{"id":2189,"date":"2026-05-15T05:15:54","date_gmt":"2026-05-15T05:15:54","guid":{"rendered":"https:\/\/www.xkh-ceramics.com\/?p=2189"},"modified":"2026-05-15T05:18:49","modified_gmt":"2026-05-15T05:18:49","slug":"ceramic-substrates-the-core-material-revolution-powering-ai-computing-optical-modules-and-power-semiconductors","status":"publish","type":"post","link":"https:\/\/www.xkh-ceramics.com\/cs\/ceramic-substrates-the-core-material-revolution-powering-ai-computing-optical-modules-and-power-semiconductors\/","title":{"rendered":"Keramick\u00e9 substr\u00e1ty: Z\u00e1kladn\u00ed materi\u00e1lov\u00e1 revoluce poh\u00e1n\u011bj\u00edc\u00ed v\u00fdpo\u010detn\u00ed techniku s um\u011blou inteligenc\u00ed, optick\u00e9 moduly a v\u00fdkonov\u00e9 polovodi\u010de"},"content":{"rendered":"

S t\u00edm, jak se zrychluje v\u00fdpo\u010detn\u00ed technika um\u011bl\u00e9 inteligence, zvy\u0161uje se rychlost p\u0159enosu dat a vyv\u00edj\u00ed se v\u00fdkonov\u00e1 elektronika nov\u00e9 generace, proch\u00e1zej\u00ed obalov\u00e9 technologie polovodi\u010d\u016f z\u00e1sadn\u00ed prom\u011bnou. B\u011b\u017en\u00e9 substr\u00e1tov\u00e9 materi\u00e1ly se st\u00e1le v\u00edce pot\u00fdkaj\u00ed s omezen\u00edmi v oblasti tepeln\u00e9 spr\u00e1vy, elektrick\u00e9ho v\u00fdkonu a hustoty integrace. V t\u00e9to souvislosti se keramick\u00e9 substr\u00e1ty st\u00e1vaj\u00ed z v\u00fdklenkov\u00fdch aplikac\u00ed rozhoduj\u00edc\u00edmi materi\u00e1ly pro budouc\u00ed polovodi\u010dov\u00e9 syst\u00e9my.<\/p>\n\n\n\n

Od akceler\u00e1tor\u016f um\u011bl\u00e9 inteligence a balen\u00ed pam\u011bt\u00ed s vysokou \u0161\u00ed\u0159kou p\u00e1sma (HBM) a\u017e po ultrarychl\u00e9 optick\u00e9 moduly a v\u00fdkonov\u00e9 polovodi\u010dov\u00e9 sou\u010d\u00e1stky, keramick\u00e9 substr\u00e1ty<\/a> jsou dnes pova\u017eov\u00e1ny za jeden z kl\u00ed\u010dov\u00fdch z\u00e1klad\u016f pokro\u010dil\u00e9 elektronick\u00e9 architektury.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

Pro\u010d jsou keramick\u00e9 substr\u00e1ty d\u016fle\u017eit\u00e9<\/h2>\n\n\n\n

Substr\u00e1ty slou\u017e\u00ed jako struktur\u00e1ln\u00ed a elektrick\u00e1 platforma spojuj\u00edc\u00ed \u010dipy, propojen\u00ed a obalov\u00e9 syst\u00e9my. V minulosti v tomto odv\u011btv\u00ed p\u0159evl\u00e1daly organick\u00e9 substr\u00e1ty a interposery na b\u00e1zi k\u0159em\u00edku. Rychl\u00fd n\u00e1r\u016fst hustoty v\u00fdkonu a slo\u017eitosti sign\u00e1lu v\u0161ak odhaluje jejich omezen\u00ed.<\/p>\n\n\n\n

Keramick\u00e9 substr\u00e1ty maj\u00ed n\u011bkolik jedine\u010dn\u00fdch v\u00fdhod:<\/p>\n\n\n\n

Vynikaj\u00edc\u00ed tepeln\u00e1 vodivost<\/h3>\n\n\n\n

Modern\u00ed procesory um\u011bl\u00e9 inteligence a vysoce v\u00fdkonn\u00e9 v\u00fdpo\u010detn\u00ed syst\u00e9my generuj\u00ed obrovskou tepelnou z\u00e1t\u011b\u017e. Tepeln\u00e9 p\u0159ek\u00e1\u017eky mohou p\u0159\u00edmo omezovat v\u00fdkon a spolehlivost.<\/p>\n\n\n\n

