{"id":2036,"date":"2026-05-08T05:18:41","date_gmt":"2026-05-08T05:18:41","guid":{"rendered":"https:\/\/www.xkh-ceramics.com\/?p=2036"},"modified":"2026-05-08T05:19:21","modified_gmt":"2026-05-08T05:19:21","slug":"advanced-ceramic-components-in-semiconductor-manufacturing-electrostatic-chuck-principles-and-trends","status":"publish","type":"post","link":"https:\/\/www.xkh-ceramics.com\/cs\/advanced-ceramic-components-in-semiconductor-manufacturing-electrostatic-chuck-principles-and-trends\/","title":{"rendered":"Pokro\u010dil\u00e9 keramick\u00e9 komponenty ve v\u00fdrob\u011b polovodi\u010d\u016f: Principy a trendy elektrostatick\u00e9ho skl\u00ed\u010didla"},"content":{"rendered":"<h2 class=\"wp-block-heading\">1. \u00davod: \u00daloha pokro\u010dil\u00e9 keramiky v polovodi\u010dov\u00fdch za\u0159\u00edzen\u00edch<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">V modern\u00ed v\u00fdrob\u011b polovodi\u010d\u016f pracuj\u00ed za\u0159\u00edzen\u00ed v extr\u00e9mn\u00edch podm\u00ednk\u00e1ch, jako je vakuov\u00e9 prost\u0159ed\u00ed, vysok\u00e9 teploty, p\u016fsoben\u00ed plazmatu a velmi p\u0159esn\u00e9 \u0159\u00edzen\u00ed pohybu. Tradi\u010dn\u00ed kovov\u00e9 materi\u00e1ly \u010dasto nespl\u0148uj\u00ed kombinovan\u00e9 po\u017eadavky na stabilitu, \u010distotu, elektrickou izolaci a tepeln\u00fd management.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Pokro\u010dil\u00e1 technick\u00e1 keramika - jako je oxid hlinit\u00fd (Al\u2082O\u2083), nitrid hlin\u00edku (AlN) a karbid k\u0159em\u00edku (SiC) - se proto stala z\u00e1kladn\u00edm materi\u00e1lem pro kritick\u00e9 polovodi\u010dov\u00e9 sou\u010d\u00e1stky. Po p\u0159esn\u00e9m tvarov\u00e1n\u00ed a velmi p\u0159esn\u00e9m obr\u00e1b\u011bn\u00ed se tato keramika \u0161iroce pou\u017e\u00edv\u00e1 v kl\u00ed\u010dov\u00fdch technologick\u00fdch za\u0159\u00edzen\u00edch v\u010detn\u011b litografie, lept\u00e1n\u00ed, nan\u00e1\u0161en\u00ed tenk\u00fdch vrstev, iontov\u00e9 implantace a chemick\u00e9 mechanick\u00e9 planarizace (CMP).<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Mezi t\u011bmito sou\u010d\u00e1stmi p\u0159edstavuje elektrostatick\u00e9 skl\u00ed\u010didlo (ESC) jedno z nejd\u016fle\u017eit\u011bj\u0161\u00edch funk\u010dn\u00edch za\u0159\u00edzen\u00ed na b\u00e1zi keramiky.<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"426\" height=\"238\" src=\"https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Electrostatic-Chuck-Principles-and-Trends-1.png\" alt=\"\" class=\"wp-image-2038\" srcset=\"https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Electrostatic-Chuck-Principles-and-Trends-1.png 426w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Electrostatic-Chuck-Principles-and-Trends-1-300x168.png 300w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Electrostatic-Chuck-Principles-and-Trends-1-18x10.png 18w\" sizes=\"(max-width: 426px) 100vw, 426px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">2. Funkce a pou\u017eit\u00ed elektrostatick\u00fdch skl\u00ed\u010didel<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">. <a href=\"https:\/\/www.xkh-ceramics.com\/cs\/produkty\/\" data-type=\"page\" data-id=\"1921\">elektrostatick\u00e9 skl\u00ed\u010didlo<\/a> je za\u0159\u00edzen\u00ed pro manipulaci a dr\u017een\u00ed desti\u010dek ur\u010den\u00e9 pro vakuov\u00e9 nebo plazmov\u00e9 prost\u0159ed\u00ed. Umo\u017e\u0148uje stabiln\u00ed a rovnom\u011brn\u00e9 upnut\u00ed ultratenk\u00fdch polovodi\u010dov\u00fdch desti\u010dek bez mechanick\u00e9ho kontaktu.