{"id":2100,"date":"2026-05-12T03:59:56","date_gmt":"2026-05-12T03:59:56","guid":{"rendered":"https:\/\/www.xkh-ceramics.com\/?post_type=product&#038;p=2100"},"modified":"2026-05-12T03:59:56","modified_gmt":"2026-05-12T03:59:56","slug":"customized-sic-ceramic-end-effector-for-wafer-handling","status":"publish","type":"product","link":"https:\/\/www.xkh-ceramics.com\/ar\/product\/customized-sic-ceramic-end-effector-for-wafer-handling\/","title":{"rendered":"Customized SiC Ceramic End Effector for Wafer Handling"},"content":{"rendered":"<p data-start=\"737\" data-end=\"989\"><img fetchpriority=\"high\" decoding=\"async\" class=\"size-medium wp-image-2101 alignright\" src=\"https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-3-300x300.png\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-3-300x300.png 300w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-3-150x150.png 150w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-3-768x768.png 768w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-3-12x12.png 12w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-3-600x600.png 600w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-3-100x100.png 100w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-3.png 1000w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>The Silicon Carbide (SiC) Ceramic End Effector is a high-precision wafer handling component designed for semiconductor automation systems, including wafer transfer robots, AMHS systems, EUV lithography equipment, and high-temperature process tools.<\/p>\n<p data-start=\"991\" data-end=\"1308\">Made from high-purity CVD SiC or engineered SSiC, this end effector delivers exceptional rigidity, ultra-low particle generation, and outstanding thermal and chemical stability. It is widely used in 300mm and advanced node semiconductor fabs, where contamination control and positioning accuracy are critical.<\/p>\n<p data-start=\"1310\" data-end=\"1470\">Compared with traditional aluminum or quartz end effectors, SiC ceramic solutions significantly improve process stability, wafer safety, and equipment lifetime.<\/p>\n<hr data-start=\"1472\" data-end=\"1475\" \/>\n<h2 data-section-id=\"ruuu6i\" data-start=\"1477\" data-end=\"1494\">Key Advantages<\/h2>\n<h3 data-section-id=\"1igp1it\" data-start=\"1496\" data-end=\"1532\">Ultra-Low Particle Contamination<\/h3>\n<ul data-start=\"1533\" data-end=\"1664\">\n<li data-section-id=\"1lx1qmw\" data-start=\"1533\" data-end=\"1587\">Particle generation: &lt;0.1\/cm\u00b2 (SEMI F57 compliant)<\/li>\n<li data-section-id=\"8gkyog\" data-start=\"1588\" data-end=\"1618\">No metal ion contamination<\/li>\n<li data-section-id=\"m28nyw\" data-start=\"1619\" data-end=\"1664\">Ideal for EUV and advanced node processes<\/li>\n<\/ul>\n<hr data-start=\"1666\" data-end=\"1669\" \/>\n<h3 data-section-id=\"nha58o\" data-start=\"1671\" data-end=\"1710\">High Rigidity &amp; Precision Stability<\/h3>\n<ul data-start=\"1711\" data-end=\"1837\">\n<li data-section-id=\"n58wtx\" data-start=\"1711\" data-end=\"1740\">Young\u2019s modulus: ~420 GPa<\/li>\n<li data-section-id=\"wiw01d\" data-start=\"1741\" data-end=\"1790\">Prevents vibration-induced wafer misalignment<\/li>\n<li