Mnoho pokro\u010dil\u00fdch keramick\u00fdch materi\u00e1l\u016f - v\u010detn\u011b nitridu hlin\u00edku (AlN), karbidu k\u0159em\u00edku (SiC) a nitridu k\u0159em\u00edku (Si\u2083N\u2084) - poskytuje v\u00fdrazn\u011b vy\u0161\u0161\u00ed tepelnou vodivost ne\u017e tradi\u010dn\u00ed organick\u00e9 materi\u00e1ly. \u00da\u010dinn\u00fd odvod tepla pom\u00e1h\u00e1 udr\u017eovat stabilitu za\u0159\u00edzen\u00ed a podporuje trval\u00fd provoz za podm\u00ednek vysok\u00e9ho v\u00fdkonu.<\/p>\n\n\n\n

N\u00edzk\u00e9 dielektrick\u00e9 ztr\u00e1ty pro vysokofrekven\u010dn\u00ed p\u0159enosy<\/h3>\n\n\n\n

S rozvojem optick\u00fdch komunika\u010dn\u00edch technologi\u00ed sm\u011brem k ultravysok\u00e9 \u0161\u00ed\u0159ce p\u00e1sma a vy\u0161\u0161\u00edm frekvenc\u00edm je integrita sign\u00e1lu st\u00e1le d\u016fle\u017eit\u011bj\u0161\u00ed.<\/p>\n\n\n\n

Keramick\u00e9 substr\u00e1ty maj\u00ed n\u00edzk\u00e9 dielektrick\u00e9 konstanty a n\u00edzk\u00e9 dielektrick\u00e9 ztr\u00e1ty, co\u017e sni\u017euje \u00fatlum sign\u00e1lu a zvy\u0161uje \u00fa\u010dinnost p\u0159enosu. D\u00edky t\u011bmto vlastnostem jsou velmi atraktivn\u00ed pro optick\u00e9 komunika\u010dn\u00ed obaly nov\u00e9 generace a pokro\u010dil\u00e9 syst\u00e9my um\u011bl\u00e9 inteligence.<\/p>\n\n\n\n

P\u0159esn\u00e9 p\u0159izp\u016fsoben\u00ed tepeln\u00e9 rozta\u017enosti<\/h3>\n\n\n\n

Nesoulad koeficient\u016f tepeln\u00e9 rozta\u017enosti mezi materi\u00e1ly substr\u00e1tu a polovodi\u010dov\u00fdmi \u010dipy m\u016f\u017ee p\u0159i opakovan\u00e9m tepeln\u00e9m cyklov\u00e1n\u00ed zp\u016fsobit mechanick\u00e9 nam\u00e1h\u00e1n\u00ed.<\/p>\n\n\n\n

Keramick\u00e9 materi\u00e1ly poskytuj\u00ed tepeln\u011b rozta\u017en\u00e9 vlastnosti, kter\u00e9 se l\u00e9pe shoduj\u00ed s polovodi\u010dov\u00fdmi materi\u00e1ly, co\u017e sni\u017euje nam\u00e1h\u00e1n\u00ed obal\u016f a zvy\u0161uje dlouhodobou spolehlivost.<\/p>\n\n\n\n

Vy\u0161\u0161\u00ed potenci\u00e1l hustoty propojen\u00ed<\/h3>\n\n\n\n

Pokro\u010dil\u00e9 balen\u00ed vy\u017eaduje st\u00e1le v\u011bt\u0161\u00ed \u0161\u00ed\u0159ku linek a v\u011bt\u0161\u00ed hustotu integrace. Keramick\u00e9 substr\u00e1ty mohou podporovat sofistikovan\u011bj\u0161\u00ed architektury propojen\u00ed, co\u017e umo\u017e\u0148uje vy\u0161\u0161\u00ed \u00farove\u0148 integrace \u010dip\u016f a men\u0161\u00ed rozm\u011bry balen\u00ed.<\/p>\n\n\n\n

S rostouc\u00ed slo\u017eitost\u00ed obal\u016f se technologie substr\u00e1tu st\u00e1v\u00e1 rozhoduj\u00edc\u00edm faktorem pro celkov\u00fd v\u00fdkon syst\u00e9mu.<\/p>\n\n\n\n

