{"id":2189,"date":"2026-05-15T05:15:54","date_gmt":"2026-05-15T05:15:54","guid":{"rendered":"https:\/\/www.xkh-ceramics.com\/?p=2189"},"modified":"2026-05-15T05:18:49","modified_gmt":"2026-05-15T05:18:49","slug":"ceramic-substrates-the-core-material-revolution-powering-ai-computing-optical-modules-and-power-semiconductors","status":"publish","type":"post","link":"https:\/\/www.xkh-ceramics.com\/cs\/ceramic-substrates-the-core-material-revolution-powering-ai-computing-optical-modules-and-power-semiconductors\/","title":{"rendered":"Keramick\u00e9 substr\u00e1ty: Z\u00e1kladn\u00ed materi\u00e1lov\u00e1 revoluce poh\u00e1n\u011bj\u00edc\u00ed v\u00fdpo\u010detn\u00ed techniku s um\u011blou inteligenc\u00ed, optick\u00e9 moduly a v\u00fdkonov\u00e9 polovodi\u010de"},"content":{"rendered":"

S t\u00edm, jak se zrychluje v\u00fdpo\u010detn\u00ed technika um\u011bl\u00e9 inteligence, zvy\u0161uje se rychlost p\u0159enosu dat a vyv\u00edj\u00ed se v\u00fdkonov\u00e1 elektronika nov\u00e9 generace, proch\u00e1zej\u00ed obalov\u00e9 technologie polovodi\u010d\u016f z\u00e1sadn\u00ed prom\u011bnou. B\u011b\u017en\u00e9 substr\u00e1tov\u00e9 materi\u00e1ly se st\u00e1le v\u00edce pot\u00fdkaj\u00ed s omezen\u00edmi v oblasti tepeln\u00e9 spr\u00e1vy, elektrick\u00e9ho v\u00fdkonu a hustoty integrace. V t\u00e9to souvislosti se keramick\u00e9 substr\u00e1ty st\u00e1vaj\u00ed z v\u00fdklenkov\u00fdch aplikac\u00ed rozhoduj\u00edc\u00edmi materi\u00e1ly pro budouc\u00ed polovodi\u010dov\u00e9 syst\u00e9my.<\/p>\n\n\n\n

Od akceler\u00e1tor\u016f um\u011bl\u00e9 inteligence a balen\u00ed pam\u011bt\u00ed s vysokou \u0161\u00ed\u0159kou p\u00e1sma (HBM) a\u017e po ultrarychl\u00e9 optick\u00e9 moduly a v\u00fdkonov\u00e9 polovodi\u010dov\u00e9 sou\u010d\u00e1stky, keramick\u00e9 substr\u00e1ty<\/a> jsou dnes pova\u017eov\u00e1ny za jeden z kl\u00ed\u010dov\u00fdch z\u00e1klad\u016f pokro\u010dil\u00e9 elektronick\u00e9 architektury.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

Pro\u010d jsou keramick\u00e9 substr\u00e1ty d\u016fle\u017eit\u00e9<\/h2>\n\n\n\n

Substr\u00e1ty slou\u017e\u00ed jako struktur\u00e1ln\u00ed a elektrick\u00e1 platforma spojuj\u00edc\u00ed \u010dipy, propojen\u00ed a obalov\u00e9 syst\u00e9my. V minulosti v tomto odv\u011btv\u00ed p\u0159evl\u00e1daly organick\u00e9 substr\u00e1ty a interposery na b\u00e1zi k\u0159em\u00edku. Rychl\u00fd n\u00e1r\u016fst hustoty v\u00fdkonu a slo\u017eitosti sign\u00e1lu v\u0161ak odhaluje jejich omezen\u00ed.<\/p>\n\n\n\n

Keramick\u00e9 substr\u00e1ty maj\u00ed n\u011bkolik jedine\u010dn\u00fdch v\u00fdhod:<\/p>\n\n\n\n

Vynikaj\u00edc\u00ed tepeln\u00e1 vodivost<\/h3>\n\n\n\n

Modern\u00ed procesory um\u011bl\u00e9 inteligence a vysoce v\u00fdkonn\u00e9 v\u00fdpo\u010detn\u00ed syst\u00e9my generuj\u00ed obrovskou tepelnou z\u00e1t\u011b\u017e. Tepeln\u00e9 p\u0159ek\u00e1\u017eky mohou p\u0159\u00edmo omezovat v\u00fdkon a spolehlivost.<\/p>\n\n\n\n