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Je \u0161iroce pou\u017e\u00edv\u00e1n v pokro\u010dil\u00fdch polovodi\u010dov\u00fdch procesech, jako jsou:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Plazmov\u00e9 lept\u00e1n\u00ed (ETCH)<\/li>\n\n\n\n<li>Fyzik\u00e1ln\u00ed napa\u0159ov\u00e1n\u00ed (PVD)<\/li>\n\n\n\n<li>Plazmou zes\u00edlen\u00e9 chemick\u00e9 napa\u0159ov\u00e1n\u00ed (PECVD)<\/li>\n\n\n\n<li>Extr\u00e9mn\u00ed ultrafialov\u00e1 litografie (EUVL)<\/li>\n\n\n\n<li>Iontov\u00e1 implantace<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">P\u0159i t\u011bchto procesech jsou desti\u010dky vystaveny energetick\u00fdm \u010d\u00e1stic\u00edm a tepeln\u00e9mu zat\u00ed\u017een\u00ed. Elektrostatick\u00e9 skl\u00ed\u010didlo proto mus\u00ed zajistit jak mechanickou stabilitu, tak p\u0159esnou tepelnou regulaci.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">3. Princip \u010dinnosti: elektrostatick\u00e1 s\u00edla a tepeln\u00fd management<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Elektrostatick\u00e9 skl\u00ed\u010didlo funguje na z\u00e1klad\u011b elektrostatick\u00e9 p\u0159ita\u017elivosti generovan\u00e9 elektrick\u00fdm polem. Protib\u011b\u017en\u011b nabit\u00e9 povrchy vytv\u00e1\u0159ej\u00ed p\u0159ita\u017elivou s\u00edlu, kter\u00e1 bezpe\u010dn\u011b dr\u017e\u00ed desti\u010dku na m\u00edst\u011b.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Z\u00e1kladn\u00ed elektrostatickou interakci lze popsat jako:<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><math xmlns=\"http:\/\/www.w3.org\/1998\/Math\/MathML\"><semantics><mrow><mi>F<\/mi><mo>=<\/mo><mi>k<\/mi><mfrac><mrow><msub><mi>q<\/mi><mn>1<\/mn><\/msub><msub><mi>q<\/mi><mn>2<\/mn><\/msub><\/mrow><msup><mi>r<\/mi><mn>2<\/mn><\/msup><\/mfrac><\/mrow><annotation encoding=\"application\/x-tex\">F = k \\frac{q_1 q_2}{r^2}<\/annotation><\/semantics><\/math>F=kr2q1q2<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><math xmlns=\"http:\/\/www.w3.org\/1998\/Math\/MathML\"><semantics><mrow><msub><mi>q<\/mi><mn>1<\/mn><\/msub><\/mrow><annotation encoding=\"application\/x-tex\">q_1<\/annotation><\/semantics><\/math>q1<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><math xmlns=\"http:\/\/www.w3.org\/1998\/Math\/MathML\"><semantics><mrow><msub><mi>q<\/mi><mn>2<\/mn><\/msub><\/mrow><annotation encoding=\"application\/x-tex\">q_2<\/annotation><\/semantics><\/math>q2<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><math xmlns=\"http:\/\/www.w3.org\/1998\/Math\/MathML\"><semantics><mrow><mi>r<\/mi><\/mrow><annotation encoding=\"application\/x-tex\">r<\/annotation><\/semantics><\/math>r<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><math xmlns=\"http:\/\/www.w3.org\/1998\/Math\/MathML\"><semantics><mrow><mi>F<\/mi><mo>=<\/mo><mi>k<\/mi><mfrac><mrow><msub><mi>q<\/mi><mn>1<\/mn><\/msub><msub><mi>q<\/mi><mn>2<\/mn><\/msub><\/mrow><msup><mi>r<\/mi><mn>2<\/mn><\/msup><\/mfrac><mo>\u2248<\/mo><mo>\u2212<\/mo><mn>5.06<\/mn><\/mrow><annotation encoding=\"application\/x-tex\">F = k\\frac{q_1 q_2}{r^2} \\p\u0159ibli\u017en\u011b -5,06<\/annotation><\/semantics><\/math>F=kr2q1q2\u2248-5,06+-<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Kde:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><math xmlns=\"http:\/\/www.w3.org\/1998\/Math\/MathML\"><semantics><mrow><mi>F<\/mi><\/mrow><annotation encoding=\"application\/x-tex\">F<\/annotation><\/semantics><\/math>F: elektrostatick\u00e1 s\u00edla<\/li>\n\n\n\n<li><math xmlns=\"http:\/\/www.w3.org\/1998\/Math\/MathML\"><semantics><mrow><msub><mi>q<\/mi><mn>1<\/mn><\/msub><mo separator=\"true\">,<\/mo><msub><mi>q<\/mi><mn>2<\/mn><\/msub><\/mrow><annotation encoding=\"application\/x-tex\">q_1, q_2<\/annotation><\/semantics><\/math>q1,q2: elektrick\u00e9 n\u00e1boje<\/li>\n\n\n\n<li><math xmlns=\"http:\/\/www.w3.org\/1998\/Math\/MathML\"><semantics><mrow><mi>r<\/mi><\/mrow><annotation encoding=\"application\/x-tex\">r<\/annotation><\/semantics><\/math>r: vzd\u00e1lenost mezi n\u00e1boji<\/li>\n\n\n\n<li><math xmlns=\"http:\/\/www.w3.org\/1998\/Math\/MathML\"><semantics><mrow><mi>k<\/mi><\/mrow><annotation encoding=\"application\/x-tex\">k<\/annotation><\/semantics><\/math>k: Coulombova konstanta<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Konstruk\u010dn\u011b se elektrostatick\u00e9 skl\u00ed\u010didlo obvykle skl\u00e1d\u00e1 ze t\u0159\u00ed vrstev:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Dielektrick\u00e1 vrstva<\/strong>: definuje izolaci a rozlo\u017een\u00ed elektrick\u00e9ho pole<\/li>\n\n\n\n<li><strong>Vrstva elektrod<\/strong>: vytv\u00e1\u0159\u00ed elektrostatick\u00e9 pole<\/li>\n\n\n\n<li><strong>Z\u00e1kladn\u00ed vrstva<\/strong>: poskytuje mechanickou oporu a veden\u00ed tepla<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Pro zvl\u00e1dnut\u00ed tepeln\u00e9 z\u00e1t\u011b\u017ee b\u011bhem zpracov\u00e1n\u00ed se b\u011b\u017en\u011b zav\u00e1d\u00ed chlazen\u00ed heliovou zadn\u00ed stranou, kter\u00e9 zlep\u0161uje p\u0159enos tepla mezi desti\u010dkou a povrchem skl\u00ed\u010didla.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">4. Klasifikace: Coulomb\u016fv typ a Johnsen\u016fv-Rahbek\u016fv typ ESC<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Elektrostatick\u00e1 skl\u00ed\u010didla se obecn\u011b d\u011bl\u00ed na dva typy podle jejich dielektrick\u00e9ho chov\u00e1n\u00ed:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">(1) Coulomb\u016fv typ ESC<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Tento typ se p\u0159i up\u00edn\u00e1n\u00ed desti\u010dek spol\u00e9h\u00e1 v\u00fdhradn\u011b na elektrostatickou s\u00edlu. M\u00e1 jednodu\u0161\u0161\u00ed konstrukci, ale poskytuje relativn\u011b ni\u017e\u0161\u00ed up\u00ednac\u00ed s\u00edlu.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">(2) ESC typu Johnsen-Rahbek (J-R)<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Tento typ vn\u00e1\u0161\u00ed do dielektrick\u00e9 vrstvy m\u00edrnou elektrickou vodivost, \u010d\u00edm\u017e zvy\u0161uje polariza\u010dn\u00ed \u00fa\u010dinky a zvy\u0161uje up\u00ednac\u00ed s\u00edlu.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Mezi hlavn\u00ed v\u00fdhody pat\u0159\u00ed:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Vy\u0161\u0161\u00ed sv\u011brn\u00e1 s\u00edla p\u0159i ni\u017e\u0161\u00edm nap\u011bt\u00ed<\/li>\n\n\n\n<li>Zlep\u0161en\u00e1 stabilita kontakt\u016f s desti\u010dkami<\/li>\n\n\n\n<li>Lep\u0161\u00ed v\u00fdkon v pokro\u010dil\u00fdch polovodi\u010dov\u00fdch uzlech<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Vy\u017eaduje v\u0161ak vy\u0161\u0161\u00ed rovnom\u011brnost materi\u00e1lu a slo\u017eit\u011bj\u0161\u00ed v\u00fdrobn\u00ed procesy.