data-section-id=\"kx1hzh\" data-start=\"1791\" data-end=\"1837\">Ensures stable high-speed robotic transfer<\/li>\n<\/ul>\n<hr data-start=\"1839\" data-end=\"1842\" \/>\n<h3 data-section-id=\"2ge170\" data-start=\"1844\" data-end=\"1875\">Excellent Thermal Stability<\/h3>\n<ul data-start=\"1876\" data-end=\"2015\">\n<li data-section-id=\"ibg0yp\" data-start=\"1876\" data-end=\"1927\">Operating temperature: up to 1600\u00b0C (oxidizing)<\/li>\n<li data-section-id=\"1e7mmjn\" data-start=\"1928\" data-end=\"1963\">Up to 1950\u00b0C (inert atmosphere)<\/li>\n<li data-section-id=\"j5ees9\" data-start=\"1964\" data-end=\"2015\">Suitable for extreme semiconductor environments<\/li>\n<\/ul>\n<hr data-start=\"2017\" data-end=\"2020\" \/>\n<h3 data-section-id=\"1twxua8\" data-start=\"2022\" data-end=\"2063\">Superior Chemical &amp; Plasma Resistance<\/h3>\n<ul data-start=\"2064\" data-end=\"2212\">\n<li data-section-id=\"x6lsw\" data-start=\"2064\" data-end=\"2120\">Resistant to acids, alkalis, and plasma environments<\/li>\n<li data-section-id=\"1c1d6qm\" data-start=\"2121\" data-end=\"2169\">No corrosion in CVD \/ PVD \/ etching chambers<\/li>\n<li data-section-id=\"1o7zcce\" data-start=\"2170\" data-end=\"2212\">Stable in SiH\u2084, NH\u2083, HCl process gases<\/li>\n<\/ul>\n<hr data-start=\"2214\" data-end=\"2217\" \/>\n<h3 data-section-id=\"14bamzt\" data-start=\"2219\" data-end=\"2252\">Wear-Free &amp; Long Service Life<\/h3>\n<ul data-start=\"2253\" data-end=\"2380\">\n<li data-section-id=\"10g9b8f\" data-start=\"2253\" data-end=\"2283\">Vickers hardness: ~2800 HV<\/li>\n<li data-section-id=\"14dvdy4\" data-start=\"2284\" data-end=\"2335\">No particle shedding during long-term operation<\/li>\n<li data-section-id=\"12rqc97\" data-start=\"2336\" data-end=\"2380\">Excellent surface durability (Ra &lt; 0.2 \u03bcm)<\/li>\n<\/ul>\n<hr data-start=\"2382\" data-end=\"2385\" \/>\n<h2 data-section-id=\"1xqplm3\" data-start=\"2387\" data-end=\"2418\">Structural &amp; Design Features<\/h2>\n<h3 data-section-id=\"1nh5g76\" data-start=\"2420\" data-end=\"2457\">Precision Wafer Handling Geometry<\/h3>\n<p data-start=\"2458\" data-end=\"2467\">Supports:<\/p>\n<ul data-start=\"2468\" data-end=\"2596\">\n<li data-section-id=\"15tpg53\" data-start=\"2468\" data-end=\"2508\">150mm \/ 200mm \/ 300mm \/ 450mm wafers<\/li>\n<li data-section-id=\"1rnwp5m\" data-start=\"2509\" data-end=\"2563\">Edge-grip \/ notch alignment \/ flat support designs<\/li>\n<li data-section-id=\"qm27un\" data-start=\"2564\" data-end=\"2596\">Custom robot arm integration<\/li>\n<\/ul>\n<hr data-start=\"2598\" data-end=\"2601\" \/>\n<h3 data-section-id=\"1yw23gm\" data-start=\"2603\" data-end=\"2643\">High Stiffness Lightweight Structure<\/h3>\n<ul data-start=\"2644\" data-end=\"2768\">\n<li data-section-id=\"tt3pyh\" data-start=\"2644\" data-end=\"2677\">High rigidity-to-weight ratio<\/li>\n<li data-section-id=\"1sb17em\" data-start=\"2678\" data-end=\"2721\">Suitable for high-speed robotic systems<\/li>\n<li data-section-id=\"1j6yie2\" data-start=\"2722\" data-end=\"2768\">Minimizes dynamic deflection during motion<\/li>\n<\/ul>\n<hr data-start=\"2770\" data-end=\"2773\" \/>\n<h3 data-section-id=\"97w9la\" data-start=\"2775\" data-end=\"2809\">Ultra-Clean