Mnoho pokro\u010dil\u00fdch keramick\u00fdch materi\u00e1l\u016f - v\u010detn\u011b nitridu hlin\u00edku (AlN), karbidu k\u0159em\u00edku (SiC) a nitridu k\u0159em\u00edku (Si\u2083N\u2084) - poskytuje v\u00fdrazn\u011b vy\u0161\u0161\u00ed tepelnou vodivost ne\u017e tradi\u010dn\u00ed organick\u00e9 materi\u00e1ly. \u00da\u010dinn\u00fd odvod tepla pom\u00e1h\u00e1 udr\u017eovat stabilitu za\u0159\u00edzen\u00ed a podporuje trval\u00fd provoz za podm\u00ednek vysok\u00e9ho v\u00fdkonu.<\/p>\n\n\n\n

N\u00edzk\u00e9 dielektrick\u00e9 ztr\u00e1ty pro vysokofrekven\u010dn\u00ed p\u0159enosy<\/h3>\n\n\n\n

S rozvojem optick\u00fdch komunika\u010dn\u00edch technologi\u00ed sm\u011brem k ultravysok\u00e9 \u0161\u00ed\u0159ce p\u00e1sma a vy\u0161\u0161\u00edm frekvenc\u00edm je integrita sign\u00e1lu st\u00e1le d\u016fle\u017eit\u011bj\u0161\u00ed.<\/p>\n\n\n\n

Keramick\u00e9 substr\u00e1ty maj\u00ed n\u00edzk\u00e9 dielektrick\u00e9 konstanty a n\u00edzk\u00e9 dielektrick\u00e9 ztr\u00e1ty, co\u017e sni\u017euje \u00fatlum sign\u00e1lu a zvy\u0161uje \u00fa\u010dinnost p\u0159enosu. D\u00edky t\u011bmto vlastnostem jsou velmi atraktivn\u00ed pro optick\u00e9 komunika\u010dn\u00ed obaly nov\u00e9 generace a pokro\u010dil\u00e9 syst\u00e9my um\u011bl\u00e9 inteligence.<\/p>\n\n\n\n

P\u0159esn\u00e9 p\u0159izp\u016fsoben\u00ed tepeln\u00e9 rozta\u017enosti<\/h3>\n\n\n\n

Nesoulad koeficient\u016f tepeln\u00e9 rozta\u017enosti mezi materi\u00e1ly substr\u00e1tu a polovodi\u010dov\u00fdmi \u010dipy m\u016f\u017ee p\u0159i opakovan\u00e9m tepeln\u00e9m cyklov\u00e1n\u00ed zp\u016fsobit mechanick\u00e9 nam\u00e1h\u00e1n\u00ed.<\/p>\n\n\n\n

Keramick\u00e9 materi\u00e1ly poskytuj\u00ed tepeln\u011b rozta\u017en\u00e9 vlastnosti, kter\u00e9 se l\u00e9pe shoduj\u00ed s polovodi\u010dov\u00fdmi materi\u00e1ly, co\u017e sni\u017euje nam\u00e1h\u00e1n\u00ed obal\u016f a zvy\u0161uje dlouhodobou spolehlivost.<\/p>\n\n\n\n

Vy\u0161\u0161\u00ed potenci\u00e1l hustoty propojen\u00ed<\/h3>\n\n\n\n

Pokro\u010dil\u00e9 balen\u00ed vy\u017eaduje st\u00e1le v\u011bt\u0161\u00ed \u0161\u00ed\u0159ku linek a v\u011bt\u0161\u00ed hustotu integrace. Keramick\u00e9 substr\u00e1ty mohou podporovat sofistikovan\u011bj\u0161\u00ed architektury propojen\u00ed, co\u017e umo\u017e\u0148uje vy\u0161\u0161\u00ed \u00farove\u0148 integrace \u010dip\u016f a men\u0161\u00ed rozm\u011bry balen\u00ed.<\/p>\n\n\n\n

S rostouc\u00ed slo\u017eitost\u00ed obal\u016f se technologie substr\u00e1tu st\u00e1v\u00e1 rozhoduj\u00edc\u00edm faktorem pro celkov\u00fd v\u00fdkon syst\u00e9mu.<\/p>\n\n\n\n