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">5. V\u00fdvoj odv\u011btv\u00ed a charakteristika trhu<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Trh s elektrostatick\u00fdmi skl\u00ed\u010didly neust\u00e1le roste d\u00edky rychl\u00e9mu roz\u0161i\u0159ov\u00e1n\u00ed v\u00fdrobn\u00edch kapacit polovodi\u010d\u016f a rostouc\u00ed popt\u00e1vce po pokro\u010dil\u00fdch uzlech.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Mezi hlavn\u00ed charakteristiky odv\u011btv\u00ed pat\u0159\u00ed:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">(1) Vysok\u00e9 technologick\u00e9 p\u0159ek\u00e1\u017eky<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Tato technologie spojuje v\u011bdu o materi\u00e1lech, elektrotechniku, tepeln\u00fd management a velmi p\u0159esn\u00e9 obr\u00e1b\u011bn\u00ed.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">(2) Vysok\u00e1 koncentrace trhu<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Glob\u00e1ln\u00edmu trhu dominuje omezen\u00fd po\u010det vysp\u011bl\u00fdch v\u00fdrobc\u016f se siln\u00fdmi integra\u010dn\u00edmi schopnostmi.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">(3) Region\u00e1ln\u00ed specializace<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">\u0160pi\u010dkov\u00fd design a syst\u00e9mov\u00e1 integrace se soust\u0159e\u010fuj\u00ed do technologicky vysp\u011bl\u00fdch region\u016f, zat\u00edmco v\u00fdroba p\u0159esn\u00e9 keramiky se st\u00e1le v\u00edce p\u0159esouv\u00e1 do Asie.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">(4) Rostouc\u00ed trend lokalizace<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">S rozvojem dom\u00e1c\u00edch polovodi\u010dov\u00fdch ekosyst\u00e9m\u016f se za\u010dala objevovat lokalizovan\u00e1 v\u00fdroba elektrostatick\u00fdch skl\u00ed\u010didel, i kdy\u017e st\u00e1le p\u0159etrv\u00e1vaj\u00ed probl\u00e9my s dlouhodobou spolehlivost\u00ed a kompatibilitou \u0161pi\u010dkov\u00fdch proces\u016f.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">6. Kl\u00ed\u010dov\u00e9 materi\u00e1ly a budouc\u00ed v\u00fdvojov\u00e9 trendy<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Budouc\u00ed v\u00fdvoj elektrostatick\u00fdch skl\u00ed\u010didel a keramick\u00fdch komponent se zam\u011b\u0159\u00ed na:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">(1) Keramika s vysokou tepelnou vodivost\u00ed<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Zlep\u0161en\u00ed teplotn\u00ed rovnom\u011brnosti d\u00edky optimalizovan\u00fdm materi\u00e1l\u016fm AlN a SiC.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">(2) Velmi vysok\u00e1 \u010distota a n\u00edzk\u00e1 hustota defekt\u016f<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Sn\u00ed\u017een\u00ed ne\u010distot a mikrodefekt\u016f pro zv\u00fd\u0161en\u00ed odolnosti a stability plazmatu.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">(3) V\u00edcevrstv\u00e9 kompozitn\u00ed struktury<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Vyv\u00e1\u017een\u00ed elektrick\u00e9 izolace, mechanick\u00e9 pevnosti a tepeln\u00fdch vlastnost\u00ed.