AI Computing m\u011bn\u00ed po\u017eadavky na balen\u00ed<\/h2>\n\n\n\n

Explozivn\u00ed r\u016fst pracovn\u00edch z\u00e1t\u011b\u017e\u00ed s um\u011blou inteligenc\u00ed v\u00fdrazn\u011b zv\u00fd\u0161il n\u00e1roky na v\u00fdpo\u010detn\u00ed v\u00fdkon a \u0161\u00ed\u0159ku pam\u011b\u0165ov\u00e9ho p\u00e1sma.<\/p>\n\n\n\n

Nov\u00e9 obalov\u00e9 architektury vy\u017eaduj\u00ed:<\/p>\n\n\n\n

    \n
  • V\u011bt\u0161\u00ed velikosti balen\u00ed<\/li>\n\n\n\n
  • Vy\u0161\u0161\u00ed po\u010det vstup\u016f\/v\u00fdstup\u016f<\/li>\n\n\n\n
  • Zlep\u0161en\u00e9 tepeln\u00e9 \u0159\u00edzen\u00ed<\/li>\n\n\n\n
  • Ni\u017e\u0161\u00ed latence sign\u00e1lu<\/li>\n\n\n\n
  • Vy\u0161\u0161\u00ed hustota integrace<\/li>\n<\/ul>\n\n\n\n

    Tradi\u010dn\u00ed obalov\u00e1 \u0159e\u0161en\u00ed se bl\u00ed\u017e\u00ed sv\u00fdm fyzick\u00fdm limit\u016fm. O\u010dek\u00e1v\u00e1 se, \u017ee budouc\u00ed syst\u00e9my um\u011bl\u00e9 inteligence budou st\u00e1le v\u00edce z\u00e1viset na pokro\u010dil\u00fdch substr\u00e1tov\u00fdch technologi\u00edch schopn\u00fdch podporovat rozs\u00e1hlou heterogenn\u00ed integraci.<\/p>\n\n\n\n

    Keramick\u00e9 substr\u00e1ty se st\u00e1vaj\u00ed nezbytn\u00fdmi, proto\u017ee sou\u010dasn\u011b \u0159e\u0161\u00ed elektrick\u00e9, tepeln\u00e9 a mechanick\u00e9 probl\u00e9my.<\/p>\n\n\n\n

    V mnoha koncepc\u00edch obal\u016f nov\u00e9 generace um\u011bl\u00e9 inteligence se m\u011bn\u00ed z voliteln\u00fdch prvk\u016f zvy\u0161uj\u00edc\u00edch v\u00fdkon na nepostradatelnou infrastrukturu.<\/p>\n\n\n\n

    Keramick\u00e9 substr\u00e1ty a v\u00fdvoj optick\u00fdch modul\u016f<\/h2>\n\n\n\n

    Dal\u0161\u00edm v\u00fdznamn\u00fdm faktorem je rychl\u00fd p\u0159echod na ultra vysokorychlostn\u00ed optick\u00e9 komunika\u010dn\u00ed syst\u00e9my.<\/p>\n\n\n\n

    Budouc\u00ed optick\u00e9 moduly pro datov\u00e1 centra a klastry um\u011bl\u00e9 inteligence vy\u017eaduj\u00ed:<\/p>\n\n\n\n

      \n
    • Rychlej\u0161\u00ed p\u0159enosov\u00e9 rychlosti<\/li>\n\n\n\n
    • Ni\u017e\u0161\u00ed vlo\u017en\u00fd \u00fatlum<\/li>\n\n\n\n
    • Sn\u00ed\u017een\u00e1 spot\u0159eba energie<\/li>\n\n\n\n
    • Lep\u0161\u00ed tepeln\u00e1 stabilita<\/li>\n<\/ul>\n\n\n\n

      P\u0159i p\u0159enosov\u00fdch rychlostech sm\u011b\u0159uj\u00edc\u00edch k v\u00edceterabitov\u00fdm architektur\u00e1m m\u016f\u017ee i mal\u00e1 degradace sign\u00e1lu ovlivnit celkovou \u00fa\u010dinnost syst\u00e9mu.<\/p>\n\n\n\n

      Keramick\u00e9 substr\u00e1ty nab\u00edzej\u00ed:<\/p>\n\n\n\n

        \n
      • vynikaj\u00edc\u00ed rozm\u011brov\u00e1 stabilita<\/li>\n\n\n\n
      • n\u00edzk\u00e9 vysokofrekven\u010dn\u00ed ztr\u00e1ty<\/li>\n\n\n\n
      • lep\u0161\u00ed schopnost odvodu tepla<\/li>\n\n\n\n
      • dlouhodob\u00e1 spolehlivost p\u0159i tepeln\u00e9m nam\u00e1h\u00e1n\u00ed<\/li>\n<\/ul>\n\n\n\n