AI Computing m\u011bn\u00ed po\u017eadavky na balen\u00ed<\/h2>\n\n\n\n

Explozivn\u00ed r\u016fst pracovn\u00edch z\u00e1t\u011b\u017e\u00ed s um\u011blou inteligenc\u00ed v\u00fdrazn\u011b zv\u00fd\u0161il n\u00e1roky na v\u00fdpo\u010detn\u00ed v\u00fdkon a \u0161\u00ed\u0159ku pam\u011b\u0165ov\u00e9ho p\u00e1sma.<\/p>\n\n\n\n

Nov\u00e9 obalov\u00e9 architektury vy\u017eaduj\u00ed:<\/p>\n\n\n\n

    \n
  • V\u011bt\u0161\u00ed velikosti balen\u00ed<\/li>\n\n\n\n
  • Vy\u0161\u0161\u00ed po\u010det vstup\u016f\/v\u00fdstup\u016f<\/li>\n\n\n\n
  • Zlep\u0161en\u00e9 tepeln\u00e9 \u0159\u00edzen\u00ed<\/li>\n\n\n\n
  • Ni\u017e\u0161\u00ed latence sign\u00e1lu<\/li>\n\n\n\n
  • Vy\u0161\u0161\u00ed hustota integrace<\/li>\n<\/ul>\n\n\n\n

    Tradi\u010dn\u00ed obalov\u00e1 \u0159e\u0161en\u00ed se bl\u00ed\u017e\u00ed sv\u00fdm fyzick\u00fdm limit\u016fm. O\u010dek\u00e1v\u00e1 se, \u017ee budouc\u00ed syst\u00e9my um\u011bl\u00e9 inteligence budou st\u00e1le v\u00edce z\u00e1viset na pokro\u010dil\u00fdch substr\u00e1tov\u00fdch technologi\u00edch schopn\u00fdch podporovat rozs\u00e1hlou heterogenn\u00ed integraci.<\/p>\n\n\n\n

    Keramick\u00e9 substr\u00e1ty se st\u00e1vaj\u00ed nezbytn\u00fdmi, proto\u017ee sou\u010dasn\u011b \u0159e\u0161\u00ed elektrick\u00e9, tepeln\u00e9 a mechanick\u00e9 probl\u00e9my.<\/p>\n\n\n\n

    V mnoha koncepc\u00edch obal\u016f nov\u00e9 generace um\u011bl\u00e9 inteligence se m\u011bn\u00ed z voliteln\u00fdch prvk\u016f zvy\u0161uj\u00edc\u00edch v\u00fdkon na nepostradatelnou infrastrukturu.<\/p>\n\n\n\n

    Keramick\u00e9 substr\u00e1ty a v\u00fdvoj optick\u00fdch modul\u016f<\/h2>\n\n\n\n

    Dal\u0161\u00edm v\u00fdznamn\u00fdm faktorem je rychl\u00fd p\u0159echod na ultra vysokorychlostn\u00ed optick\u00e9 komunika\u010dn\u00ed syst\u00e9my.<\/p>\n\n\n\n

    Budouc\u00ed optick\u00e9 moduly pro datov\u00e1 centra a klastry um\u011bl\u00e9 inteligence vy\u017eaduj\u00ed:<\/p>\n\n\n\n

      \n
    • Rychlej\u0161\u00ed p\u0159enosov\u00e9 rychlosti<\/li>\n\n\n\n
    • Ni\u017e\u0161\u00ed vlo\u017en\u00fd \u00fatlum<\/li>\n\n\n\n
    • Sn\u00ed\u017een\u00e1 spot\u0159eba energie<\/li>\n\n\n\n
    • Lep\u0161\u00ed tepeln\u00e1 stabilita<\/li>\n<\/ul>\n\n\n\n

      P\u0159i p\u0159enosov\u00fdch rychlostech sm\u011b\u0159uj\u00edc\u00edch k v\u00edceterabitov\u00fdm architektur\u00e1m m\u016f\u017ee i mal\u00e1 degradace sign\u00e1lu ovlivnit celkovou \u00fa\u010dinnost syst\u00e9mu.<\/p>\n\n\n\n

      Keramick\u00e9 substr\u00e1ty nab\u00edzej\u00ed:<\/p>\n\n\n\n

        \n
      • vynikaj\u00edc\u00ed rozm\u011brov\u00e1 stabilita<\/li>\n\n\n\n
      • n\u00edzk\u00e9 vysokofrekven\u010dn\u00ed ztr\u00e1ty<\/li>\n\n\n\n
      • lep\u0161\u00ed schopnost odvodu tepla<\/li>\n\n\n\n
      • dlouhodob\u00e1 spolehlivost p\u0159i tepeln\u00e9m nam\u00e1h\u00e1n\u00ed<\/li>\n<\/ul>\n\n\n\n

