p>\n\n\n\n

            \n
          • Ni\u017e\u0161\u00ed riziko vzniku trhlin<\/li>\n\n\n\n
          • Lep\u0161\u00ed rozm\u011brov\u00e1 stabilita<\/li>\n\n\n\n
          • Sn\u00ed\u017een\u00e1 deformace p\u0159i zv\u00fd\u0161en\u00fdch teplot\u00e1ch<\/li>\n\n\n\n
          • V\u011bt\u0161\u00ed odolnost proti n\u00e1hodn\u00e9mu n\u00e1razu<\/li>\n<\/ul>\n\n\n\n

            K\u0159emenn\u00e9 materi\u00e1ly jsou k\u0159eh\u010d\u00ed a po del\u0161\u00ed dob\u011b pou\u017e\u00edv\u00e1n\u00ed mohou b\u00fdt n\u00e1chyln\u00e9 k prasknut\u00ed.<\/p>\n\n\n\n

            Ve vysoce v\u00fdkonn\u00fdch v\u00fdrobn\u00edch prost\u0159ed\u00edch se pevn\u011bj\u0161\u00ed materi\u00e1ly \u010dasto projevuj\u00ed v men\u0161\u00edm po\u010dtu p\u0159eru\u0161en\u00ed provozu za\u0159\u00edzen\u00ed.<\/p>\n\n\n\n

            3. Odolnost proti teplotn\u00edm \u0161ok\u016fm<\/h2>\n\n\n\n

            Polovodi\u010dov\u00e9 procesy \u010dasto zahrnuj\u00ed rychl\u00e9 zm\u011bny teploty.<\/p>\n\n\n\n

            Karbid k\u0159em\u00edku m\u00e1 d\u00edky kombinaci tepeln\u00e9 vodivosti a struktur\u00e1ln\u00ed pevnosti vynikaj\u00edc\u00ed odolnost v\u016f\u010di tepeln\u00fdm \u0161ok\u016fm.<\/p>\n\n\n\n

            T\u00edm se sni\u017euje pravd\u011bpodobnost, \u017ee:<\/p>\n\n\n\n

              \n
            • N\u00e1hl\u00e9 prasknut\u00ed<\/li>\n\n\n\n
            • \u00danava materi\u00e1lu<\/li>\n\n\n\n
            • P\u0159eru\u0161en\u00ed procesu<\/li>\n<\/ul>\n\n\n\n

              P\u0159i opakovan\u00fdch rychl\u00fdch cyklech zah\u0159\u00edv\u00e1n\u00ed a ochlazov\u00e1n\u00ed m\u016f\u017ee u k\u0159emene doch\u00e1zet k akumulaci nap\u011bt\u00ed.<\/p>\n\n\n\n

              P\u0159i agresivn\u00edm tepeln\u00e9m zpracov\u00e1n\u00ed se SiC \u010dasto osv\u011bd\u010duje l\u00e9pe.<\/p>\n\n\n\n

              4. \u017divotnost a n\u00e1klady na \u00fadr\u017ebu<\/h2>\n\n\n\n

              Po\u010d\u00e1te\u010dn\u00ed po\u0159izovac\u00ed n\u00e1klady nejsou jedin\u00fdm faktorem, kter\u00fd je t\u0159eba zv\u00e1\u017eit.<\/p>\n\n\n\n

              Lod\u011b z k\u0159emenn\u00fdch desti\u010dek jsou obvykle levn\u011bj\u0161\u00ed, ale mohou vy\u017eadovat:<\/p>\n\n\n\n

                \n
              • \u010cast\u011bj\u0161\u00ed v\u00fdm\u011bna<\/li>\n\n\n\n
              • Zv\u00fd\u0161en\u00e1 \u00fadr\u017eba<\/li>\n\n\n\n
              • V\u011bt\u0161\u00ed riziko prostoj\u016f<\/li>\n\n\n\n
              • Vy\u0161\u0161\u00ed spot\u0159eba z\u00e1sob<\/li>\n<\/ul>\n\n\n\n

                Lo\u010fky z karbidu k\u0159em\u00edku maj\u00ed obecn\u011b mnohem del\u0161\u00ed provozn\u00ed \u017eivotnost.<\/p>\n\n\n\n

                A\u010dkoli po\u010d\u00e1te\u010dn\u00ed investice m\u016f\u017ee b\u00fdt vy\u0161\u0161\u00ed, celkov\u00e9 n\u00e1klady na vlastnictv\u00ed se mohou \u010dasem sn\u00ed\u017eit.<\/p>\n\n\n\n

                U velk\u00fdch v\u00fdrobn\u00edch za\u0159\u00edzen\u00ed p\u0159in\u00e1\u0161\u00ed dlouh\u00e1 \u017eivotnost \u010dasto zna\u010dn\u00e9 \u00faspory.<\/p>\n\n\n\n