        Tyto vlastnosti stav\u00ed keramiku do pozice siln\u00e9ho kandid\u00e1ta pro optick\u00e9 obalov\u00e9 platformy p\u0159\u00ed\u0161t\u00ed generace.<\/p>\n\n\n\n

        Pokra\u010duj\u00edc\u00ed roz\u0161i\u0159ov\u00e1n\u00ed aplikac\u00ed v\u00fdkonov\u00fdch polovodi\u010d\u016f<\/h2>\n\n\n\n

        Do nov\u00e9 \u00e9ry vstupuje tak\u00e9 v\u00fdkonov\u00e1 elektronika.<\/p>\n\n\n\n

        Elektromobily, syst\u00e9my obnoviteln\u00fdch zdroj\u016f energie, pr\u016fmyslov\u00e1 automatizace a vysokonap\u011b\u0165ov\u00e9 aplikace se st\u00e1le v\u00edce spol\u00e9haj\u00ed na \u0161irokop\u00e1smov\u00e9 polovodi\u010de.<\/p>\n\n\n\n

        Tato za\u0159\u00edzen\u00ed pracuj\u00ed pod:<\/p>\n\n\n\n

          \n
        • vy\u0161\u0161\u00ed nap\u011bt\u00ed<\/li>\n\n\n\n
        • vy\u0161\u0161\u00ed sp\u00ednac\u00ed frekvence<\/li>\n\n\n\n
        • zv\u00fd\u0161en\u00e9 teploty<\/li>\n\n\n\n
        • n\u00e1ro\u010dn\u00e9 podm\u00ednky tepeln\u00e9ho cyklov\u00e1n\u00ed<\/li>\n<\/ul>\n\n\n\n

          Keramick\u00e9 substr\u00e1ty ji\u017e hraj\u00ed kl\u00ed\u010dovou roli v mnoha v\u00fdkonov\u00fdch modulech, proto\u017ee kombinuj\u00ed:<\/p>\n\n\n\n

            \n
          • elektrick\u00e1 izolace<\/li>\n\n\n\n
          • mechanick\u00e1 pevnost<\/li>\n\n\n\n
          • tepeln\u00e1 vodivost<\/li>\n\n\n\n
          • spolehlivost v n\u00e1ro\u010dn\u00fdch podm\u00ednk\u00e1ch<\/li>\n<\/ul>\n\n\n\n

            S rostouc\u00ed hustotou v\u00fdkonu se o\u010dek\u00e1v\u00e1 je\u0161t\u011b v\u011bt\u0161\u00ed v\u00fdznam substr\u00e1tov\u00fdch struktur na b\u00e1zi keramiky.<\/p>\n\n\n\n

            Materi\u00e1lov\u00e9 platformy ur\u010duj\u00edc\u00ed budouc\u00ed v\u00fdvoj<\/h2>\n\n\n\n

            Rostouc\u00ed pozornost p\u0159itahuje n\u011bkolik keramick\u00fdch materi\u00e1l\u016f:<\/p>\n\n\n\n

            Materi\u00e1l<\/th>Kl\u00ed\u010dov\u00e9 charakteristiky<\/th>Typick\u00e9 aplikace<\/th><\/tr><\/thead>
            Hlin\u00edk (Al\u2082O\u2083)<\/td>N\u00e1kladov\u011b efektivn\u00ed, dobr\u00e1 izolace<\/td>Obecn\u00e9 elektronick\u00e9 obaly<\/td><\/tr>
            Nitrid hlin\u00edku (AlN)<\/td>Vysok\u00e1 tepeln\u00e1 vodivost<\/td>Vysoce v\u00fdkonn\u00e1 elektronika<\/td><\/tr>
            Nitrid k\u0159em\u00edku (Si\u2083N\u2084)<\/td>Vysok\u00e1 mechanick\u00e1 pevnost<\/td>Automobilov\u00e9 a v\u00fdkonov\u00e9 moduly<\/td><\/tr>
            Karbid k\u0159em\u00edku (SiC)<\/td>Odolnost v\u016f\u010di extr\u00e9mn\u00edm teplot\u00e1m<\/td>Pokro\u010dil\u00fd tepeln\u00fd management<\/td><\/tr>
            Zirkonov\u00e1 keramika<\/td>Vysok\u00e1 hou\u017eevnatost<\/td>Specializovan\u00e9 konstruk\u010dn\u00ed aplikace<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