        Tyto vlastnosti stav\u00ed keramiku do pozice siln\u00e9ho kandid\u00e1ta pro optick\u00e9 obalov\u00e9 platformy p\u0159\u00ed\u0161t\u00ed generace.<\/p>\n\n\n\n

        Pokra\u010duj\u00edc\u00ed roz\u0161i\u0159ov\u00e1n\u00ed aplikac\u00ed v\u00fdkonov\u00fdch polovodi\u010d\u016f<\/h2>\n\n\n\n

        Do nov\u00e9 \u00e9ry vstupuje tak\u00e9 v\u00fdkonov\u00e1 elektronika.<\/p>\n\n\n\n

        Elektromobily, syst\u00e9my obnoviteln\u00fdch zdroj\u016f energie, pr\u016fmyslov\u00e1 automatizace a vysokonap\u011b\u0165ov\u00e9 aplikace se st\u00e1le v\u00edce spol\u00e9haj\u00ed na \u0161irokop\u00e1smov\u00e9 polovodi\u010de.<\/p>\n\n\n\n

        Tato za\u0159\u00edzen\u00ed pracuj\u00ed pod:<\/p>\n\n\n\n

          \n
        • vy\u0161\u0161\u00ed nap\u011bt\u00ed<\/li>\n\n\n\n
        • vy\u0161\u0161\u00ed sp\u00ednac\u00ed frekvence<\/li>\n\n\n\n
        • zv\u00fd\u0161en\u00e9 teploty<\/li>\n\n\n\n
        • n\u00e1ro\u010dn\u00e9 podm\u00ednky tepeln\u00e9ho cyklov\u00e1n\u00ed<\/li>\n<\/ul>\n\n\n\n

          Keramick\u00e9 substr\u00e1ty ji\u017e hraj\u00ed kl\u00ed\u010dovou roli v mnoha v\u00fdkonov\u00fdch modulech, proto\u017ee kombinuj\u00ed:<\/p>\n\n\n\n

            \n
          • elektrick\u00e1 izolace<\/li>\n\n\n\n
          • mechanick\u00e1 pevnost<\/li>\n\n\n\n
          • tepeln\u00e1 vodivost<\/li>\n\n\n\n
          • spolehlivost v n\u00e1ro\u010dn\u00fdch podm\u00ednk\u00e1ch<\/li>\n<\/ul>\n\n\n\n

            S rostouc\u00ed hustotou v\u00fdkonu se o\u010dek\u00e1v\u00e1 je\u0161t\u011b v\u011bt\u0161\u00ed v\u00fdznam substr\u00e1tov\u00fdch struktur na b\u00e1zi keramiky.<\/p>\n\n\n\n

            Materi\u00e1lov\u00e9 platformy ur\u010duj\u00edc\u00ed budouc\u00ed v\u00fdvoj<\/h2>\n\n\n\n

            Rostouc\u00ed pozornost p\u0159itahuje n\u011bkolik keramick\u00fdch materi\u00e1l\u016f:<\/p>\n\n\n\n

            Materi\u00e1l<\/th>Kl\u00ed\u010dov\u00e9 charakteristiky<\/th>Typick\u00e9 aplikace<\/th><\/tr><\/thead>
            Hlin\u00edk (Al\u2082O\u2083)<\/td>N\u00e1kladov\u011b efektivn\u00ed, dobr\u00e1 izolace<\/td>Obecn\u00e9 elektronick\u00e9 obaly<\/td><\/tr>
            Nitrid hlin\u00edku (AlN)<\/td>Vysok\u00e1 tepeln\u00e1 vodivost<\/td>Vysoce v\u00fdkonn\u00e1 elektronika<\/td><\/tr>
            Nitrid k\u0159em\u00edku (Si\u2083N\u2084)<\/td>Vysok\u00e1 mechanick\u00e1 pevnost<\/td>Automobilov\u00e9 a v\u00fdkonov\u00e9 moduly<\/td><\/tr>
            Karbid k\u0159em\u00edku (SiC)<\/td>Odolnost v\u016f\u010di extr\u00e9mn\u00edm teplot\u00e1m<\/td>Pokro\u010dil\u00fd tepeln\u00fd management<\/td><\/tr>
            Zirkonov\u00e1 keramika<\/td>Vysok\u00e1 hou\u017eevnatost<\/td>Specializovan\u00e9 konstruk\u010dn\u00ed aplikace<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