                5. \u0158\u00edzen\u00ed \u010d\u00e1stic a v\u00fdt\u011b\u017enost procesu<\/h2>\n\n\n\n

                Kontrola kontaminace m\u00e1 p\u0159i v\u00fdrob\u011b polovodi\u010d\u016f z\u00e1sadn\u00ed v\u00fdznam.<\/p>\n\n\n\n

                Po\u0161kozen\u00e9 nebo st\u00e1rnouc\u00ed desti\u010dky mohou vytv\u00e1\u0159et \u010d\u00e1stice, kter\u00e9 ovliv\u0148uj\u00ed kvalitu desti\u010dek a v\u00fdt\u011b\u017enost procesu.<\/p>\n\n\n\n

                Proto\u017ee karbid k\u0159em\u00edku zachov\u00e1v\u00e1 struktur\u00e1ln\u00ed integritu v n\u00e1ro\u010dn\u00fdch podm\u00ednk\u00e1ch, m\u016f\u017ee pomoci sn\u00ed\u017eit:<\/p>\n\n\n\n

                  \n
                • Mikrotrhliny<\/li>\n\n\n\n
                • Degradace povrchu<\/li>\n\n\n\n
                • Generov\u00e1n\u00ed \u010d\u00e1stic<\/li>\n<\/ul>\n\n\n\n

                  Ni\u017e\u0161\u00ed riziko kontaminace p\u0159isp\u00edv\u00e1 k vy\u0161\u0161\u00ed stabilit\u011b procesu.<\/p>\n\n\n\n

                  Kterou lo\u010fku na oplatky byste si m\u011bli vybrat?<\/h2>\n\n\n\n

                  Karbid k\u0159em\u00edku si vyberte, pokud:<\/h3>\n\n\n\n
                    \n
                  • V\u00e1\u0161 proces vyu\u017e\u00edv\u00e1 extr\u00e9mn\u011b vysok\u00e9 teploty<\/li>\n\n\n\n
                  • Tepeln\u00e1 rovnom\u011brnost je rozhoduj\u00edc\u00ed<\/li>\n\n\n\n
                  • Pot\u0159ebujete del\u0161\u00ed \u017eivotnost<\/li>\n\n\n\n
                  • Objem v\u00fdroby je vysok\u00fd<\/li>\n\n\n\n
                  • Chcete ni\u017e\u0161\u00ed dlouhodob\u00e9 provozn\u00ed n\u00e1klady<\/li>\n\n\n\n
                  • D\u016fle\u017eit\u00e1 je mechanick\u00e1 odolnost<\/li>\n<\/ul>\n\n\n\n

                    Vyberte si k\u0159emenn\u00e9 desti\u010dky, pokud:<\/h3>\n\n\n\n
                      \n
                    • Prim\u00e1rn\u00edm probl\u00e9mem jsou rozpo\u010dtov\u00e1 omezen\u00ed<\/li>\n\n\n\n
                    • Provozn\u00ed teploty jsou m\u00edrn\u00e9<\/li>\n\n\n\n
                    • Objem v\u00fdroby je ni\u017e\u0161\u00ed<\/li>\n\n\n\n
                    • Je vy\u017eadov\u00e1na tradi\u010dn\u00ed kompatibilita proces\u016f<\/li>\n<\/ul>\n\n\n\n

                      Z\u00e1v\u011bre\u010dn\u00e9 my\u0161lenky<\/h2>\n\n\n\n

                      Neexistuje univerz\u00e1ln\u00ed odpov\u011b\u010f na ot\u00e1zku, zda jsou lep\u0161\u00ed desti\u010dky z karbidu k\u0159em\u00edku nebo k\u0159emenn\u00e9 desti\u010dky. Spr\u00e1vn\u00e1 volba z\u00e1vis\u00ed na procesn\u00edch podm\u00ednk\u00e1ch, rozsahu v\u00fdroby a priorit\u00e1ch v oblasti n\u00e1klad\u016f.<\/p>\n\n\n\n

                      Pro pokro\u010dil\u00e9 polovodi\u010dov\u00e9 aplikace a n\u00e1ro\u010dn\u00e1 tepeln\u00e1 prost\u0159ed\u00ed jsou st\u00e1le \u010dast\u011bji preferovan\u00fdm \u0159e\u0161en\u00edm desti\u010dky z karbidu k\u0159em\u00edku, a to d\u00edky jejich vynikaj\u00edc\u00edm tepeln\u00fdm vlastnostem, pevnosti a dlouh\u00e9 \u017eivotnosti.<\/p>\n\n\n\n