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">(4) Prodlou\u017een\u00e1 \u017eivotnost<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Zv\u00fd\u0161en\u00ed odolnosti proti tepeln\u00e9mu cyklov\u00e1n\u00ed a plazmov\u00e9 korozi pro sn\u00ed\u017een\u00ed \u010detnosti v\u00fdm\u011bny.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">7. Z\u00e1v\u011br<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Elektrostatick\u00e1 skl\u00ed\u010didla jako z\u00e1kladn\u00ed keramick\u00e9 funk\u010dn\u00ed sou\u010d\u00e1sti polovodi\u010dov\u00fdch za\u0159\u00edzen\u00ed v sob\u011b integruj\u00ed pokro\u010dilou materi\u00e1lovou v\u011bdu, elektrostatiku a tepeln\u00e9 in\u017een\u00fdrstv\u00ed. Jejich v\u00fdkon p\u0159\u00edmo ovliv\u0148uje p\u0159esnost zpracov\u00e1n\u00ed desti\u010dek a v\u00fdt\u011b\u017enost v\u00fdroby.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">S dal\u0161\u00edm v\u00fdvojem polovodi\u010dov\u00fdch proces\u016f sm\u011brem k vy\u0161\u0161\u00ed p\u0159esnosti a men\u0161\u00edm uzl\u016fm bude popt\u00e1vka po vysoce v\u00fdkonn\u00fdch keramick\u00fdch sou\u010d\u00e1stk\u00e1ch i nad\u00e1le r\u016fst, co\u017e bude podn\u011btem k neust\u00e1l\u00fdm inovac\u00edm v oblasti materi\u00e1l\u016f a v\u00fdrobn\u00edch technologi\u00ed.<\/p>","protected":false},"excerpt":{"rendered":"<p>1. Introduction: Role of Advanced Ceramics in Semiconductor Equipment In modern semiconductor manufacturing, equipment operates under extreme conditions such as vacuum environments, high temperatures, plasma exposure, and ultra-precision motion control. Traditional metallic materials often fail to meet the combined requirements of stability, cleanliness, electrical insulation, and thermal management. Advanced engineering ceramics\u2014such as alumina (Al\u2082O\u2083), aluminum [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":2038,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[3],"tags":[46,37,102,96,91,68,103,93,92,101,95,89,98,55,90,78,94,100,97,99],"class_list":["post-2036","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-advanced-ceramics","tag-alumina-ceramics","tag-aluminum-nitride","tag-coulomb-force","tag-dielectric-materials","tag-electrostatic-chuck","tag-esc","tag-etching-process","tag-helium-cooling","tag-ion-implantation","tag-johnsen-rahbek","tag-plasma-process","tag-precision-machining","tag-semiconductor","tag-semiconductor-equipment","tag-silicon-carbide","tag-thermal-management","tag-thin-film-deposition","tag-vacuum-environment","tag-wafer-handling"],"_links":{"self":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts\/2036","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/comments?post=2036"}],"version-history":[{"count":2,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts\/2036\/revisions"}],"predecessor-version":[{"id":2040,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/posts\/2036\/revisions\/2040"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/media\/2038"}],"wp:attachment":[{"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/media?parent=2036"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/categories?post=2036"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.xkh-ceramics.com\/cs\/wp-json\/wp\/v2\/tags?post=2036"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}