            Ka\u017ed\u00fd materi\u00e1l nab\u00edz\u00ed jinou rovnov\u00e1hu tepeln\u00fdch, elektrick\u00fdch a mechanick\u00fdch vlastnost\u00ed, co\u017e konstrukt\u00e9r\u016fm umo\u017e\u0148uje optimalizovat v\u00fdb\u011br substr\u00e1tu podle pot\u0159eb aplikace.<\/p>\n\n\n\n

            V\u00fdhled do budoucna: Od podp\u016frn\u00e9ho materi\u00e1lu ke strategick\u00e9 technologii<\/h2>\n\n\n\n

            Polovodi\u010dov\u00fd pr\u016fmysl vstupuje do f\u00e1ze, kdy inovace materi\u00e1l\u016f st\u00e1le v\u00edce ur\u010duj\u00ed schopnosti syst\u00e9mu.<\/p>\n\n\n\n

            S roz\u0161i\u0159ov\u00e1n\u00edm v\u00fdpo\u010detn\u00ed techniky s um\u011blou inteligenc\u00ed, zvy\u0161ov\u00e1n\u00edm \u0161\u00ed\u0159ky p\u00e1sma optick\u00e9 komunikace a dal\u0161\u00edm v\u00fdvojem v\u00fdkonov\u00e9 elektroniky se technologie substr\u00e1t\u016f st\u00e1vaj\u00ed sp\u00ed\u0161e strategickou infrastrukturou ne\u017e pasivn\u00edmi podp\u016frn\u00fdmi sou\u010d\u00e1stmi.<\/p>\n\n\n\n

            Keramick\u00e9 substr\u00e1ty maj\u00ed jedine\u010dn\u00e9 postaven\u00ed d\u00edky t\u0159em rozhoduj\u00edc\u00edm p\u0159ednostem:<\/p>\n\n\n\n

              \n
            • vysok\u00e1 tepeln\u00e1 vodivost<\/li>\n\n\n\n
            • n\u00edzk\u00e9 dielektrick\u00e9 ztr\u00e1ty<\/li>\n\n\n\n
            • kompatibilita s tepelnou rozta\u017enost\u00ed<\/li>\n<\/ul>\n\n\n\n

              D\u00edky t\u011bmto vlastnostem jsou pro budouc\u00ed obalov\u00e9 ekosyst\u00e9my st\u00e1le d\u016fle\u017eit\u011bj\u0161\u00ed.<\/p>\n\n\n\n

              V nadch\u00e1zej\u00edc\u00edch letech se technologie keramick\u00fdch substr\u00e1t\u016f mohou st\u00e1t jedn\u00edm z nejvlivn\u011bj\u0161\u00edch materi\u00e1lov\u00fdch posun\u016f ve v\u00fdrob\u011b polovodi\u010d\u016f, kter\u00fd umo\u017en\u00ed p\u0159\u00ed\u0161t\u00ed generaci v\u00fdpo\u010detn\u00edch, komunika\u010dn\u00edch a energetick\u00fdch syst\u00e9m\u016f.<\/p>","protected":false},"excerpt":{"rendered":"

              As artificial intelligence computing accelerates, data transmission speeds increase, and next-generation power electronics continue to evolve, semiconductor packaging technologies are undergoing a fundamental transformation. Conventional substrate materials are increasingly facing […]<\/p>\n","protected":false},"author":1,"featured_media":2190,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[3],"tags":[274,277,102,272,275,276,273,76,78,250,94],"class_list":["post-2189","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-advanced-packaging","tag-ai-computing","tag-aluminum-nitride","tag-ceramic-substrate","tag-hbm","tag-optical-modules","tag-power-semiconductor","tag-semiconductor-packaging","tag-silicon-carbide","tag-silicon-nitride","tag-thermal-management"],"_links":{"self":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts\/2189","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/comments?post=2189"}],"version-history":[{"count":2,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts\/2189\/revisions"}],"predecessor-version":[{"id":2192,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts\/2189\/revisions\/2192"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/media\/2190"}],"wp:attachment":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/media?parent=2189"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/categories?post=2189"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/tags?post=2189"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}