Surface Processing<\/h3>\n<ul data-start=\"2810\" data-end=\"2905\">\n<li data-section-id=\"1lu1i7j\" data-start=\"2810\" data-end=\"2844\">Precision grinding &amp; polishing<\/li>\n<li data-section-id=\"1amctgl\" data-start=\"2845\" data-end=\"2870\">Low surface roughness<\/li>\n<li data-section-id=\"1js4nxo\" data-start=\"2871\" data-end=\"2905\">Cleanroom-compatible structure<\/li>\n<\/ul>\n<hr data-start=\"2907\" data-end=\"2910\" \/>\n<h3 data-section-id=\"50i47d\" data-start=\"2912\" data-end=\"2944\">Custom Engineering Interface<\/h3>\n<ul data-start=\"2945\" data-end=\"3063\">\n<li data-section-id=\"1dle0c1\" data-start=\"2945\" data-end=\"2981\">Robot arm mounting compatibility<\/li>\n<li data-section-id=\"19fhsyz\" data-start=\"2982\" data-end=\"3018\">OEM integration for AMHS systems<\/li>\n<li data-section-id=\"3wahd3\" data-start=\"3019\" data-end=\"3063\">Custom hole positions and fixture design<\/li>\n<\/ul>\n<hr data-start=\"3065\" data-end=\"3068\" \/>\n<h2 data-section-id=\"rb24ym\" data-start=\"3070\" data-end=\"3089\">Material Options<\/h2>\n<h3 data-section-id=\"87v3o9\" data-start=\"3091\" data-end=\"3124\">CVD Silicon Carbide (CVD SiC)<\/h3>\n<ul data-start=\"3125\" data-end=\"3232\">\n<li data-section-id=\"1qjlbs6\" data-start=\"3125\" data-end=\"3146\">Ultra-high purity<\/li>\n<li data-section-id=\"1856ohe\" data-start=\"3147\" data-end=\"3198\">Best for EUV \/ advanced semiconductor processes<\/li>\n<li data-section-id=\"1lwpzbt\" data-start=\"3199\" data-end=\"3232\">Ultra-low contamination level<\/li>\n<\/ul>\n<hr data-start=\"3234\" data-end=\"3237\" \/>\n<h3 data-section-id=\"gwj4n0\" data-start=\"3239\" data-end=\"3274\">Sintered Silicon Carbide (SSiC)<\/h3>\n<ul data-start=\"3275\" data-end=\"3402\">\n<li data-section-id=\"1hi8oju\" data-start=\"3275\" data-end=\"3312\">High strength and wear resistance<\/li>\n<li data-section-id=\"1rnk9x7\" data-start=\"3313\" data-end=\"3363\">Suitable for industrial wafer handling systems<\/li>\n<li data-section-id=\"67fp04\" data-start=\"3364\" data-end=\"3402\">Excellent cost-performance balance<\/li>\n<\/ul>\n<hr data-start=\"3404\" data-end=\"3407\" \/>\n<h2 data-section-id=\"1cgu054\" data-start=\"3409\" data-end=\"3436\">Technical Specifications<\/h2>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"3438\" data-end=\"3888\">\n<thead data-start=\"3438\" data-end=\"3462\">\n<tr data-start=\"3438\" data-end=\"3462\">\n<th class=\"last:pe-10\" data-start=\"3438\" data-end=\"3445\" data-col-size=\"sm\">Item<\/th>\n<th class=\"last:pe-10\" data-start=\"3445\" data-end=\"3462\" data-col-size=\"sm\">Specification<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"3487\" data-end=\"3888\">\n<tr data-start=\"3487\" data-end=\"3516\">\n<td data-start=\"3487\" data-end=\"3498\" data-col-size=\"sm\">Material<\/td>\n<td data-col-size=\"sm\" data-start=\"3498\" data-end=\"3516\">CVD SiC \/ SSiC<\/td>\n<\/tr>\n<tr data-start=\"3517\" data-end=\"3536\">\n<td data-start=\"3517\" data-end=\"3526\" data-col-size=\"sm\">Purity<\/td>\n<td data-start=\"3526\" data-end=\"3536\" data-col-size=\"sm\">&gt;99.5%<\/td>\n<\/tr>\n<tr data-start=\"3537\" data-end=\"3561\">\n<td data-start=\"3537\" data-end=\"3550\" data-col-size=\"sm\">Grain