            Ka\u017ed\u00fd materi\u00e1l nab\u00edz\u00ed jinou rovnov\u00e1hu tepeln\u00fdch, elektrick\u00fdch a mechanick\u00fdch vlastnost\u00ed, co\u017e konstrukt\u00e9r\u016fm umo\u017e\u0148uje optimalizovat v\u00fdb\u011br substr\u00e1tu podle pot\u0159eb aplikace.<\/p>\n\n\n\n

            V\u00fdhled do budoucna: Od podp\u016frn\u00e9ho materi\u00e1lu ke strategick\u00e9 technologii<\/h2>\n\n\n\n

            Polovodi\u010dov\u00fd pr\u016fmysl vstupuje do f\u00e1ze, kdy inovace materi\u00e1l\u016f st\u00e1le v\u00edce ur\u010duj\u00ed schopnosti syst\u00e9mu.<\/p>\n\n\n\n

            S roz\u0161i\u0159ov\u00e1n\u00edm v\u00fdpo\u010detn\u00ed techniky s um\u011blou inteligenc\u00ed, zvy\u0161ov\u00e1n\u00edm \u0161\u00ed\u0159ky p\u00e1sma optick\u00e9 komunikace a dal\u0161\u00edm v\u00fdvojem v\u00fdkonov\u00e9 elektroniky se technologie substr\u00e1t\u016f st\u00e1vaj\u00ed sp\u00ed\u0161e strategickou infrastrukturou ne\u017e pasivn\u00edmi podp\u016frn\u00fdmi sou\u010d\u00e1stmi.<\/p>\n\n\n\n

            Keramick\u00e9 substr\u00e1ty maj\u00ed jedine\u010dn\u00e9 postaven\u00ed d\u00edky t\u0159em rozhoduj\u00edc\u00edm p\u0159ednostem:<\/p>\n\n\n\n

              \n
            • vysok\u00e1 tepeln\u00e1 vodivost<\/li>\n\n\n\n
            • n\u00edzk\u00e9 dielektrick\u00e9 ztr\u00e1ty<\/li>\n\n\n\n
            • kompatibilita s tepelnou rozta\u017enost\u00ed<\/li>\n<\/ul>\n\n\n\n

              D\u00edky t\u011bmto vlastnostem jsou pro budouc\u00ed obalov\u00e9 ekosyst\u00e9my st\u00e1le d\u016fle\u017eit\u011bj\u0161\u00ed.<\/p>\n\n\n\n

              V nadch\u00e1zej\u00edc\u00edch letech se technologie keramick\u00fdch substr\u00e1t\u016f mohou st\u00e1t jedn\u00edm z nejvlivn\u011bj\u0161\u00edch materi\u00e1lov\u00fdch posun\u016f ve v\u00fdrob\u011b polovodi\u010d\u016f, kter\u00fd umo\u017en\u00ed p\u0159\u00ed\u0161t\u00ed generaci v\u00fdpo\u010detn\u00edch, komunika\u010dn\u00edch a energetick\u00fdch syst\u00e9m\u016f.<\/p>","protected":false},"excerpt":{"rendered":"

              As artificial intelligence computing accelerates, data transmission speeds increase, and next-generation power electronics continue to evolve, semiconductor packaging technologies are undergoing a fundamental transformation. Conventional substrate materials are increasingly facing limitations in thermal management, electrical performance, and integration density. Against this backdrop, ceramic substrates are emerging from niche applications to become critical enabling materials for […]<\/p>\n","protected":false},"author":1,"featured_media":2190,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[3],"tags":[274,277,102,272,275,276,273,76,78,250,94],"class_list":["post-2189","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-advanced-packaging","tag-ai-computing","tag-aluminum-nitride","tag-ceramic-substrate","tag-hbm","tag-optical-modules","tag-power-semiconductor","tag-semiconductor-packaging","tag-silicon-carbide","tag-silicon-nitride","tag-thermal-management"],"_links":{"self":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts\/2189","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/comments?post=2189"}],"version-history":[{"count":2,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts\/2189\/revisions"}],"predecessor-version":[{"id":2192,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts\/2189\/revisions\/2192"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/media\/2190"}],"wp:attachment":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/media?parent=2189"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/categories?post=2189"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/tags?post=2189"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}