                      K\u0159emenn\u00e9 desti\u010dky jsou st\u00e1le praktickou volbou pro mnoho b\u011b\u017en\u00fdch aplikac\u00ed, zejm\u00e9na tam, kde je d\u016fle\u017eit\u00e1 ni\u017e\u0161\u00ed po\u010d\u00e1te\u010dn\u00ed investice.<\/p>\n\n\n\n

                      Vzhledem k tomu, \u017ee v\u00fdroba polovodi\u010d\u016f pokra\u010duje sm\u011brem k v\u011bt\u0161\u00edm desti\u010dk\u00e1m, p\u0159\u00edsn\u011bj\u0161\u00edm toleranc\u00edm a vy\u0161\u0161\u00edm procesn\u00edm teplot\u00e1m, o\u010dek\u00e1v\u00e1 se, \u017ee pokro\u010dil\u00e9 keramick\u00e9 materi\u00e1ly, jako je SiC, budou hr\u00e1t je\u0161t\u011b v\u011bt\u0161\u00ed roli.<\/p>\n\n\n

                      \n
                      \n
                      \n

                      Mohou desti\u010dky z karbidu k\u0159em\u00edku p\u0159\u00edmo nahradit desti\u010dky z k\u0159em\u00edku?<\/h3>\n
                      \n\n

                      Ne v\u017edy. V\u00fdm\u011bna z\u00e1vis\u00ed na kompatibilit\u011b za\u0159\u00edzen\u00ed, velikosti desti\u010dek, tepeln\u00fdch profilech a specifikac\u00edch procesu. P\u0159ed zm\u011bnou materi\u00e1l\u016f by si v\u00fdrobci m\u011bli ov\u011b\u0159it rozm\u011brov\u00e9 a procesn\u00ed po\u017eadavky.<\/p>\n\n<\/div>\n<\/div>\n

                      \n

                      Pro\u010d jsou lod\u011b z karbidu k\u0159em\u00edku dra\u017e\u0161\u00ed?<\/h3>\n
                      \n\n

                      Materi\u00e1ly SiC zahrnuj\u00ed slo\u017eit\u00e9 v\u00fdrobn\u00ed procesy a pokro\u010dil\u00e9 techniky v\u00fdroby keramiky. Jejich del\u0161\u00ed \u017eivotnost a ni\u017e\u0161\u00ed frekvence v\u00fdm\u011bny v\u0161ak \u010dasto sni\u017euj\u00ed celkov\u00e9 provozn\u00ed n\u00e1klady.<\/p>\n\n<\/div>\n<\/div>\n

                      \n

                      Kter\u00fd materi\u00e1l pro v\u00fdrobu desti\u010dek je vhodn\u011bj\u0161\u00ed pro vysokoteplotn\u00ed zpracov\u00e1n\u00ed polovodi\u010d\u016f?<\/h3>\n
                      \n\n

                      Pro vysokoteplotn\u00ed aplikace a aplikace s rychl\u00fdm tepeln\u00fdm cyklem poskytuj\u00ed desti\u010dky z karbidu k\u0159em\u00edku obecn\u011b lep\u0161\u00ed v\u00fdkon d\u00edky vynikaj\u00edc\u00ed tepeln\u00e9 vodivosti, mechanick\u00e9 pevnosti a odolnosti proti tepeln\u00fdm \u0161ok\u016fm.<\/p>\n\n<\/div>\n<\/div>\n<\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"

                      In semiconductor manufacturing, wafer handling components directly affect process stability, yield, and long-term operating cost. Among them, wafer boats play a critical role in transporting and supporting wafers during high-temperature diffusion, oxidation, epitaxy, and coating processes. Two of the most commonly used materials are Silicon Carbide (SiC) wafer boats and Quartz wafer boats. While both […]<\/p>\n","protected":false},"author":1,"featured_media":2246,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[3],"tags":[469,514,513,518,515,251,520,81,517,521,522,516,512,519],"class_list":["post-2297","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-advanced-ceramic-materials","tag-diffusion-furnace-components","tag-high-temperature-wafer-processing","tag-lpcvd-wafer-boat","tag-quartz-wafer-boat","tag-semiconductor-ceramics","tag-semiconductor-equipment-parts","tag-semiconductor-manufacturing","tag-semiconductor-wafer-carrier","tag-sic-wafer-boat","tag-silicon-carbide-components","tag-silicon-carbide-wafer-boat","tag-wafer-boat-comparison","tag-wafer-handling-solutions"],"_links":{"self":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts\/2297","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/comments?post=2297"}],"version-history":[{"count":1,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts\/2297\/revisions"}],"predecessor-version":[{"id":2298,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts\/2297\/revisions\/2298"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/media\/2246"}],"wp:attachment":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/media?parent=2297"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/categories?post=2297"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/tags?post=2297"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}