Size<\/td>\n<td data-col-size=\"sm\" data-start=\"3550\" data-end=\"3561\">4\u201310 \u03bcm<\/td>\n<\/tr>\n<tr data-start=\"3562\" data-end=\"3587\">\n<td data-start=\"3562\" data-end=\"3572\" data-col-size=\"sm\">Density<\/td>\n<td data-col-size=\"sm\" data-start=\"3572\" data-end=\"3587\">&gt;3.14 g\/cm\u00b3<\/td>\n<\/tr>\n<tr data-start=\"3588\" data-end=\"3611\">\n<td data-start=\"3588\" data-end=\"3599\" data-col-size=\"sm\">Hardness<\/td>\n<td data-col-size=\"sm\" data-start=\"3599\" data-end=\"3611\">~2800 HV<\/td>\n<\/tr>\n<tr data-start=\"3612\" data-end=\"3643\">\n<td data-start=\"3612\" data-end=\"3632\" data-col-size=\"sm\">Flexural Strength<\/td>\n<td data-col-size=\"sm\" data-start=\"3632\" data-end=\"3643\">450 MPa<\/td>\n<\/tr>\n<tr data-start=\"3644\" data-end=\"3673\">\n<td data-start=\"3644\" data-end=\"3662\" data-col-size=\"sm\">Elastic Modulus<\/td>\n<td data-col-size=\"sm\" data-start=\"3662\" data-end=\"3673\">420 GPa<\/td>\n<\/tr>\n<tr data-start=\"3674\" data-end=\"3710\">\n<td data-start=\"3674\" data-end=\"3697\" data-col-size=\"sm\">Thermal Conductivity<\/td>\n<td data-col-size=\"sm\" data-start=\"3697\" data-end=\"3710\">160 W\/m\u00b7K<\/td>\n<\/tr>\n<tr data-start=\"3711\" data-end=\"3768\">\n<td data-start=\"3711\" data-end=\"3729\" data-col-size=\"sm\">Max Temperature<\/td>\n<td data-col-size=\"sm\" data-start=\"3729\" data-end=\"3768\">1600\u00b0C (oxidation) \/ 1950\u00b0C (inert)<\/td>\n<\/tr>\n<tr data-start=\"3769\" data-end=\"3810\">\n<td data-start=\"3769\" data-end=\"3794\" data-col-size=\"sm\">Electrical Resistivity<\/td>\n<td data-col-size=\"sm\" data-start=\"3794\" data-end=\"3810\">10\u2076\u201310\u2078 \u03a9\u00b7cm<\/td>\n<\/tr>\n<tr data-start=\"3811\" data-end=\"3851\">\n<td data-start=\"3811\" data-end=\"3828\" data-col-size=\"sm\">Surface Finish<\/td>\n<td data-col-size=\"sm\" data-start=\"3828\" data-end=\"3851\">Ultra-fine polished<\/td>\n<\/tr>\n<tr data-start=\"3852\" data-end=\"3888\">\n<td data-start=\"3852\" data-end=\"3859\" data-col-size=\"sm\">Size<\/td>\n<td data-start=\"3859\" data-end=\"3888\" data-col-size=\"sm\">Custom (150\u2013450mm wafers)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<hr data-start=\"3890\" data-end=\"3893\" \/>\n<h2 data-section-id=\"mu966k\" data-start=\"3895\" data-end=\"3910\">Applications<\/h2>\n<h3 data-section-id=\"6yu2ul\" data-start=\"3912\" data-end=\"3943\">Semiconductor Manufacturing<\/h3>\n<ul data-start=\"3944\" data-end=\"4097\">\n<li data-section-id=\"49bdmt\" data-start=\"3944\" data-end=\"3978\">EUV lithography wafer handling<\/li>\n<li data-section-id=\"11xdzhh\" data-start=\"3979\" data-end=\"4017\">300mm wafer robot transfer systems<\/li>\n<li data-section-id=\"ox84z0\" data-start=\"4018\" data-end=\"4060\">CVD \/ PVD \/ etching chamber automation<\/li>\n<li data-section-id=\"teg2xm\" data-start=\"4061\" data-end=\"4097\">Ion implantation wafer transport<\/li>\n<\/ul>\n<hr data-start=\"4099\" data-end=\"4102\" \/>\n<h3 data-section-id=\"sf9357\" data-start=\"4104\" data-end=\"4140\">Advanced Semiconductor Materials<\/h3>\n<ul data-start=\"4141\" data-end=\"4248\">\n<li data-section-id=\"iiuum6\" data-start=\"4141\" data-end=\"4176\">SiC power device wafer handling<\/li>\n<li data-section-id=\"se94ot\" data-start=\"4177\" data-end=\"4211\">GaN epitaxy production systems<\/li>\n<li data-section-id=\"3yciq1\" data-start=\"4212\" data-end=\"4248\">High-temperature MOCVD processes<\/li>\n<\/ul>\n<hr data-start=\"4250\" data-end=\"4253\" \/>\n<h3 data-section-id=\"11khwnl\" data-start=\"4255\" data-end=\"4286\">Photovoltaic &amp; LED Industry<\/h3>\n<ul data-start=\"4287\" data-end=\"4389\">\n<li data-section-id=\"q29bxq\" data-start=\"4287\" data-end=\"4319\">Solar wafer automation lines<\/li>\n<li data-section-id=\"10mww1v\" data-start=\"4320\" data-end=\"4361\">Micro-LED \/ Mini-LED transfer systems<\/li>\n<li data-section-id=\"dp5vhg\" data-start=\"4362\" data-end=\"4389\">Sapphire wafer handling<\/li>\n<\/ul>\n<hr data-start=\"4391\" data-end=\"4394\" \/>\n<h3 data-section-id=\"j366yc\" data-start=\"4396\" data-end=\"4428\">Automation &amp; Robotics (AMHS)<\/h3>\n<ul data-start=\"4429\" data-end=\"4533\">\n<li data-section-id=\"fpj2it\" data-start=\"4429\" data-end=\"4459\">Wafer transport robot arms<\/li>\n<li data-section-id=\"e4e8u3\" data-start=\"4460\" data-end=\"4492\">Cleanroom automation systems<\/li>\n<li data-section-id=\"k0rhy6\" data-start=\"4493\" data-end=\"4533\">High-speed material handling systems<\/li>\n<\/ul>\n<hr data-start=\"4535\" data-end=\"4538\" \/>\n<h3 data-section-id=\"1c5bbdr\" data-start=\"4540\" data-end=\"4573\">Research &amp; High-End Equipment<\/h3>\n<ul data-start=\"4574\" data-end=\"4679\">\n<li data-section-id=\"1sbej07\" data-start=\"4574\" data-end=\"4604\">Quantum device fabrication<\/li>\n<li data-section-id=\"5u37w7\" data-start=\"4605\" data-end=\"4641\">Cryogenic wafer handling systems<\/li>\n<li data-section-id=\"i12e24\" data-start=\"4642\" data-end=\"4679\">Advanced packaging (3D IC \/ MEMS)<\/li>\n<\/ul>\n<hr data-start=\"4681\" data-end=\"4684\" \/>\n<h2 data-section-id=\"vm5qii\" data-start=\"4686\" data-end=\"4715\">Product Advantages Summary<\/h2>\n<ul data-start=\"4717\" data-end=\"4996\">\n<li data-section-id=\"r4wmoo\" data-start=\"4717\" data-end=\"4750\">Zero metal contamination risk<\/li>\n<li data-section-id=\"w80eyq\" data-start=\"4751\" data-end=\"4797\">Ultra-high rigidity for precision handling<\/li>\n<li data-section-id=\"ovhb2l\" data-start=\"4798\" data-end=\"4842\">Excellent thermal and chemical stability<\/li>\n<li data-section-id=\"1pry50x\" data-start=\"4843\" data-end=\"4878\">Long lifetime with minimal wear<\/li>\n<li data-section-id=\"16clm2x\" data-start=\"4879\" data-end=\"4919\">Compatible with cleanroom automation<\/li>\n<li data-section-id=\"1usfebt\" data-start=\"4920\" data-end=\"4956\">Customizable for all wafer sizes<\/li>\n<li data-section-id=\"whnxc2\" data-start=\"4957\" data-end=\"4996\">Suitable for EUV and advanced nodes<\/li>\n<\/ul>\n<hr data-start=\"4998\" data-end=\"5001\" \/>\n<h2 data-section-id=\"rnyyeg\" data-start=\"5003\" data-end=\"5027\">Customization Options<img decoding=\"async\" class=\"size-medium wp-image-2102 alignright\" src=\"https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-2-300x300.png\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-2-300x300.png 300w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-2-150x150.png 150w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-2-768x768.png 768w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-2-12x12.png 12w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-2-600x600.png 600w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-2-100x100.png 100w, https:\/\/www.xkh-ceramics.com\/wp-content\/uploads\/2026\/05\/Customized-SiC-Ceramic-End-Effector-for-Wafer-Handling-2.png 1000w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><\/h2>\n<p data-start=\"5029\" data-end=\"5067\">We support full OEM\/ODM customization:<\/p>\n<ul data-start=\"5069\" data-end=\"5319\">\n<li data-section-id=\"pzy3qt\" data-start=\"5069\" data-end=\"5127\">End effector geometry (flat \/ edge grip \/ notch align)<\/li>\n<li data-section-id=\"173oufn\" data-start=\"5128\" data-end=\"5168\">Wafer size compatibility (150\u2013450mm)<\/li>\n<li data-section-id=\"1sh3bgb\" data-start=\"5169\" data-end=\"5195\">Robot interface design<\/li>\n<li data-section-id=\"1ma3ck\" data-start=\"5196\" data-end=\"5252\">Surface coating (anti-static \/ hydrophobic optional)<\/li>\n<li data-section-id=\"7mw706\" data-start=\"5253\" data-end=\"5289\">Precision tolerance optimization<\/li>\n<li data-section-id=\"w4j63d\" data-start=\"5290\" data-end=\"5319\">Cleanroom-grade finishing<\/li>\n<\/ul>\n<hr data-start=\"5321\" data-end=\"5324\" \/>\n<h2 data-section-id=\"1hryhf7\" data-start=\"5326\" data-end=\"5332\">FAQ<\/h2>\n<h3 data-section-id=\"1mpzh4o\" data-start=\"5334\" data-end=\"5384\">Q1: Why use SiC instead of aluminum or quartz?<\/h3>\n<ul data-start=\"5385\" data-end=\"5556\">\n<li data-section-id=\"1xvhlf0\" data-start=\"5385\" data-end=\"5437\">Aluminum: particle generation + oxidation issues<\/li>\n<li data-section-id=\"1q7gghy\" data-start=\"5438\" data-end=\"5489\">Quartz: brittle + poor thermal shock resistance<\/li>\n<li data-section-id=\"vgt2b3\" data-start=\"5490\" data-end=\"5556\">SiC: best combination of rigidity, cleanliness, and durability<\/li>\n<\/ul>\n<hr data-start=\"5558\" data-end=\"5561\" \/>\n<h3 data-section-id=\"1cxfupn\" data-start=\"5563\" data-end=\"5599\">Q2: Can it support 450mm wafers?<\/h3>\n<p data-start=\"5600\" data-end=\"5667\">Yes, custom designs are available for 450mm wafer handling systems.<\/p>\n<hr data-start=\"5669\" data-end=\"5672\" \/>\n<h3 data-section-id=\"a4nxop\" data-start=\"5674\" data-end=\"5717\">Q3: Is it suitable for EUV lithography?<\/h3>\n<p data-start=\"5718\" data-end=\"5803\">Yes. SiC end effectors meet ultra-low particle and vacuum compatibility requirements.<\/p>\n<hr data-start=\"5805\" data-end=\"5808\" \/>\n<h3 data-section-id=\"1ajqsm3\" data-start=\"5810\" data-end=\"5872\">Q4: Can it be used in vacuum and high-temperature systems?<\/h3>\n<p data-start=\"5873\" data-end=\"5951\">Yes. SiC performs stably in vacuum, plasma, and high-temperature environments.<\/p>","protected":false},"excerpt":{"rendered":"<p>The Silicon Carbide (SiC) Ceramic End Effector is a high-precision wafer handling component designed for semiconductor automation systems, including wafer transfer robots, AMHS systems, EUV lithography equipment, and high-temperature process 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